Socket
A socket, for holding a semiconductor package, comprises a housing receiving a plurality of contacts and defining a space, a plurality of actuators assembled to the housing around the space, a lid movably assembled to the housing, a plurality of push fingers and a plurality of springs urging the push fingers. When the lid moves downwardly, the actuators are actuated to open the space and let the semiconductor package locate in the space, synchronously, the push fingers are forced by the lid to slide away from the space; When the lid moves upwardly, the actuator rotates to close the space and press the semiconductor package, and then the push fingers move back toward the space to position the semiconductor package by restore forces of the springs.
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1. Field of the Invention
The present invention relates to the art of electrical connector, and more specially to a socket for electrically interconnecting two electrical interfaces, such as a semiconductor package and a circuit board.
2. Description of the Prior Art
A conventional connector comprises a housing defining a receiving space and receiving a plurality of terminals, a plurality of actuators assembled to the housing around the receiving space, and a cover movably assembled to the housing in a top-to-bottom direction. The actuator defines a close position and an open position to open/close the receiving space. When the cover moves downwardly, the actuators are brought to move from the close position to the open position, a semiconductor package is put in the receiving space from a top side, then the cover is released and moves upwardly to an initial position, the actuator returns to the close position and downwardly presses the semiconductor package to make the semiconductor package electrically contact with the terminals. However, the semiconductor package is not adjusted and positioned after being located in the receiving space, so the semiconductor package may not be accurately positioned with the terminals on the housing, which will influence the whole performance of the socket.
Accordingly, a new socket that solves the above problems is desirable.
SUMMARY OF THE INVENTIONAccordingly, an object of the present invention is to provide a socket, which can position the semiconductor package received therein.
To fulfill the above object, a socket for a semiconductor package comprises a housing receiving a plurality of terminals and defining a space in a center thereof for receiving the semiconductor package; at least one push finger mounted to the housing and protruding into the space, the push finger being able to outwardly slide to leave the space; and a lid movably assembled to the housing.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Reference is now made to the drawings to describe the invention in detail.
Referring to
Continuing referring to
The frame member 40 defines an opening 41 with same size with the center hole 102 of the base 10 and is provided with four outwardly and upwardly protruding corners 42 to be located in two adjacent actuators 30 assembled on the base 10 and four mounting portions 43 for engaging with the base 10. The frame member 40 has another plane 44 attached to a bottom surface thereof. The frame member 40 is mounted to the base 10 from a top side and defines a space 100 together with the base 10 for locating the semiconductor package (not shown). The base 10, the bottom plate 20 and the frame member 40 are assembled together to form a housing.
Continuing referring to
Referring to
Conjoined with
Hereinafter, we will describe how the actuator 30 works. Primitively, the lid 50 is at a highest position, the actuator 30 is in a close state, as shown in
Referring to
Conjoined with
The push finger 60 is inwardly inserted into corresponding grooves 16 of the base 10 and corresponding slot 42 of the frame member 40 until the foot 64 touches an inner side of the rooms 17, and then, a spring 65 is put in the room 17 and surrounds the protruding pin 640 to inwardly urge the push finger 60 toward the space 100. At this situation, the protruding edge 630 of the vertical wall 63 protrudes into the space 100 (referring to
Referring to
Furthermore, although the present invention has been described with reference to particular embodiments, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
Claims
1. A socket for a semiconductor package comprising:
- a housing receiving a plurality of terminals and defining a space in a center thereof for receiving the semiconductor package;
- at least one push finger mounted to the housing and protruding into the space, the push finger being able to outwardly slide to leave the space; and
- a lid movably assembled to the housing.
2. The socket of claim 1, further comprising a plurality of actuators, the actuators are rotatablely assembled to the housing and are actuated by the lid to open/close the space.
3. The socket of claim 1, further comprising at least one spring which urges the push finger into the space.
4. The socket of claim 1, wherein the lid has at least one engaging portion which forces the push finger to move away from the space, when the lid downwardly moves relative to the housing.
5. The socket of claim 4, wherein the housing defines at least one slot for retaining and receiving the push finger, the push finger has a header which is located out of the slot and is actuated by the engaging portion of the lid.
6. The socket of claim 5, further comprising at least one spring, the spring is located in a room defined by the housing and urges the push finger toward the space, the spring is compressed when the push finger moves away from the space.
7. The socket of claim 1, wherein the push finger has a main body, a vertical wall upwardly extending from the main body with a protruding edge protruding into the space to abut against the semiconductor package, a header disposed at an end of the main body to be outwardly forced by the lid, and a foot downwardly extending from the main body which is inwardly urged toward the space by a spring.
8. A socket comprising:
- a housing receiving a plurality of terminals and defining a space;
- a lid assembled to the housing and being movable in a top-to-bottom direction;
- a plurality of actuators, which are mounted to the housing around the space and actuated by the lid to open/close the space; and
- at least one push finger having a protruding portion protruding into the space.
9. The socket of claim 8, further comprising at least one spring, the spring is located between the housing and the push finger to urge the push finger toward the space.
10. The socket of claim 9, wherein when the lid downwardly moves, the push finger is forced to move away from the space against the spring; and when the lid upwardly moves, the push finger returns to original position and protrudes into the space by a restore force of the spring.
11. The socket of claim 10, wherein the housing comprise a base, a bottom plate assembled to a bottom surface of the base, and a frame member assembled to the base from a top side.
12. The socket of claim 10, wherein the push finger has a header with an incline surface, the lid has at least one blocking portion which abuts against the incline surface and forces the push finger to move away from the space.
13. The socket of claim 8, wherein the push finger has a main body, a vertical wall upwardly extending from the main body with a protruding edge protruding into the space, a header disposed at an end of the main body to be outwardly forced by the lid, and a foot downwardly extending from the main body which is inwardly urged toward the space by a spring.
14. The socket of claim 8, wherein said actuator including a first linking member, pivotable about a first pivot, a second linking member having one section pivotally connected to a middle portion of the first linking member, and another section pivotally connected to a third linking member which is pivotable about a second pivot, under a condition that a pressing portion for pressing an electronic package is positioned on the first linking member, and the third linking member is actuated by the lid.
15. A socket comprising:
- a housing receiving a plurality of terminals and defining a space for receiving an electronic package therein;
- a lid assembled to the housing and being movable up and down in a vertical direction;
- a plurality of actuators, which are mounted to the housing around the space and actuated by the lid to open/close the space; wherein
- said actuator including a first linking member, pivotable about a first pivot, a second linking member having one section pivotally connected to a middle portion of the first linking member, and another section pivotally connected to a third linking member which is pivotable about a second pivot, under a condition that a pressing portion for pressing said electronic package is positioned on the first linking member, and the third linking member is actuated by the lid.
16. The socket of claim 15, wherein a push finger is assembled to the housing and moveable in a transverse direction under a condition that the push finger is actuated by said lie.
17. The socket of claim 15, wherein the push finger is further actuated by a spring so as to urge the push finger toward the electronic package when the lid is in a closed position.
Type: Application
Filed: Aug 31, 2007
Publication Date: Mar 5, 2009
Patent Grant number: 7736166
Applicant:
Inventor: Andrew Gattuso (Chandler, AZ)
Application Number: 11/897,820