Abstract: An electrical connector comprises an upper housing, a lower housing and a plurality of contacts which each have a top contact received in the upper housing and a bottom contact received in the lower housing. The top contact is formed with a keeping portion and a lower mating end downwardly; the bottom contact has a pair of mating beams extending vertically for engaging with the lower mating end of the top contact. The pair of mating beams of the bottom contact mechanically and electrically engage with the lower mating end of the top contact when the top contact approaches the bottom contact two mating beams in a top-to-bottom direction under a pressed force. The contact has a simple structure adapted to a high-density connector while still maintaining performance of the connector.

Abstract: An electrical connector comprises an upper housing, a lower housing and a plurality of contacts which each have a top contact received in the upper housing and a bottom contact received in the lower housing. The top contact is formed with a keeping portion and a lower mating end downwardly; the bottom contact has a pair of mating beams extending vertically for engaging with the lower mating end of the top contact. The pair of mating beams of the bottom contact mechanically and electrically engage with the lower mating end of the top contact when the top contact approaches the bottom contact two mating beams in a top-to-bottom direction under a pressed force. The contact has a simple structure adapted to a high-density connector while still maintaining performance of the connector.

Abstract: A socket, for holding a semiconductor package, comprises a housing receiving a plurality of contacts and defining a space, a plurality of actuators assembled to the housing around the space, a lid movably assembled to the housing, a plurality of push fingers and a plurality of springs urging the push fingers. When the lid moves downwardly, the actuators are actuated to open the space and let the semiconductor package locate in the space, synchronously, the push fingers are forced by the lid to slide away from the space; When the lid moves upwardly, the actuator rotates to close the space and press the semiconductor package, and then the push fingers move back toward the space to position the semiconductor package by restore forces of the springs.

Abstract: A socket, for receiving a semiconductor package, has an insulating base receiving a plurality of contacts, a plurality of movable arms, a first movable frame, a second movable frame and a plurality of springs urging the movable arms. Each movable arm defines am opening position and a close position relative to the insulating base, The movable arm has an actuating portion with a free end and a cuneiform outside surface, a horizontal portion extending from the actuating portion for pressing the semiconductor package and a pair of bores on a bottom part of the actuating portion. A haulm passes through the bores to assemble the movable arm to the insulating base.

Abstract: A socket connector assembly for holding a semiconductor package comprises a socket connector and an actuator assembled to the socket connector. The actuator comprises a housing defining an opening on a bottom face thereof; a cam portion retained to the housing and being able to rotate; and a floating module. The floating module is movably mounted to the housing and defines a topmost position and a lowermost position relative to the housing. The floating moves between the topmost position and the lowermost position during a rotation of the cam portion. The floating module has an engaging portion to contact with the semiconductor package when the floating module is at the lowermost position.

Abstract: A conductive contact (1) includes a base portion (10) extending along a upright direction, an extending portion (13) extending from the base portion (10), a spring portion (14) extending upwardly from the extending portion (13) with a contacting portion extending portion (13) on a top end thereof, a tail (11) formed on a distal end thereof. Wherein the contact (1) further defines a head portion (12) extending upwardly from the base portion (1) for abutting against the extending portion (13) during the contact (1) sliding at a predetermined trace.

Abstract: A socket connector, adapted for electrically connecting an IC package and a printed circuit board, comprises a plurality contacts, an upper housing and a lower housing. The contact has a top contact, a bottom contact and a spring disposed between the top contact and the bottom contact. The top contact has a keeping portion formed with a front piece, a rear piece facing to the front piece and a bend portion connecting bottom edges of the front piece and the rear piece, and defines a guiding slot between the front piece and the rear piece. The bottom contact is inserted into the top contact and movable along the guiding slot. The lower housing defines a plurality of through gaps for receiving the bottom contacts; and the upper housing is mounted upon the lower housing and defines a plurality of receiving slots for receiving the top contacts.

Abstract: A socket connector for settling an integrated circuit module therein and connecting a sensor therewith comprises a base, a center plate mounted on the base, a plurality of contacts retained on the center plate and a retaining member. The base defines a slot for receiving the retaining member and a fastening hole for receiving the sensor, the retaining member comprises a blocking abutting against the sensor received in the fastening hole and a spring urging the blocking toward the sensor.

Abstract: A socket, for holding a semiconductor package, comprises a housing receiving a plurality of contacts and defining a space, a plurality of actuators assembled to the housing around the space, a lid movably assembled to the housing, a plurality of push fingers and a plurality of springs urging the push fingers. When the lid moves downwardly, the actuators are actuated to open the space and let the semiconductor package locate in the space, synchronously, the push fingers are forced by the lid to slide away from the space; When the lid moves upwardly, the actuator rotates to close the space and press the semiconductor package, and then the push fingers move back toward the space to position the semiconductor package by restore forces of the springs.

Abstract: A socket connector for settling an integrated circuit module therein and connecting a sensor therewith comprises a base, a center plate mounted on the base, a plurality of contacts retained on the center plate and a retaining member. The base defines a slot for receiving the retaining member and a fastening hole for receiving the sensor, the retaining member comprises a blocking abutting against the sensor received in the fastening hole and a spring urging the blocking toward the sensor.

Abstract: A socket connector assembly for holding a semiconductor package comprises a socket connector and an actuator assembled to the socket connector. The actuator comprises a housing defining an opening on a bottom face thereof; a cam portion retained to the housing and being able to rotate; and a floating module. The floating module is movably mounted to the housing and defines a topmost position and a lowermost position relative to the housing. The floating moves between the topmost position and the lowermost position during a rotation of the cam portion. The floating module has an engaging portion to contact with the semiconductor package when the floating module is at the lowermost position.

Abstract: An electrical connector comprising: an insulative housing defining a top surface with a plurality contact terminals planted within the housing; a frame having an rectangle framework securely attaching to the housing defining sidewalls jointly formed a room for receiving an IC package therein, engaging hollows are defined at an pair of opposite corner of the framework and a chamber at a corner of the framework; a compliant biasing device positioned in the said chamber of the corner of framework for positioning the IC package; a thermal control element having alignment pins related to the engaging hollows, said thermal control element pushing the compliant biasing device sliding in the chamber so the compliant biasing device attaching on the IC package to ensure proper and reliable electrical interconnection.

Abstract: A conductive contact (1) includes a base portion (10) extending along a upright direction, an extending portion (13) extending from the base portion (10), a spring portion (14) extending upwardly from the extending portion (13) with a contacting portion extending portion (13) on a top end thereof, a tail (11) formed on a distal end thereof. Wherein the contact (1) further defines a reinforcing portion (12) extending upwardly from the base portion (1) for abutting against the extending portion (13) during the contact (1) sliding at a predetermined trace.

Abstract: A socket, for receiving a semiconductor package, has an insulating base receiving a plurality of contacts, a plurality of movable arms, a first movable frame, a second movable frame and a plurality of springs urging the movable arms. Each movable arm defines am opening position and a close position relative to the insulating base, The movable arm has an actuating portion with a free end and a cuneiform outside surface, a horizontal portion extending from the actuating portion for pressing the semiconductor package and a pair of bores on a bottom part of the actuating portion. A haulm passes through the bores to assemble the movable arm to the insulating base.

Abstract: The socket connector assembly (20) comprises a socket connector (30), an IC package (40) installed upon the socket connector, a heat sink (60) mounted above the IC package, an actuator (50, 50?) detachably attached to the socket connector, a retention mechanism (70) mounted on the actuator and securing the heat sink on the actuator, and at least one latch (51, 51?). The at least one latch comprises a body (51a, 51a?). One end (51c) of the body is disposed on a part of the actuator. A latching portion (51b, 51b?) is formed on another end of the body, for being directly attached to a part of the socket connector. Thus the at least one latch holds the actuator on the socket connector.

Abstract: A burn-in socket assembly (1) includes a base (10) receiving an IC and a number of contacts, a slider member (20) mounted onto the base and capable of moving along the base, a pair of actuation members (30) assembled onto the base, and a cover (40) assembled onto the actuation members and capable of moving up and down. The base forms a pair of receiving elements (141) on front and end sides respectively. Each receiving element includes a body portion (142), a pair of spaced top portion (143) each having slits (144) extending therethrough and an aperture (145) extending therethrough. A sensor is received in the aperture to provide signals to a controller during being operated at high temperature. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.

Abstract: A test connector (1) includes a base (10), a cover (20), a metallic stiffener (70), two operating members (60), and a lid (30). An opening (703) is defined in the stiffener for receiving the cover therein. Two spaced projections (704) are formed on one end of the stiffener. Two receiving grooves (705) are defined in bottoms of the projections respectively. Each operating member comprises a first operating lever (601) engaged with the receiving grooves via a first shaft (603), and a second operating lever (602) engaged with the base. The lid is engaged with the operating members for pivotably moving the first and second operating levers so that the operating members actuate the stiffener and the cover to move. When the cover moves to make the terminals connect a CPU during applying an unduly force on the lid, the metallic stiffener can protect the plastic cover from damage.

Abstract: The socket connector assembly (20) comprises a socket connector (30), an IC package (40) installed upon the socket connector, a heat sink (60) mounted above the IC package, an actuator (50, 50?) detachably attached to the socket connector, a retention mechanism (70) mounted on the actuator and securing the heat sink on the actuator, and at least one latch (51, 51?). Said at least one latch comprises a body (51a, 51a?). One end (51c) of the body is disposed on a part of the actuator. A latching portion (51b, 51b?) is formed on another end of the body, for being directly attached to a part of the socket connector. Thereby said at least one latch holds the actuator on the socket connector.

Abstract: A connector assembly (10) includes a test connector (14) for testing of an IC package (40), an actuation system (12) mounted on the test connector, and a supporting member (16) engaged with the actuation system. The supporting member includes a frame (162) and a plurality of columns (160) for supporting the frame. The frame defines an opening (1620) in a center thereof, a pair of opposite channels (1622), and two receiving holes (1623). The actuation system includes a pair of first cams (120) received in the corresponding channels of the frame, a pair of spindles (126) received in the corresponding receiving holes of the frame, an actuation lever (124) connected between the first cams, and a pair of second cams (122) integrally connected to the spindles. The actuation system can exert a continuous force on the test connector, thereby the testing of the IC package is effective.

Abstract: A connector assembly (10) includes a test connector (14) for testing of an IC package (40), an actuation system (12) mounted on the test connector, and a supporting member (16) engaged with the actuation system. The supporting member includes a frame (162) and a plurality of columns (160) for supporting the frame. The frame defines an opening (1620) in a center thereof, a pair of opposite channels (1622), and two receiving holes (1623). The actuation system includes a pair of first cams (120) received in the corresponding channels of the frame, a pair of spindles (126) received in the corresponding receiving holes of the frame, an actuation lever (124) connected between the first cams, and a pair of second cams (122) integrally connected to the spindles. The actuation system can exert a continuous force on the test connector, thereby the testing of the IC package is effective.