Abstract: An embodiment of the invention provides an integrated circuit having an organic field effect transistor (OFET) with a dielectric layer. The dielectric layer is prepared from a polymer formulation comprising: about 100 parts of at least one crosslinkable base polymer, from about 10 to about 20 parts of at least one di- or tribenzyl alcohol compound as an electrophilic crosslinking component, from about 0.2 to about 10 parts of at least one photo acid generator, and at least one solvent. Another embodiment provides a semiconductor fabrication method. The method comprises applying the polymer formulation to a surface of a substrate, drying the polymer formulation, crosslinking the polymer formulation after drying, and baking the polymer formulation after crosslinking.

Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.

Abstract: The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).

Abstract: The hair treatment composition contains a combination of an anionic polysaccharide, a second homopolymer or copolymer, which is built up from acrylamidoalkylsulfonic acids, methacrylamidoalkylsulfonic acids, or their salts, and a third polymer, which is an amphiphilic polymer. Preferably the hair treatment composition is a hair styling gel containing xanthan as a first polymer, ammonium acryloyldimethyltaurate/vinylpyrrolidone copolymer as a second polymer and, as a third polymer, cross-linked copolymers made from (meth)acrylic acid and C10- to C30-alkyl esters of (meth)acrylic acid. The preferred gel has a shaky pudding-like consistency and is suitable as a 2-in-1 gel that can be used as either a hair styling gel for increasing hairstyle volume or as a finishing gel for structuring a hairstyle.

Abstract: The hair treatment composition contains a combination of at least one itaconic acid monoester/acrylate copolymer and at least one polystyrene sulfonate with a molecular weight in a range from 50,000 to 200,000. The itaconic acid monoester monomer or monomers are of formula CH2?C(COOR1)CH2COOR2, wherein one of R1 and R2 represents hydrogen and another of R1 and R2 represents —(CH2CH2O)x—R3, x is a number between 1 and 100 and R3 is an alkyl group with 8 to 30 carbon atoms. In an especially preferred embodiment the hair treatment composition contains an itaconic acid monocetyl ester/acrylate copolymer and an itaconic acid monostearyl ester/acrylate copolymer.

Abstract: Polymers are described which exhibit a resistive hysteresis effect. The polymers include a polymer backbone to which pentaarylcyclopentadienyl radicals are bonded as side groups. A resistive memory element is formed that includes the polymer as a storage medium. By applying a voltage, the memory element can be switched between a nonconductive and a conductive state.

Abstract: Novel dicarboxylic acids are described herein that are suitable for the preparation of high-temperature-stable polymers, which are particularly useful in forming suitable dielectrics in microelectronics.

Abstract: Memory cells having two electrodes and a layer arranged in between and including an active material which contains hexakisbenzylthiobenzene, dichlorodicyano-p-benzoquinone and optionally a polymer are provided. Furthermore, a process for the production of the cells according to the invention is provided, as well as the novel use of a composition which can be used as active material for the memory cells.

Abstract: A memory cell is provided which comprises two electrodes and a layer arranged in between and comprising an active material comprising (a) a compound selected from the group consisting of in which R1 and R4, independently of one another, may have the following meaning: —H, -alkyl, -aryl, -heteroaryl, —O-alkyl, —O-aryl, —O-heteroaryl, —SH, —S-alkyl, —S-aryl, —S-heteroaryl, —CO-alkyl, —CO-aryl, —CO-heteroaryl, —CS-alkyl, —CS-aryl, —CS-heteroaryl, -halogen, —CN and/or —NO2, in which R1 and R2, R2 and R3, R3 and R4 together may form a ring, (b) a compound of the general formula II: in which R5 to R7, independently of one another, may have the following meaning: —H, -alkyl, -aryl, -heteroaryl, —O-alkyl, —O-aryl, —O-heteroaryl, —NH2, —N(alkyl)2, —N(aryl)2, —N(heteroaryl)2, —SH, —S-alkyl, —S-aryl, —S-heteroaryl, —CO-alkyl, —CO-aryl, —CO-heteroaryl, —CS-alkyl, —CS-aryl, —CS-heteroaryl, -halogen, —CN and/or —NO2, in which R5 and R6 or R7 and R8 together may form a ring, and optionally (c) a polymer.

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Abstract: Disclosed are variants of Cre recombinase that have broadened specificity for the site of recombination. Specifically, the disclosed variants mediate recombination between sequences other than the loxP sequence and other lox site sequences on which wild type Cre recombinase is active. In general, the disclosed Cre variants mediate efficient recombination between lox sites that wild type Cre can act on (referred to as wild type lox sites), between variant lox sites not efficiently utilized by wild type Cre (referred to as variant lox sites), and between a wild type lox site and a variant lox site. Also disclosed are methods or recombining nucleic acids using the disclosed Cre variants. For example, the disclosed Cre variants can be used in any method or technique where Cre recombinase (or other, similar recombinases such as FLP) can be used.

Abstract: A bis-o-aminophenol has a formula I These bis-o-aminophenols permit the preparation of polybenzoxazoles stabilized at high temperatures. The bis-o-aminophenols are preferably prepared from the corresponding diols, which are first nitrosated. The nitroso compound is then reduced to the amino compound by hydrogenation with Pd/C and H2.

Abstract: A layer-forming antireflective composition is proposed which contains as a base polymer poly(hydroxyamide) or polybenzoxazole and as dye component at least one dye from the classes of the methine dyes, methine dye derivatives, azomethine dyes, azomethine dye derivatives, coumarin dyes, coumarin dye derivatives, triphenylmethane dyes, triphenylmethane dye derivatives and/or an azo dye.

Abstract: The organic polymers of the invention have electrical semiconductor properties. The compounds have a backbone of phenylene groups to which side groups with semiconductor properties, or which impart semiconductor properties to the polymer, are bonded. The polymers are obtained by Bergmann cyclization from compounds that contain aromatic groups to which vicinal ethynyl groups are bonded. The polymers are suitable for the production of semiconductor components, such as organic transistors or diodes.

Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.

Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for microelectronics.