Patents by Inventor Andreas Thies

Andreas Thies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050119817
    Abstract: A procedure is described for control and regulation of the dynamic-drive of a vehicle according to a set nominal value for the vehicle components affecting the dynamic-drive. The nominal value is set according to a driver's wish setting and with reference to a vehicle pattern stored in a control device. The measurable forces acting upon the vehicle are regulated and a controlled distribution of the longitudinal and lateral forces acting upon the tires of the vehicle is carried out among the tires.
    Type: Application
    Filed: November 23, 2004
    Publication date: June 2, 2005
    Inventors: Christoph Pelchen, Thomas Rosemeier, Andreas Thies
  • Patent number: 6793795
    Abstract: A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: September 21, 2004
    Assignee: Atotech Deutschland GmbH
    Inventors: Heinrich Meyer, Andreas Thies
  • Patent number: 6736983
    Abstract: Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil 1; b. forming the inner structures in and/or on the first metal layer or metal foil 1 by suitable etching methods and/or metal deposition methods; and c. forming the functional layers 3 solely on the walls of the inner structures and thereafter B.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: May 18, 2004
    Assignee: Atotech Deutschland GmbH
    Inventors: Andreas Thies, Konrad Cramer, Heinrich Meyer