Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.

Abstract: A trigger guard for a firearm with a projection extending towards a magazine well of the firearm such that the projection extends into the magazine well. The trigger guard allows the projection to apply pressure to an inserted magazine or to limit the amount of movement of an inserted magazine within the magazine well.

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

Abstract: A method of making a flexible device comprises providing a rigid substrate and a flexible substrate, disposing a layer of print adhesive on the rigid substrate, and micro-transfer printing micro-devices onto the print adhesive. Each of the micro-devices comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and from the flexible substrate. A bonding layer is provided to bond the flexible substrate to the micro-devices such that (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate (e.g., forming a device structure). The flexible substrate is separated from the rigid substrate so that the micro-devices remain bonded to the flexible substrate providing a flexible device. The micro-devices can comprise at least a portion of a micro-device tether.

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.

Abstract: An exemplary active-matrix display comprises pixels disposed in a pixel array and pixel micro-controllers disposed in a controller array on a display substrate. Each of the pixels comprises micro-light-emitting elements that emit different color light. Each of the pixel micro-controllers is electrically connected to control the micro-light-emitting elements in each of two or more adjacent pixels in the pixel array. A spatial separation between pixels is greater than a spatial separation between the micro-light-emitting elements and is greater than a size of each of the micro-light-emitting elements. The micro-light-emitting elements in each of the pixels are disposed in a common pixel direction orthogonal to a pixel micro-controller center line an element distance substantially equal to or greater than one quarter of the extent of the pixel micro-controller in the common pixel direction from the center line. The pixel direction for each pixel controlled by a common pixel micro-controller is different.

Abstract: A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

Abstract: A method of making a flexible device comprises providing a rigid substrate and a flexible substrate, disposing a layer of print adhesive on the rigid substrate, and micro-transfer printing micro-devices onto the print adhesive. Each of the micro-devices comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and from the flexible substrate. A bonding layer is provided to bond the flexible substrate to the micro-devices such that (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate (e.g., forming a device structure). The flexible substrate is separated from the rigid substrate so that the micro-devices remain bonded to the flexible substrate providing a flexible device. The micro-devices can comprise at least a portion of a micro-device tether.

Abstract: A method of making a flexible device comprises providing a rigid substrate and a flexible substrate, disposing a layer of print adhesive on the rigid substrate, and micro-transfer printing micro-devices onto the print adhesive. Each of the micro-devices comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and from the flexible substrate. A bonding layer is provided to bond the flexible substrate to the micro-devices such that (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate (e.g., forming a device structure). The flexible substrate is separated from the rigid substrate so that the micro-devices remain bonded to the flexible substrate providing a flexible device. The micro-devices can comprise at least a portion of a micro-device tether.

Abstract: A transparent display comprises an at least partially transparent display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area and are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. The transparent display has a bezel transparency that varies over the bezel area. Bezel wires can be spaced apart by a bezel wire spacing that is greater than a width of the bezel wires. A display wire can be a mesh wire or have a depth greater than a width.

Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.

Abstract: A method of making and testing transfer-printable micro-devices on a source wafer includes providing a source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads, providing a micro-device entirely over each of the plurality of sacrificial portions, each micro-device physically connected to at least one anchor with one or more tethers, providing one or more electrical test connections from each micro-device to a corresponding test contact pad, testing the micro-devices through the test connections to determine functional micro-devices and faulty micro-devices, and removing at least a portion of the one or more test connections.

Abstract: A digital-drive display system, comprising an array of display pixels, each display pixel having a light emitter, a digital memory for storing a digital pixel value, and a drive circuit that drives the light emitter in response to the digital pixel value. The drive circuit can respond to a control signal provided to all of the display pixels in common by a display controller that loads digital pixel values in the digit memory of each display pixel.

Abstract: A wire guide includes a solid core mandrel that is initially received in a flat wire coil that has a rest inner diameter that is greater than a uniform diameter of the solid core mandrel. The flat wire of the flat wire coil is in tension between a proximal location and a distal location so that the flat wire coil has a reduced inner diameter that is smaller than its rest inner diameter. The tension in the flat wire is introduced by torquing the mandrel relative to the flat wire coil as part of attaching the coil to the mandrel.

Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.

Abstract: A micro-transfer printed high-resolution inorganic light-emitting diode (iLED) display includes a display substrate and a plurality of pixels disposed over the display substrate, each pixel including a pixel controller disposed or formed in or on a pixel substrate and controlling one or more iLEDs disposed or formed in or on respective iLED substrates. The one or more iLEDs are disposed above or below the pixel controller in a separate layer from the pixel controller. The display substrate, the iLED substrate(s), and the pixel substrate are all separate, independent and distinct, and the one or more iLEDs and pixel controller are each separate devices.

Abstract: A trigger guard for a firearm with a projection extending towards a magazine well of the firearm such that the projection extends into the magazine well. The trigger guard allows the projection to apply pressure to an inserted magazine or to limit the amount of movement of an inserted magazine within the magazine well.