Abstract: A method and a system for routing electrical connections are disclosed. A semiconductor device includes a first semiconductor chip and a routing plane having a plurality of routing lines. A first connecting line is electrically coupled to the first semiconductor chip and one of the plurality of routing lines and a second connecting line is electrically coupled to the one of the plurality of routing lines and to one of a second semiconductor chip or a first external contact element.

Abstract: The present invention discloses novel methods for the synthesis of oligonucleotides with nucleoside phosphoramidites on solid supports. The methods comprise the stepwise chain assembly of oligonucleotides on supports with 5?-acyl phosphoramidites. The synthesis cycles consist of a front end deprotection step which is conducted with a solution of a primary amine or a phenolate, a phosphoramidite coupling step with a 5?-acyl nucleoside phosphoramidite in the presence of an activator, a phosphite oxidation step and an optional capping step. The novel methods improve the quality of synthetic oligonucleotides due to the irreversibility of the front end deprotection step, which prevents the formation of deletion sequences, and due to the avoidance of acidic reagents in the synthesis cycles, which prevent the formation of depurination side products.

Abstract: A method and a system for routing electrical connections of a plurality of chips are disclosed. In one embodiment, a semiconductor device is provided comprising at least one semiconductor chip, at least one routing plane comprising at least one routing line, and at least one connecting line electrically coupled to the at least one routing line and at least one semiconductor chip.

Abstract: A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

Abstract: A semiconductor device is provided configured to be electrically connected to another device by through silicon interconnect technology. The semiconductor device includes a semiconductor substrate with at least one through hole. A through silicon conductor extends inside the through hole from the upper side to the bottom side of the semiconductor substrate. The through silicon conductor is electrical isolated from the semiconductor substrate and includes a conductor bump at one of its ends. Between the inner surface of the through hole and the through silicon conductor a gap is formed. The gap surrounds the through silicon conductor on one side of the semiconductor substrate having the conductor bump, and extends from this side of the substrate into the substrate. The gap is filled with a flexible dielectric material.

Abstract: Fabricating an integrated circuit device includes providing a semiconductor substrate comprising a first surface and a second surface, forming a wiring layer on the first surface of the semiconductor substrate, providing a circuit chip, and arranging the circuit chip on the wiring layer of the semiconductor substrate. The fabricating further includes forming an embedding layer on the wiring layer and on the circuit chip, the embedding layer encapsulating the circuit chip, thinning the semiconductor substrate at the second surface after forming the embedding layer, and forming a conductive via in the semiconductor substrate being electrically coupled to the wiring layer and exposed at the second surface of the semiconductor substrate. Moreover, an integrated circuit device is described.

Abstract: Integrated circuit assembly including a die stack assembly having a heat dissipation device thermally coupled to a lateral of surface the die stack assembly. The die stack assembly includes a plurality integrated circuits placed on each other. In another embodiment a heat dissipation device comprising an encapsulant is thermally coupled to and surrounds a die stack assembly that includes a plurality of integrated circuits placed on each other. At least one heat conducting intermediate layer between integrated circuits is thermally coupled to the heat dissipation device.

Abstract: The present invention discloses novel methods for the synthesis of oligonucleotides and nucleoside phosphoramidites. The methods are based on employing aryl-substituted 5-phenyl-1H-tetrazoles with perfluoroalkyl groups on the aromatic ring as activators. In one aspect the novel activators are used in the synthesis of oligonucleotides via the phosphoramidite approach. In this aspect the activators are highly efficient and can be applied with very short coupling times. In a further aspect, the activators of the invention are used in the synthesis of phosphoramidites through the reaction of nucleosides comprising a free hydroxyl group with phosphitylating agents. In this aspect the activators provide very pure phosphoramidites under mild conditions. The activators of the invention are further characterized by being highly soluble, non-hygroscopic and non-hazardous.

Abstract: A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.

Abstract: A semiconductor device is provided configured to be electrically connected to another device by through silicon interconnect technology. The semiconductor device includes a semiconductor substrate with at least one through hole. A through silicon conductor extends inside the through hole from the upper side to the bottom side of the semiconductor substrate. The through silicon conductor is electrical isolated from the semiconductor substrate and includes a conductor bump at one of its ends. Between the inner surface of the through hole and the through silicon conductor a gap is formed. The gap surrounds the through silicon conductor on one side of the semiconductor substrate having the conductor bump, and extends from this side of the substrate into the substrate. The gap is filled with a flexible dielectric material.

Abstract: Fabricating an integrated circuit device includes providing a semiconductor substrate comprising a first surface and a sec-ond surface, forming a wiring layer on the first surface of the semiconductor substrate, providing a circuit chip, and arranging the circuit chip on the wiring layer of the semi-conductor substrate. The fabricating further includes forming an embedding layer on the wiring layer and on the circuit chip, the embedding layer encapsulating the circuit chip, thinning the semiconductor substrate at the second surface after forming the embedding layer, and forming a conductive via in the semiconductor substrate being electrically coupled to the wiring layer and exposed at the second surface of the semiconductor substrate. Moreover, an integrated circuit de-vice is described.

Abstract: This invention discloses a novel method for immobilizing molecules to a support. Specifically, this invention discloses a method of immobilizing derivatized biomolecules, such as oligonucleotides, using cycloaddition reactions, such as the Diels-Alder reaction. Included in this invention are the novel immobilized biomolecules that can be prepared according to the method of this invention.

Abstract: The present invention discloses novel methods for the synthesis of oligonucleotides with nucleoside phosphoramidites on solid supports. The methods comprise the stepwise chain assembly of oligonucleotides on supports with 5?-acyl phosphoramidites. The synthesis cycles consist of a front end deprotection step which is conducted with a solution of a primary amine or a phenolate, a phosphoramidite coupling step with a 5?-acyl nucleoside phosphoramidite in the presence of an activator, a phosphite oxidation step and an optional capping step. The novel methods improve the quality of synthetic oligonucleotides due to the irreversibility of the front end deprotection step, which prevents the formation of deletion sequences, and due to the avoidance of acidic reagents in the synthesis cycles, which prevent the formation of depurination side products.

Abstract: Integrated circuit assembly including a die stack assembly having a heat dissipation device thermally coupled to a lateral of surface the die stack assembly. The die stack assembly includes a plurality integrated circuits placed on each other. In another embodiment a heat dissipation device comprising an encapsulant is thermally coupled to and surrounds a die stack assembly that includes a plurality of integrated circuits placed on each other. At least one heat conducting intermediate layer between integrated circuits is thermally coupled to the heat dissipation device.

Abstract: The present invention discloses novel methods and solid supports for the synthesis of 3?-amino oligonucleotides. The novel supports are based on an unsubstituted or ring-substituted hydroxymethylbenzoyl linker element wherein the hydroxymethyl group is esterified to a solid phase bound carboxylic acid and the carbonyl group is linked to an amino alcohol as an amide. Oligonucleotides are conveniently synthesized on the novel supports with no modifications in the standard phosphoramidite synthesis scheme. The ester function of the support is cleaved under the alkaline deprotection conditions for oligonucleotides to provide a free hydroxymethyl group that aids in the release of the 3?-amino oligonucleotide products with a free amino group through neighbor group participation. The free amino group of the oligonucleotides is available for further conjugation reactions to haptens, reporter groups, surfaces or other small molecules or biomolecules.

Abstract: The present invention discloses novel phosphoramidite reagents for use in oligonucleotide synthesis. The present invention further discloses novel methods for the conversion of terminal hydroxyl groups of oligonucleotides into phosphate monoesters. By employing novel reagents, as also disclosed herein, the methods are fully compatible with standard procedures for solid phase oligonucleotide synthesis and do not require additional processing steps. The inventive reagents to phosphorylate terminal hydroxyl groups of oligonucleotides are superior to the prior art in that they for the first time combine the desired attributes of being a solid compound for facile handling, comprising two ?-eliminating protective groups removable as fast or faster than the standard cyanoethyl group, providing a DMT-group for easy monitoring of the coupling efficiency, and enabling a fast final deprotection of the phosphorylated oligonucleotide without any extra manipulation steps.

Abstract: A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.

Abstract: The present invention relates to semiconductor devices. According to the present invention a semiconductor device is described, comprising: a substrate for carrying a semiconductor chip on a first surface of said substrate; said semiconductor chip being punctually attached to said substrate on said first surface of said substrate via a single attachment point; and means for protecting said semiconductor chip on said first surface of said substrate at least protecting said semiconductor chip laterally.

Abstract: The present invention discloses novel methods for the synthesis of oligonucleotides and nucleoside phosphoramidites. The methods are based on employing aryl-substituted 5-phenyl-1H-tetrazoles with perfluoroalkyl groups on the aromatic ring as activators. In one aspect the novel activators are used in the synthesis of oligonucleotides via the phosphoramidite approach. In this aspect the activators are highly efficient and can be applied with very short coupling times. In a further aspect, the activators of the invention are used in the synthesis of phosphoramidites through the reaction of nucleosides comprising a free hydroxyl group with phosphitylating agents. In this aspect the activators provide very pure phosphoramidites under mild conditions. The activators of the invention are further characterized by being highly soluble, non-hygroscopic and non-hazardous.

Abstract: A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.