Patents by Inventor Andreas Thies

Andreas Thies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070132197
    Abstract: An actuator for an active chassis of a motor vehicle is proposed which includes a body spring and a vibration damper, and which incorporates a hydraulic or pneumatic positioning cylinder (3) and a compensation spring (2). The actuator (1) is so designed and positioned that the static body mass (13) is borne by the compensation spring (2).
    Type: Application
    Filed: December 8, 2006
    Publication date: June 14, 2007
    Applicant: ZF Friedrichshafen AG
    Inventors: Andreas Thies, Uwe Wohanka, Christoph Pelchen
  • Publication number: 20060267139
    Abstract: A semiconductor substrate is provided comprising a plurality of contact pads arranged on a horizontal surface of the semiconductor substrate. Pillars of a first sacrificial material are formed on the contact pads. A first dielectric layer is deposited thus covering at least said pillars. A first conductive layer is deposited between said pillars covered with the first dielectric layer. The pillars are removed thus providing trenches in the first conductive layer having walls covered with the dielectric layer. A second conductive layer is deposited on the first dielectric layer in the trench. A second dielectric layer is deposited such that at least the second conductive layer in the trench is covered by the second dielectric layer. A third conductive layer is deposited on the second dielectric layer.
    Type: Application
    Filed: May 31, 2005
    Publication date: November 30, 2006
    Applicant: Infineon Technologies AG
    Inventors: Andreas Thies, Klaus Muemmler
  • Publication number: 20060194049
    Abstract: A lead for writing, drawing and painting utensils has a colorant lead core and at least one lead coat extending in the direction of the longitudinal axis. The at least one lead coat envelopes the lead core as seen in cross section of the lead and the lead coat and lead core are immovably mounted relative to each other. The at least one lead coat has a higher bending strength than the lead core.
    Type: Application
    Filed: January 26, 2006
    Publication date: August 31, 2006
    Inventors: Andreas Thies, Christa Lehrer, Jurgen Reiner, Christine Delapierre, Robert Nein, Franz Ochsenkuhn, Max Heindl
  • Publication number: 20060173597
    Abstract: A method for determining a control standard of an active steering device (10) of a vehicle (1) controllable by a control device (11). A driving dynamic of the vehicle (1) is influenced according to the control standard. The control standard is determined according to a nominal yawing rate calculated at least with reference to different actual operating parameters of the vehicle and one dynamic vehicle state determined according to the nominal yawing rate and actual operating state parameters. The control standard is superimposed on a steering transit angle preset by a driver so that an existing actual yawing rate is changed in direction of the nominal yawing rate.
    Type: Application
    Filed: December 16, 2005
    Publication date: August 3, 2006
    Inventors: Christoph Pelchen, Andreas Thies, Thomas Rosemeier
  • Publication number: 20060113587
    Abstract: A transistor array for semiconductor memory devices is provided. A plurality of semiconductor pillars extending outwardly from a bulk section of a semiconductor substrate is arranged in rows and columns. Each pillar forms an active area of a vertical channel access transistor. Insulating trenches are formed between the rows of pillars. Buried word lines extend within the insulating trenches along the rows of pillars. Bit line trenches are formed between columns of pillars. Bit lines extend perpendicular to the word lines in lower portions of the bit line trenches. A first and a second column of pillars face adjacent each bit line. Each bit line is coupled to the active areas in the pillars of the first column of pillars via a single sided bit line contact formed from polycrystalline silicon and is insulated from the active areas of the pillars of the second column of pillars.
    Type: Application
    Filed: November 30, 2004
    Publication date: June 1, 2006
    Inventors: Andreas Thies, Klaus Muemmler
  • Publication number: 20050173250
    Abstract: In manufacturing integrated circuits voids in the metal layer may readily form during electrolytic metal deposition. In order to avoid these faults which adversely affect the functionality of the circuits, the invention suggests to utilize for metal deposition an electrolysis device comprised of at least one anode and at least one cathode and in which at least one reference electrode is disposed at the surface of the at least one anode or at the surface of the at least one cathode. A voltmeter is respectively provided for detecting the electric voltages between the at least one anode and the at least one reference electrode and between the at least one reference electrode and the at least one cathode.
    Type: Application
    Filed: July 2, 2003
    Publication date: August 11, 2005
    Inventors: Andreas Thies, Thomas Dretschkow
  • Publication number: 20050119817
    Abstract: A procedure is described for control and regulation of the dynamic-drive of a vehicle according to a set nominal value for the vehicle components affecting the dynamic-drive. The nominal value is set according to a driver's wish setting and with reference to a vehicle pattern stored in a control device. The measurable forces acting upon the vehicle are regulated and a controlled distribution of the longitudinal and lateral forces acting upon the tires of the vehicle is carried out among the tires.
    Type: Application
    Filed: November 23, 2004
    Publication date: June 2, 2005
    Inventors: Christoph Pelchen, Thomas Rosemeier, Andreas Thies
  • Patent number: 6793795
    Abstract: A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: September 21, 2004
    Assignee: Atotech Deutschland GmbH
    Inventors: Heinrich Meyer, Andreas Thies
  • Patent number: 6736983
    Abstract: Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The micro-components are intended to be suitable for a large number of different applications in chemical reaction technology, for heat exchanging, for mixing substances or for evaporating liquids. In particular, the micro-components are intended to have no problems in respect of leaks in the flow channels. The method has the following method steps: A. producing the at least one individual layer by: a. producing a first metal layer or a metal foil 1; b. forming the inner structures in and/or on the first metal layer or metal foil 1 by suitable etching methods and/or metal deposition methods; and c. forming the functional layers 3 solely on the walls of the inner structures and thereafter B.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: May 18, 2004
    Assignee: Atotech Deutschland GmbH
    Inventors: Andreas Thies, Konrad Cramer, Heinrich Meyer