Patents by Inventor Andrew D. Henroid

Andrew D. Henroid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11849167
    Abstract: Techniques for on-demand issuance of private keys for encrypted video transmission are described. A video processing service of a provider network receives a request from a computing device outside the provider network to begin video processing of video data generated by a video source device outside the provider network. The video processing service sends instructions to a video encoding device associated with the video source device to establish the connection for video transmission. The video processing service sends an encryption key to the video encoding device, and sends a decryption key to a video decryption engine. Subsequently, the video processing service receives video data from the video source device, via the video encoding device.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: December 19, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Matthew Rives Vegas, Andrew D. Henroid, Akhil Ramachandran, Brian J. Rundle, Darin J. Klaas, Kevin Moore
  • Patent number: 11589100
    Abstract: Techniques for on-demand issuance of private keys for encrypted video transmission are described. A video processing service of a provider network receives a request from a computing device outside the provider network to begin video processing of video data generated by a video source device outside the provider network. The video processing service sends instructions to a video encoding device associated with the video source device to establish the connection for video transmission. The video processing service sends an encryption key to the video encoding device, and sends a decryption key to a video decryption engine. Subsequently, the video processing service receives video data from the video source device, via the video encoding device.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: February 21, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Matthew Rives Vegas, Andrew D. Henroid, Akhil Ramachandran, Brian J. Rundle, Darin J. Klaas, Kevin Moore
  • Patent number: 11567896
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Patent number: 11221857
    Abstract: The present invention relates to a platform power management scheme. In some embodiments, a platform provides a relative performance scale using one or more parameters to be requested by an OSPM system.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, Paul S. Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem, Krishnakanth V. Sistla, Eliezer Weissmann
  • Publication number: 20200334193
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Patent number: 10761579
    Abstract: In one embodiment, a system includes: a plurality of compute nodes to couple in a chassis; a first shared power supply to provide a baseline power level to the plurality of compute nodes; and an auxiliary power source to provide power to one or more of the plurality of compute nodes during operation at a higher power level than the baseline power level. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Vasudevan Srinivasan, Eugene Gorbatov, Andrew D. Henroid, Barnes Cooper, David W. Browning, Guy M. Therien, Neil W. Songer, Krishnakanth V. Sistla, James G. Hermerding, II
  • Patent number: 10706004
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Patent number: 10503517
    Abstract: A heterogeneous processor architecture and a method of booting a heterogeneous processor is described. A processor according to one embodiment comprises: a set of large physical processor cores; a set of small physical processor cores having relatively lower performance processing capabilities and relatively lower power usage relative to the large physical processor cores; and a package unit, to enable a bootstrap processor. The bootstrap processor initializes the homogeneous physical processor cores, while the heterogeneous processor presents the appearance of a homogeneous processor to a system firmware interface.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: December 10, 2019
    Assignee: Intel Corporation
    Inventors: Eliezer Weissmann, Rinat Rappoport, Michael Mishaeli, Hisham Shafi, Oron Lenz, Jason W. Brandt, Stephen A. Fischer, Bret L. Toll, Inder M. Sodhi, Alon Naveh, Ganapati N. Srinivasa, Ashish V. Choubal, Scott D. Hahn, David A. Koufaty, Russel J. Fenger, Gaurav Khanna, Eugene Gorbatov, Mishali Naik, Andrew J. Herdrich, Abirami Prabhakaran, Sanjeev S. Sahagirdar, Paul Brett, Paolo Narvaez, Andrew D. Henroid, Dheeraj R. Subbareddy
  • Publication number: 20190317773
    Abstract: The present invention relates to a platform power management scheme. In some embodiments, a platform provides a relative performance scale using one or more parameters to be requested by an OSPM system.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 17, 2019
    Applicant: Intel Corporation
    Inventors: Guy M. Therien, Paul S. Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem, Krishnakanth V. Sistla, Eliezer Weissmann
  • Patent number: 10275260
    Abstract: The present invention relates to a platform power management scheme. In some embodiments, a platform provides a relative performance scale using one or more parameters to be requested by an OSPM system.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: April 30, 2019
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, Paul S. Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem, Krishnakanth V. Sistla, Eliezer Weissmann
  • Patent number: 10162687
    Abstract: A processor of an aspect includes at least one lower processing capability and lower power consumption physical compute element and at least one higher processing capability and higher power consumption physical compute element. Migration performance benefit evaluation logic is to evaluate a performance benefit of a migration of a workload from the at least one lower processing capability compute element to the at least one higher processing capability compute element, and to determine whether or not to allow the migration based on the evaluated performance benefit. Available energy and thermal budget evaluation logic is to evaluate available energy and thermal budgets and to determine to allow the migration if the migration fits within the available energy and thermal budgets. Workload migration logic is to perform the migration when allowed by both the migration performance benefit evaluation logic and the available energy and thermal budget evaluation logic.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: December 25, 2018
    Assignee: Intel Corporation
    Inventors: Eugene Gorbatov, Alon Naveh, Inder M. Sodhi, Ganapati N. Srinivasa, Eliezer Weissmann, Guarav Khanna, Mishali Naik, Russell J. Fenger, Andrew D. Henroid, Dheeraj R. Subbareddy, David A. Koufaty, Paolo Narvaez
  • Patent number: 10108433
    Abstract: The present invention relates to a platform power management scheme. In some embodiments, a platform provides a relative performance scale using one or more parameters to be requested by an OSPM system.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: October 23, 2018
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, Paul S. Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem
  • Patent number: 10007528
    Abstract: In some embodiments, a PPM interface may be provided with functionality to facilitate to an OS memory power state management for one or more memory nodes, regardless of a particular platform hardware configuration, as long as the platform hardware is in conformance with the PPM interface.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: June 26, 2018
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, Paul Diefenbaugh, Anil Aggarwal, Andrew D. Henroid, Jeremy J. Shrall, Efraim Rotem, Krishnakanth V. Sistla, Eliezer Weissmann, Mohan Kumar, Sarathy Jayakumar, Jose Andy Vargas, Neelam Chandwani, Michael A. Rothman, Robert Gough, Mark Doran
  • Publication number: 20180143932
    Abstract: Methods and apparatuses relating to circuitry to spawn multiple virtual serial bus hub instances on a same physical serial bus hub are described. In one embodiment, an apparatus includes a serial bus hub to electrically couple a plurality of hosts and a plurality of devices, and a circuit to spawn a first virtual hub instance that is bound to a first host of the plurality of hosts and a first device of the plurality of devices, and spawn a concurrently usable, second virtual hub instance that is bound to a second host of the plurality of hosts and a second device of the plurality of devices.
    Type: Application
    Filed: November 21, 2016
    Publication date: May 24, 2018
    Inventors: SEAN LAWLESS, ANDREW D. HENROID
  • Publication number: 20180067892
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Application
    Filed: November 14, 2017
    Publication date: March 8, 2018
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Publication number: 20180060078
    Abstract: A heterogeneous processor architecture and a method of booting a heterogeneous processor is described. A processor according to one embodiment comprises: a set of large physical processor cores; a set of small physical processor cores having relatively lower performance processing capabilities and relatively lower power usage relative to the large physical processor cores; and a package unit, to enable a bootstrap processor. The bootstrap processor initializes the homogeneous physical processor cores, while the heterogeneous processor presents the appearance of a homogeneous processor to a system firmware interface.
    Type: Application
    Filed: August 8, 2017
    Publication date: March 1, 2018
    Inventors: Eliezer Weissmann, Rinat Rappoport, Michael Mishaeli, Hisham Shafi, Oron Lenz, Jason W. Brandt, Stephen A. Fischer, Bret L. Toll, Inder M. Sodhi, Alon Naveh, Ganapati N. Srinivasa, Ashish V, Choubal, Scott D. Hahn, David A. Koufaty, Russel J. Fenger, Gaurav Khanna, Eugene Gorbatov, Mishali Naik, Andrew J. Herdrich, Abirami Prabhakaran, Sanjeev S. Sahagirdar, Paul Brett, Paolo Narvaez, Andrew D. Henroid, Dheeraj R. Subbareddy
  • Patent number: 9874922
    Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power control logic to receive power capability information from a plurality of devices to couple to the processor and allocate a platform power budget to the devices, set a first power level for the devices at which the corresponding device is allocated to be powered, communicate the first power level to the devices, and dynamically reduce a first power to be allocated to a first device and increase a second power to be allocated to a second device responsive to a request from the second device for a higher power level. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: January 23, 2018
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Vasudevan Srinivasan, Eugene Gorbatov, Andrew D. Henroid, Barnes Cooper, David W. Browning, Guy M. Therien, Neil W. Songer, James G. Hermerding, II
  • Patent number: 9842082
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: December 12, 2017
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Publication number: 20170329377
    Abstract: In one embodiment, a system includes: a plurality of compute nodes to couple in a chassis; a first shared power supply to provide a baseline power level to the plurality of compute nodes; and an auxiliary power source to provide power to one or more of the plurality of compute nodes during operation at a higher power level than the baseline power level. Other embodiments are described and claimed.
    Type: Application
    Filed: August 4, 2017
    Publication date: November 16, 2017
    Inventors: Ankush Varma, Vasudevan Srinivasan, Eugene Gorbatov, Andrew D. Henroid, Barnes Cooper, David W. Browning, Guy M. Therien, Neil W. Songer, Krishnakanth V. Sistla, James G. Hermerding, II
  • Patent number: 9766673
    Abstract: In one embodiment, a system includes: a plurality of compute nodes to couple in a chassis; a first shared power supply to provide a baseline power level to the plurality of compute nodes; and an auxiliary power source to provide power to one or more of the plurality of compute nodes during operation at a higher power level than the baseline power level. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 19, 2017
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Vasudevan Srinivasan, Eugene Gorbatov, Andrew D. Henroid, Barnes Cooper, David W. Browning, Guy M. Therien, Neil W. Songer, Krishnakanth V. Sistla, James G. Hermerding, II