Patents by Inventor Andrew A. CHENG

Andrew A. CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9682854
    Abstract: Packaged MEMS devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring is formed by a first bonding between the two ring pads. The device has a gap between the substrate and the cap wafer. This gap may be filled with a pressurized gas. An electrical connection is formed by a second bonding between one substrate pad and one wafer pad. An electrical contact is disposed over the cap wafer. The device also includes an insulation layer between the electrical contact and the cap wafer. Methods of producing the packaged MEMS devices are also described.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: June 20, 2017
    Assignee: MEMSIC, INC
    Inventors: Piu Francis Man, Anru Andrew Cheng
  • Publication number: 20170107992
    Abstract: Apparatus includes a signal processor that receives signaling containing information about real time pump operating parameters related to pumps forming part of a pumping system in a plant/facility, and a user input selecting a pump for displaying the real time pump operating parameters on a control monitor to allow a plant/facility operator to implement a centralized pump control of the pumps at a given centralized location; and that determines corresponding signaling containing information to display on the control monitor the real time pump operating parameters to allow the plant/facility operator to implement the centralized control of the pumps at the given centralized location, based upon the signaling received.
    Type: Application
    Filed: July 22, 2016
    Publication date: April 20, 2017
    Inventors: Andrew A. CHENG, James J. GU, Pradipkumar B. PATEL, Kyle D. SCHOENHEIT
  • Patent number: 9611856
    Abstract: The present invention provides apparatus featuring a signal processor or processing module that may be configured at least to: process signaling containing information about an equilibrium point of pump differential pressure and system pressure formulated in a hydronic domain by utilizing pump and system characteristic curve equations so as to yield system pressure and flow rate at any particular load and time in a pump hydronic system, including using a multi-dimensional sensorless conversion technique; and determine equivalent hydronic system characteristics associated with the pump differential pressure and flow rate to their corresponding motor power and speed reconstructed and remapped by using a discrete numerical approach, based at least partly on the signaling received. The signal processor or processing module may provide corresponding signaling containing information about the system pumping flow rate and pressure determined.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: April 4, 2017
    Assignee: Fluid Handling LLC
    Inventors: Andrew A. Cheng, Graham A. Scott, James J. Gu
  • Patent number: 9596855
    Abstract: Small molecule compound having a fused heterocyclic ring structure that are substituted derivatives of the Auromomycin Chromophore having the general formula:
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: March 21, 2017
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Roger Gareth Linington, Havva Fitnat Gurcan, Kelly Corbus Peach, Andrew Cheng
  • Patent number: 9555795
    Abstract: A hybrid vehicle includes an engine coupled to a planetary gearset and an electric motor configured to provide motor torque directly to a torque transfer set. An overdrive clutch is configured to, when engaged, bypass at least a portion of engine torque to an overdrive shaft directly connected to the torque transfer set. This allows the engine to also provide torque directly to the torque transfer set along with the motor in an overdrive mode of operation. At least one controller is programmed to control the motor and/or the engine based on an estimated amount of torque transferred through the overdrive clutch.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: January 31, 2017
    Assignee: Ford Global Technologies, LLC
    Inventors: Bernard D. Nefcy, Daniel Scott Colvin, Andrew Cheng
  • Publication number: 20160356276
    Abstract: The present invention provides a numerical affinity pump sensorless conversion signal processing technique, e.g. based upon processing the pump differential pressure, flow rate and power at pump maximum speed published by pump manufacturers, as well as the pump affinity law in order to obtain instant pump differential pressures and flow rate directly and numerically. The sensorless converter technique may be applied to any form of pump characteristics distributions simple or complicated, since there is no need to reconstruct and to solve any pump and system characteristics equations. As a result, the computation accuracy is significantly improved.
    Type: Application
    Filed: June 6, 2016
    Publication date: December 8, 2016
    Inventors: Andrew A. CHENG, James J. GU, Kyle D. Schoenheit
  • Publication number: 20160297674
    Abstract: Packaged MEMS devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring is formed by a first bonding between the two ring pads. The device has a gap between the substrate and the cap wafer. This gap may be filled with a pressurized gas. An electrical connection is formed by a second bonding between one substrate pad and one wafer pad. An electrical contact is disposed over the cap wafer. The device also includes an insulation layer between the electrical contact and the cap wafer. Methods of producing the packaged MEMS devices are also described.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 13, 2016
    Inventors: Piu Francis Man, Anru Andrew Cheng
  • Publication number: 20160246290
    Abstract: Apparatus is provided featuring a signal processor or processing module configured to receive signaling containing information about a pump no flow idle (NFI) state when the pump is running at a pump idle speed; and determine corresponding signaling containing information about whether the pump should remain in a no flow shutdown (NFSD) state or the pump NFI state, based upon the signaling received. The signal processor or processing module is configured to provide the corresponding signaling containing information about whether the pump should remain in the NFSD state or the NFI state.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 25, 2016
    Inventors: Andrew A. CHENG, James J. GU
  • Publication number: 20160200311
    Abstract: A hybrid vehicle includes an engine coupled to a planetary gearset and an electric motor configured to provide motor torque directly to a torque transfer set. An overdrive clutch is configured to, when engaged, bypass at least a portion of engine torque to an overdrive shaft directly connected to the torque transfer set. This allows the engine to also provide torque directly to the torque transfer set along with the motor in an overdrive mode of operation. At least one controller is programmed to control the motor and/or the engine based on an estimated amount of torque transferred through the overdrive clutch.
    Type: Application
    Filed: January 9, 2015
    Publication date: July 14, 2016
    Inventors: Bernard D. NEFCY, Daniel Scott COLVIN, Andrew CHENG
  • Publication number: 20160186889
    Abstract: A discrete valve flow rate converter is provided to obtain a system flow through a valve in a dynamic hydronic pumping system, e.g., based on signaling containing information about the valve's differential pressure and the valve's hydronic characteristics calibration data. The discrete valve flow rate converter resolves the valve system flow rate directly and accurately with the valve's open position and the corresponding valve differential pressure signals associated therewith. The discrete valve flow rate converter may be applied to all kinds of valves as long as their open position and differential pressure associated with is available, e.g., including implementations for control valve applications, e.g., where the valve open position is controlled automatically and accurately, as well as implementations either for pumping system pressure controls with the flow rate known, such as adaptive hydronic system pressure controls, or as an alternative to sensorless pump monitoring and control.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 30, 2016
    Inventors: Andrew A. CHENG, James J. GU
  • Publication number: 20160017889
    Abstract: A signal processor receives signaling containing information about flow rates from sensorless converters in zone circulators in heating/cooling zones controlled by temperature sensors in a hydronic heating system in order to derive an adaptive pressure set point to meet the flow rates requested by the heating/cooling zones using an adaptive system and flow control curve equation, the signaling containing information about total flow rates requested by the zone circulators; determines desired pump speeds for the zone circulators to meet temperature requirements in heat zones; provides corresponding signaling containing information about the desired pump speeds; and/or determines the adaptive pump control curve equation based upon an adaptive system curve and as a moving maximum system flow rate depending on an adaptive pressure set point, a system flow rate requested by temperature loads, a minimum pressure at no flow, a control curve setting parameter, and an adaptive moving maximum flow and pressure.
    Type: Application
    Filed: June 4, 2015
    Publication date: January 21, 2016
    Inventors: Andrew A. CHENG, James J. GU, Graham A. SCOTT
  • Publication number: 20160010639
    Abstract: The present invention provides apparatus, including a hydronic sensorless pumping system, that features a signal processor or processing module configured to receive signaling containing information about motor readout values of power and speed, and also about pump and system characteristics equations together with empirical power equations that are constructed by a polynomial best-fit function together with pump affinity laws based upon a pump curve published by a pump manufacturer; and determine corresponding signaling containing information about a pump or system pressure and a flow rate at the motor readout values of power and speed, based upon the signaling received.
    Type: Application
    Filed: April 7, 2015
    Publication date: January 14, 2016
    Inventors: Andrew A. CHENG, James J. GU, Graham A. SCOTT
  • Patent number: 9170381
    Abstract: An electrical connection system for an optoelectronic socket comprises an optoelectronic socket (1), an OE package (2) assembled to the optoelectronic socket (1), and a circuit board (4). The optoelectronic socket (1) comprises a plurality of passageways (104) embedded with an optical member (12) respectively, and a number of electrical contacts. The OE package (2) comprises a plurality of lenses (20) located at bottom portion thereof and a plurality of electrical pads (22) located at peripheral of the bottom portion. Bottom end of the lens (20) of the OE package (2) are received in the passageway (104) and the electrical pads (22) contact with the electrical contacts (14). The optical member (12) is received in recess on upper face of the circuit board (4) and connects with a waveguide (40) positioned in the recess. The electrical contact is soldered to the circuit board.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: October 27, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Cheng-Chi Yeh, Andrew Cheng
  • Patent number: 8979575
    Abstract: An electrical connector assembly for use with an electronic package, includes an electrical connector having a plurality of contacts, and an assistant heat sink mounted upon the electrical connector and having an opening to allow the electronic package connecting with the contacts.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Pi Cheng, Andrew Cheng
  • Publication number: 20150032271
    Abstract: The present invention provides apparatus that features a signal processor or processing module configured to receive signaling containing information about an adaptive or self-calibrating set point control curve and a varying equivalent system characteristic curve based at least partly on an instant pump pressure and a flow rate using an adaptive moving average filter, and equivalent hydronic system characteristics associated with the instant pump pressure and the flow rate to corresponding motor power and speed reconstructed and remapped using a discrete numerical approach; and determine an adaptive pressure set point, based at least partly on the signaling received.
    Type: Application
    Filed: July 24, 2014
    Publication date: January 29, 2015
    Inventors: Andrew A. CHENG, James J. GU, Graham A. SCOTT
  • Patent number: 8894422
    Abstract: An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: November 25, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Nan-Hung Lin, Andrew Cheng, Chih-Pi Cheng, Shuo-Hsiu Hsu, Ting-Yao Hung
  • Publication number: 20140288716
    Abstract: The present invention provides apparatus featuring a signal processor or processing module that may be configured at least to: process signaling containing information about an equilibrium point of pump differential pressure and system pressure formulated in a hydronic domain by utilizing pump and system characteristic curve equations so as to yield system pressure and flow rate at any particular load and time in a pump hydronic system, including using a multi-dimensional sensorless conversion technique; and determine equivalent hydronic system characteristics associated with the pump differential pressure and flow rate to their corresponding motor power and speed reconstructed and remapped by using a discrete numerical approach, based at least partly on the signaling received. The signal processor or processing module may provide corresponding signaling containing information about the system pumping flow rate and pressure determined.
    Type: Application
    Filed: February 24, 2014
    Publication date: September 25, 2014
    Applicant: Fluid Handling LLC.
    Inventors: Andrew A. CHENG, Graham A. SCOTT, James J. GU
  • Publication number: 20140249682
    Abstract: The present invention provides apparatus featuring a signal processor or processing module that may be configured at least to: receive signaling containing information about calibrated motor speed and power data for a hydronic pumping system; and determine system pumping flow rate and pressure associated with an equivalent hydronic system characteristic variable, based at least partly on the signaling received. The signal processor or processing module may be configured to provide corresponding signaling containing information about the system pumping flow rate and pressure determined. The corresponding signaling may contain information used to control the hydronic pumping system.
    Type: Application
    Filed: November 27, 2013
    Publication date: September 4, 2014
    Applicant: Fluid Handling LLC.
    Inventors: Andrew A. CHENG, Graham A. SCOTT, James J. GU
  • Patent number: 8806341
    Abstract: A method and apparatus for navigating a media program is disclosed. Viewing data for segments of the media program are monitored and used to compile statistics that are presented to the user in a histogram, so that popular portions of the media program can be identified and navigated to. One embodiment includes a searchable transcript of the media program that is synchronized with the histogram.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: August 12, 2014
    Assignee: Hulu, LLC
    Inventors: Eugene Chuan-Huai Wei, Varun Narang, Zhibing Wang, Yuming Liang, Xin Jin, Ting-Hao Yang, Eric Feng, Andrew Cheng-Min Lin
  • Patent number: 8806340
    Abstract: A method and apparatus for embedding a media program with a randomly user selected thumbnail is disclosed. The user can scan a media program to identify one of a plurality of media program frames, select the frame of interest, then designate it as the thumbnail to use in connection with the embedded media program.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: August 12, 2014
    Assignee: Hulu, LLC
    Inventors: Andrew Cheng-min Lin, Eric Buehl, Tienan Ren, Xin Jin, Eric I. Feng