Patents by Inventor Andrew Clarke
Andrew Clarke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11912497Abstract: A customisable, modular storage system is described where goods are stored in containers and the containers are stored in stacks. The stacks are contained within towers formed of stacks of bin receiving units. A grid network of tracks is provided on the top of the bin receiving units upon which load handling devices run. The load handling 30 devices take containers from the stacks and deposit them at alternative locations in the stacks or deposit then at stations where goods may be picked out.Type: GrantFiled: May 20, 2022Date of Patent: February 27, 2024Assignee: OCADO INNOVATION LIMITEDInventors: Lars Sverker Ture Lindbo, Paul Clarke, Andrew John Ingram-Tedd
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Publication number: 20240059638Abstract: Use of diverse biomass feedstock in a process for the recovery of target C5 and C6 alditols and target glycols via staged hydrogenation and hydrogenolysis processes is disclosed. Particular alditols of interest include, but are not limited to, xylitol and sorbitol. Various embodiments of the present invention synergistically improve overall recovery of target alditols and/or glycols from a mixed C5/C6 sugar stream without needlessly driving total recovery of the individual target alditols and/or glycols. The result is a highly efficient, low complexity process having enhanced production flexibility, reduced waste and greater overall yield than conventional processes directed to alditol or glycol production.Type: ApplicationFiled: October 25, 2023Publication date: February 22, 2024Inventors: Lloyd ALLEN, Claudio ARATO, Terry BRIX, Peter Andrew CLARKE, Joshua DAVIES, Bryan GENE, Mark KIRBY, Quak Foo LEE, William MCKEAN, Ankit MUNJAPARA, Clive Richard NORTON, Stuart A. STEIN, Gregory STOCK, David SUGDEN
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Patent number: 11894477Abstract: An electrical device includes a substrate with a compressive layer, a neutral stress buffer layer and a tensile stress compensation layer. The stress buffer layer and the stress compensation layer may each be formed with aluminum nitride using different processing parameters to provide a different intrinsic stress value for each layer. The aluminum nitride tensile layer is configured to counteract stresses from the compressive layer in the device to thereby control an amount of substrate bow in the device. This is useful for protecting fragile materials in the device, such as mercury cadmium telluride. The aluminum nitride stress compensation layer also can compensate for forces, such as due to CTE mismatches, to protect the fragile layer. The device may include temperature-sensitive materials, and the aluminum nitride stress compensation layer or stress buffer layer may be formed at a temperature below the thermal degradation temperature of the temperature-sensitive material.Type: GrantFiled: May 17, 2021Date of Patent: February 6, 2024Assignee: Raytheon CompanyInventors: Andrew Clarke, Emily Thomson, Michael Rondon
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Patent number: 11851785Abstract: An electrical device includes an aluminum nitride passivation layer for a mercury cadmium telluride (Hg1-xCdxTe) (MCT) semiconductor layer of the device. The AlN passivation layer may be an un-textured amorphous-to-polycrystalline film that is deposited onto the surface of the MCT in its as-grown state, or overlying the MCT after the MCT surface has been pre-treated or partially passivated, in this way fully passivating the MCT. The AlN passivation layer may have a coefficient of thermal expansion (CTE) that closely matches the CTE of the MCT layer, thereby reducing strain at an interface to the MCT. The AlN passivation layer may be formed with a neutral inherent (residual) stress, provide mechanical rigidity, and chemical resistance to protect the MCT.Type: GrantFiled: May 21, 2021Date of Patent: December 26, 2023Assignee: Raytheon CompanyInventors: Andrew Clarke, David R. Rhiger, George Grama, Stuart B. Farrell
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Patent number: 11854879Abstract: A Cu3Sn electrical interconnect and method of making same in an electrical device, such as for hybrid bond 3D-integration of the electrical device with one or more other electrical devices. The method of forming the Cu3Sn electrical interconnect includes: depositing a Sn layer in the via hole; depositing a Cu layer atop and in contact with the Sn layer; and heating the Sn layer and the Cu layer such that the Sn and Cu layers diffuse together to form a Cu3Sn interconnect in the via hole. During the heating, a diffusion front between the Sn and Cu layers moves in a direction toward the Cu layer as initially deposited, such that any remaining Cu layer or any voids formed during the diffusion are at an upper region of the formed Cu3Sn interconnect in the via hole, thereby allowing such voids or remaining material to be easily removed.Type: GrantFiled: February 25, 2021Date of Patent: December 26, 2023Assignee: Raytheon CompanyInventors: Andrew Clarke, John J. Drab, Faye Walker
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Patent number: 11840500Abstract: Use of diverse biomass feedstock in a process for the recovery of target C5 and C6 alditols and target glycols via staged hydrogenation and hydrogenolysis processes is disclosed. Particular alditols of interest include, but are not limited to, xylitol and sorbitol. Various embodiments of the present invention synergistically improve overall recovery of target alditols and/or glycols from a mixed C5/C6 sugar stream without needlessly driving total recovery of the individual target alditols and/or glycols. The result is a highly efficient, low complexity process having enhanced production flexibility, reduced waste and greater overall yield than conventional processes directed to alditol or glycol production.Type: GrantFiled: July 29, 2020Date of Patent: December 12, 2023Assignee: INTERCONTINENTAL GREAT BRANDS LLCInventors: Lloyd Allen, Claudio Arato, Terry Brix, Peter Andrew Clarke, Joshua Davies, Bryan Gene, Mark Kirby, Quak Foo Lee, William McKean, Ankit Munjapara, Clive Richard Norton, Stuart A. Stein, Gregory Stock, David Sugden
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Patent number: 11814207Abstract: An automated packaging station is capable of being used to package objects. The automated packaging station includes a supply of web material, a surface (202), an aperture (206) therein, and a closing system. The automated packaging station is configured to form the web material into a pouch. The aperture (206) is configured such that an object can be inserted therethrough. The automated packaging station is configured to bias open the pouch beneath the surface such that the object inserted through the aperture falls into the pouch. The closing system is configured to close the pouch to form a package around the object in response to the object being inserted through the aperture. The object is capable of being shipped to a recipient in the package.Type: GrantFiled: December 18, 2019Date of Patent: November 14, 2023Assignee: Sealed Air Corporation (US)Inventors: Brian Vilag, Bradley Powell, Morgan R. Stewart, Todd Rodgers, Joshua Woodie, Garrett P. Dyer, James Bravado, Yunji Gu, Michael Andrew Clarke, Jonathan D. Skolrood, Preston Chad Stephens
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Patent number: 11817521Abstract: In one aspect, a method includes forming an electrical path between p-type mercury cadmium telluride and a metal layer. The forming of the electrical path includes depositing a layer of polycrystalline p-type silicon directly on to the p-type mercury cadmium telluride and forming the metal layer on the layer of polycrystalline p-type silicon. In another aspect, an apparatus includes an electrical path. The electrical path includes a p-type mercury cadmium telluride layer, a polycrystalline p-type silicon layer in direct contact with the p-type mercury cadmium telluride layer, a metal silicide in direct contact with the polycrystalline p-type silicon layer, and an electrically conductive metal on the metal silicide. In operation, holes, indicative of electrical current on the electrical path, flow from the p-type mercury cadmium telluride layer to the electrically conductive metal.Type: GrantFiled: September 15, 2021Date of Patent: November 14, 2023Assignee: Raytheon CompanyInventors: Andrew Clarke, David R. Rhiger, Chad W. Fulk, Stuart B. Farrell, James Pattison, Jeffrey M. Peterson, Chad M. Althouse
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Patent number: 11782741Abstract: A coreflood experiment may be modeled by generating a three dimensional computer simulation model of a core plug and modeling within the three dimensional computer simulation model one or both of a fluid introduction element or a fluid extraction element of a core holder used in the coreflood experiment. Once generated, the model may be loaded and used when running a simulation to model a heterogeneous distribution of fluid flow proximate one or more faces of the core plug.Type: GrantFiled: February 27, 2020Date of Patent: October 10, 2023Assignee: Schlumberger Technology CorporationInventors: Shi Su, Marie Ann Giddins, Paul Naccache, Andrew Clarke, Edmund J. Fordham
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Patent number: 11733139Abstract: Sag propensity of a fluid can be determined by applying an oscillatory strain at an amplitude in excess of a linear region and below a yield strain of the drilling fluid. This may include use of medium amplitude oscillatory shear (MAOS), from which an elastic modulus of the fluid is determined. The elastic modulus may be determined over time, from which a time to reach maximum elastic modulus can be determined. The time to reach maximum elastic modulus is then converted or correlated to a drilling fluid sag propensity for the drilling fluid either in absolute terms or in relation to base or comparison fluids. Such an evaluation can be performed using a torsional resonance device in which the oscillatory strain is controllable so as to be maintained relatively constant during the measurement.Type: GrantFiled: May 25, 2022Date of Patent: August 22, 2023Assignee: SCHLUMBERGER TECHNOLOGY CORPORATIONInventor: Andrew Clarke
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Patent number: 11659660Abstract: A through-wafer via substrate includes a substrate having an intermediate layer and a bonding layer formed on a surface of the intermediate layer. A via cavity extends through the bonding layer and into the intermediate layer, and a stress buffer liner is deposited directly on inner sidewalls and a base of the via cavity. An electrically conductive through-wafer via is disposed in the via cavity such that the stress buffer liner is interposed completely between the intermediate layer and the through-wafer via.Type: GrantFiled: November 1, 2019Date of Patent: May 23, 2023Assignee: RAYTHEON COMPANYInventors: Christine Frandsen, John J. Drab, Andrew Clarke
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Publication number: 20230143079Abstract: Analytical methods and systems applied to sequential event data are disclosed. An exemplary system and method analyzes datasets containing events in a plurality of journeys. The methods and systems described analyze and quantify the relative importance of events and sequences leading to outcomes where the data is complex and interconnected. In some embodiments, a graphical user interface illustrates the quantification of these datasets. In some embodiments, the graphical user interface maps the journey paths to show the relative importance of each journey path. In some embodiments, the maps of journey paths are interactive, allowing selection of paths of interest for detailed analysis. In some embodiments, the methods and systems calculate paths similar to a journey path of interest. An exemplary method and system also provides detailed recommendations for changing events within a sequence to either increase or decrease the likelihood of achieving a selected outcome.Type: ApplicationFiled: October 11, 2022Publication date: May 11, 2023Applicant: Ignite Enterprise Software Solutions, Inc.Inventors: William Robert Bagley, Kyle Rattet, Joshua Templeton, David Holiday, Michael Herman, Christopher Andrew Clarke, Pedro Quinones, Andrew McGouirk, Jason Hodges, Jon B. Wisda, Philip Cunnell, Adam Rubin, Stefanie Tuder
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Patent number: D1016006Type: GrantFiled: June 25, 2021Date of Patent: February 27, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, M. Evans Hankey, Richard P. Howarth, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Clement Tissandier, Julian Jaede, Marine C. Bataille, Markus Diebel, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Jonathan Gomez Garcia, Nicolas Pedro Lylyk, Anthony Michael Ashcroft, Eugene Antony Whang, Joe Sung-Ho Tan
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Patent number: D1016059Type: GrantFiled: June 17, 2022Date of Patent: February 27, 2024Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Jeremy Bataillou, Daniel J. Coster, Daniele De Iuliis, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Marc A. Newson, Matthew Dean Rohrbach, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Christopher J. Stringer, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D1016777Type: GrantFiled: March 29, 2023Date of Patent: March 5, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang
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Patent number: D1016783Type: GrantFiled: May 10, 2023Date of Patent: March 5, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang
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Patent number: D1016811Type: GrantFiled: May 19, 2022Date of Patent: March 5, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Moises Hernandez Hernandez, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Nicolas Pedro Lylyk, Marc A. Newson, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang
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Patent number: D1017538Type: GrantFiled: December 12, 2022Date of Patent: March 12, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang
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Patent number: D1017603Type: GrantFiled: May 19, 2022Date of Patent: March 12, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Moises Hernandez Hernandez, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Nicolas Pedro Lylyk, Marc A. Newson, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang
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Patent number: D1018528Type: GrantFiled: May 7, 2021Date of Patent: March 19, 2024Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Abidur Rahman Chowdhury, Clara Geneviève Marine Courtaigne, Markus Diebel, Jonathan Gomez Garcia, M. Evans Hankey, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, Peter Russell-Clarke, Benjamin Andrew Shaffer, Joe Sung-Ho Tan, Clement Tissandier, Eugene Antony Whang