Abstract: A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.

Abstract: An exemplary active-matrix system comprises a system substrate with pixel elements disposed in pixel rows and pixel columns, pixel circuits each controlling two or more of the pixel elements, and row and column lines, at least one of each of which is electrically connected to each pixel circuit. The number of row lines is less than the number of pixel rows, the number of column lines is less than the number of pixel columns, or the number of row lines is less than the number of pixel rows and the number of column lines is less than the number of pixel columns.

Abstract: A micro-transfer printed intermediate structure comprises an intermediate substrate and one or more pixel structures disposed on the intermediate substrate. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure. A fractured intermediate tether is physically attached to the intermediate substrate. A method of making an intermediate structure source wafer comprises providing a source wafer having a patterned sacrificial layer including sacrificial portions separated by anchors, disposing an intermediate substrate over the patterned sacrificial layer, and disposing one or more pixel structures on the intermediate substrate entirely on or over each sacrificial portion. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure to form an intermediate structure.

Abstract: A method of making and testing transfer-printable micro-devices on a source wafer includes providing a source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads, providing a micro-device entirely over each of the plurality of sacrificial portions, each micro-device physically connected to at least one anchor with one or more tethers, providing one or more electrical test connections from each micro-device to a corresponding test contact pad, testing the micro-devices through the test connections to determine functional micro-devices and faulty micro-devices, and removing at least a portion of the one or more test connections.

Abstract: A micro-transfer printed high-resolution inorganic light-emitting diode (iLED) display includes a display substrate and a plurality of pixels disposed over the display substrate, each pixel comprising a pixel controller disposed or formed in or on a pixel substrate and controlling one or more iLEDs disposed or formed in or on respective iLED substrates. The one or more iLEDs are disposed above or below the pixel controller in a separate layer from the pixel controller. The display substrate, the iLED substrate(s), and the pixel substrate are all separate, independent and distinct, and the one or more iLEDs and pixel controller are each separate devices.

Abstract: An exemplary active-matrix system comprises a system substrate with pixel elements disposed in pixel rows and pixel columns, pixel circuits each controlling two or more of the pixel elements, and row and column lines, at least one of each of which is electrically connected to each pixel circuit. The number of row lines is less than the number of pixel rows, the number of column lines is less than the number of pixel columns, or the number of row lines is less than the number of pixel rows and the number of column lines is less than the number of pixel columns.

Abstract: A micro-transfer printed intermediate structure comprises an intermediate substrate and one or more pixel structures disposed on the intermediate substrate. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure. A fractured intermediate tether is physically attached to the intermediate substrate. A method of making an intermediate structure source wafer comprises providing a source wafer having a patterned sacrificial layer including sacrificial portions separated by anchors, disposing an intermediate substrate over the patterned sacrificial layer, and disposing one or more pixel structures on the intermediate substrate entirely on or over each sacrificial portion. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure to form an intermediate structure.

Abstract: A semiconductor structure suitable for micro-transfer printing includes a semiconductor substrate and a patterned insulation layer disposed on or over the semiconductor substrate. The insulation layer pattern forms one or more etch vias in contact with the semiconductor substrate. Each etch via is exposed. A semiconductor device is disposed on the patterned insulation layer and is surrounded by an isolation material in one or more isolation vias that are adjacent to the etch via. The etch via can be at least partially filled with a semiconductor material that is etchable with a common etchant as the semiconductor substrate. Alternatively, the etch via is empty and the semiconductor substrate is patterned to form a gap that separates at least a part of the semiconductor device from the semiconductor substrate and forms a tether physically connecting the semiconductor device to an anchor portion of the semiconductor substrate or the patterned insulation layer.

Abstract: A wirelessly powered display comprises a substrate, an antenna with multiple turns disposed on the substrate, an electronic circuit disposed on the substrate, and one or more pixels each having one or more inorganic light-emitting diodes disposed on the substrate. The electronic circuit is electrically connected to the one or more inorganic LEDs and the antenna, the antenna is responsive to electromagnetic energy to provide electrical power, and the electronic circuit includes a power converter that converts a signal with a relatively high current and low voltage to a signal with a relatively high voltage and low current. A wirelessly coupled display system includes a device including a wireless power transmitter that provides wireless power within a specified range and one or more wirelessly powered displays located within the range and responsive to the wireless power provided by the device to display an image.

Abstract: An apparatus includes a processor and a keyboard having multiple, separately moveable keys. The keyboard is configured to function as both a keyboard and a trackpad.

Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

Abstract: Systems, devices and methods for racking circuit breakers in a switchgear cabinet include a drive mechanism that is flexibly linked to a racking mechanism associated with each circuit breaker. The drive mechanism can be connected for racking multiple circuit breakers without requiring re-positioning of the drive mechanism.

Abstract: A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.

Abstract: A computing device includes a memory storing executable instructions, a processor configured to execute the instructions, a programmable display screen configured to display text-based information, and a multi-color indicator. The multi-color indicator is located on a surface of the computing device and includes a plurality of segments, each segment configured to display at least four different colors, where colors displayed by segments of the multi-color indicator are programmable, through execution of the instructions by the processor, to display non-text-based information.

Abstract: A wirelessly powered display comprises a substrate, an antenna with multiple turns disposed on the substrate, an electronic circuit disposed on the substrate, and one or more pixels each having one or more inorganic light-emitting diodes disposed on the substrate. The electronic circuit is electrically connected to the one or more inorganic LEDs and the antenna, the antenna is responsive to electromagnetic energy to provide electrical power, and the electronic circuit includes a power converter that converts a signal with a relatively high current and low voltage to a signal with a relatively high voltage and low current. A wirelessly coupled display system includes a device including a wireless power transmitter that provides wireless power within a specified range and one or more wirelessly powered displays located within the range and responsive to the wireless power provided by the device to display an image.

Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

Abstract: A micro-transfer printed intermediate structure comprises an intermediate substrate and one or more pixel structures disposed on the intermediate substrate. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure. A fractured intermediate tether is physically attached to the intermediate substrate. A method of making an intermediate structure source wafer comprises providing a source wafer having a patterned sacrificial layer including sacrificial portions separated by anchors, disposing an intermediate substrate over the patterned sacrificial layer, and disposing one or more pixel structures on the intermediate substrate entirely on or over each sacrificial portion. Each pixel structure includes an LED, a color filter, and a fractured pixel tether physically attached to the pixel structure to form an intermediate structure.

Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.