Abstract: Position sensing modules associated with a device are provided. The position sensing modules are configured to receive electrical characteristics associated with one or more switches of a device over a predetermined period of time, the one or more switches being configured to connect service to or disconnect service from a customer; calculate a match indicator for each phase of the device including the one or more switches, the match indicator indicating whether an electrical characteristic on a load-side of the device matches a same electrical characteristic on a line-side of the device for each phase of the device; and determine a position of the one or more switches based on the received electrical characteristics and the calculated match indicator for each phase of the device.

Abstract: Position sensing and verification modules and a meter are provided. A module is configured to determine a position of one or more switch poles by measuring a current across the one or more switch poles. If a current is greater than or equal to a predetermined current threshold, the position is closed. If a current is less than the predetermined current threshold, the position is open. The module is configured to determine a line voltage with respect to a first reference value, determine a load voltage with respect to the first reference value, compare the line voltage to the load voltage to determine if the line voltage and the load voltage are within a predetermined threshold, and confirm the position of the one or more switch poles based on the comparison of the line voltage to the load voltage for the one or more line phases.

Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line, a magnetic structure around the conductive line, and material stubs at side faces of the magnetic structure.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a dielectric layer, in a substrate, the dielectric layer including an electroless catalyst, wherein the electroless catalyst includes one or more of palladium, gold, silver, ruthenium, cobalt, copper, nickel, titanium, aluminum, lead, silicon, and tantalum; a first conductive trace having a first thickness in the dielectric layer, wherein the first thickness is between 4 um and 143 um; and a second conductive trace having a second thickness in the dielectric layer, wherein the second thickness is between 2 um and 141 um, wherein the first thickness is greater than the second thickness, and wherein the first conductive trace and the second conductive trace have sloped sidewalls.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

Abstract: Disclosed herein are asymmetric cored integrated circuit (IC) package supports, and related devices and methods. For example, in some embodiments, an IC package support may include a core region having a first face and an opposing second face, a first buildup region at the first face of the core region, and a second buildup region at the second face of the core region. A thickness of the first buildup region may be different than a thickness of the second buildup region. In some embodiments, an inductor may be included in the core region.

Abstract: A sheet 200 for an array of vacuum apertures 152 in a substrate support unit 150 of a printer is provided. The sheet 200 comprises a plurality of valves 202 formed into the sheet 200. The sheet 200 is made from a resilient material. Each valve 202 comprises a valve head 204 for sealing a vacuum aperture 152 in the substrate support unit 150, and a valve lever arm 206 for permitting movement of the valve head 204 towards and away from the vacuum aperture 152 in order to open and close the valve 202.

Abstract: A substrate support system 10 for a conveyor printer is provided, comprising a support unit 100 comprising a plurality of vacuum apertures 108 arranged for fluidic communication with a source of negative pressure. The support unit 100 also comprises at least one air bearing 114 arranged for fluidic communication with a source of positive pressure. The air bearing 114 comprises porous media 116. The substrate support system 10 also comprises a conveyor belt 150 arranged over the support unit 100 for supporting a substrate 170 to be printed on. The conveyor belt 150 comprises a plurality of belt apertures. The vacuum apertures 108 are arranged to convey a negative pressure through the belt apertures for retaining the substrate 170 on the conveyor belt 150. The at least one air bearing 114 is arranged to convey a positive pressure to support the conveyor belt 150.

Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line, a magnetic structure around the conductive line, and material stubs at side faces of the magnetic structure.

Abstract: Semiconductor packages including package substrates having polymer-derived ceramic cores are described. In an example, a package substrate includes a core layer including a polymer-derived ceramic. The polymer-derived ceramic may include filler particles to control shrinkage and reduce warpage of the core layer during fabrication and use of the package substrate. The core layer may include counterbores or blind holes to embed a contact pad or an electrical interconnect in the core layer. A semiconductor die may be mounted on the package substrate and may be electrically connected to the contact pad or the electrical interconnect.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

Abstract: Disclosed herein are asymmetric cored integrated circuit (IC) package supports, and related devices and methods. For example, in some embodiments, an IC package support may include a core region having a first face and an opposing second face, a first buildup region at the first face of the core region, and a second buildup region at the second face of the core region. A thickness of the first buildup region may be different than a thickness of the second buildup region. In some embodiments, an inductor may be included in the core region.

Abstract: Semiconductor packages including package substrates having polymer-derived ceramic cores are described. In an example, a package substrate includes a core layer including a polymer-derived ceramic. The polymer-derived ceramic may include filler particles to control shrinkage and reduce warpage of the core layer during fabrication and use of the package substrate. The core layer may include counterbores or blind holes to embed a contact pad or an electrical interconnect in the core layer. A semiconductor die may be mounted on the package substrate and may be electrically connected to the contact pad or the electrical interconnect.

Abstract: Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: A device and method for the reduction of vortex-induced vibration of a deepwater riser. A device for attachment to a structure, which is subject to movement relative to a fluid surrounding the structure, for reducing vortex-induced vibration effects on the structure, the device comprising: a flexible netting (4) interconnecting a plurality of relatively inflexible members comprising a plurality of elongate members (3) and a plurality of spacer members (6), wherein each elongate member has a first cuter boundary and each spacer member has a second outer boundary wherein the second boundary extends radially outward of the first outer boundary relative to the netting, over at least: a substantial portion of the boundary.