Patents by Inventor Andrew John McKerrow
Andrew John McKerrow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11832533Abstract: Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve forming a bilayer including a barrier layer directly on chalcogenide material deposited using pulsed plasma plasma-enhanced chemical vapor deposition (PP-PECVD) and an encapsulation layer over the barrier layer deposited using plasma-enhanced atomic layer deposition (PEALD). In various embodiments, the barrier layer is formed using a halogen-free silicon precursor and the encapsulation layer deposited by PEALD is formed using a halogen-containing silicon precursor and a hydrogen-free nitrogen-containing reactant.Type: GrantFiled: December 20, 2021Date of Patent: November 28, 2023Assignee: Lam Research CorporationInventors: James Samuel Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn Merced Kelchner, John Hoang, Alexander Dulkin, Danna Qian, Vikrant Rai
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Publication number: 20220115592Abstract: Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve forming a bilayer including a barrier layer directly on chalcogenide material deposited using pulsed plasma plasma-enhanced chemical vapor deposition (PP-PECVD) and an encapsulation layer over the barrier layer deposited using plasma-enhanced atomic layer deposition (PEALD). In various embodiments, the barrier layer is formed using a halogen-free silicon precursor and the encapsulation layer deposited by PEALD is formed using a halogen-containing silicon precursor and a hydrogen-free nitrogen-containing reactant.Type: ApplicationFiled: December 20, 2021Publication date: April 14, 2022Inventors: James Samuel Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn Merced Kelchner, John Hoang, Alexander Dulkin, Danna Qian, Vikrant Rai
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Patent number: 11239420Abstract: Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve forming a bilayer including a barrier layer directly on chalcogenide material deposited using pulsed plasma plasma-enhanced chemical vapor deposition (PP-PECVD) and an encapsulation layer over the barrier layer deposited using plasma-enhanced atomic layer deposition (PEALD). In various embodiments, the barrier layer is formed using a halogen-free silicon precursor and the encapsulation layer deposited by PEALD is formed using a halogen-containing silicon precursor and a hydrogen-free nitrogen-containing reactant.Type: GrantFiled: August 24, 2018Date of Patent: February 1, 2022Assignee: Lam Research CorporationInventors: James Samuel Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn Merced Kelchner, John Hoang, Alexander Dulkin, Danna Qian, Vikrant Rai
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Patent number: 11075127Abstract: Disclosed are methods of and apparatuses and systems for depositing a film in a multi-station deposition apparatus. The methods may include: (a) providing a substrate to a first station of the apparatus, (b) adjusting the temperature of the substrate to a first temperature, (c) depositing a first portion of the material on the substrate while the substrate is at the first temperature in the first station, (d) transferring the substrate to the second station, (e) adjusting the temperature of the substrate to a second temperature, and (f) depositing a second portion of the material on the substrate while the substrate is at the second temperature, such that the first portion and the second portion exhibit different values of a property of the material. The apparatuses and systems may include a multi-station deposition apparatus and a controller having control logic for performing one or more of (a)-(f).Type: GrantFiled: July 3, 2019Date of Patent: July 27, 2021Assignee: Lam Research CorporationInventors: Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, James Samuel Sims, Ramesh Chandrasekharan, Jon Henri
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Patent number: 10745817Abstract: In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.Type: GrantFiled: October 16, 2017Date of Patent: August 18, 2020Assignee: Novellus Systems, Inc.Inventors: Kousik Ganesan, Tighe A. Spurlin, Jonathan David Reid, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan
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Publication number: 20200066987Abstract: Methods and apparatuses for forming an encapsulation bilayer over a chalcogenide material on a semiconductor substrate are provided. Methods involve forming a bilayer including a barrier layer directly on chalcogenide material deposited using pulsed plasma plasma-enhanced chemical vapor deposition (PP-PECVD) and an encapsulation layer over the barrier layer deposited using plasma-enhanced atomic layer deposition (PEALD). In various embodiments, the barrier layer is formed using a halogen-free silicon precursor and the encapsulation layer deposited by PEALD is formed using a halogen-containing silicon precursor and a hydrogen-free nitrogen-containing reactant.Type: ApplicationFiled: August 24, 2018Publication date: February 27, 2020Inventors: James Samuel Sims, Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn Merced Kelchner, John Hoang, Alexander Dulkin, Danna Qian, Vikrant Rai
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Publication number: 20200066607Abstract: Disclosed are methods of and apparatuses and systems for depositing a film in a multi-station deposition apparatus. The methods may include: (a) providing a substrate to a first station of the apparatus, (b) adjusting the temperature of the substrate to a first temperature, (c) depositing a first portion of the material on the substrate while the substrate is at the first temperature in the first station, (d) transferring the substrate to the second station, (e) adjusting the temperature of the substrate to a second temperature, and (f) depositing a second portion of the material on the substrate while the substrate is at the second temperature, such that the first portion and the second portion exhibit different values of a property of the material. The apparatuses and systems may include a multi-station deposition apparatus and a controller having control logic for performing one or more of (a)-(f).Type: ApplicationFiled: July 3, 2019Publication date: February 27, 2020Inventors: Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, James Samuel Sims, Ramesh Chandrasekharan, Jon Henri
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Patent number: 10454029Abstract: Methods and apparatuses for forming conformal, low wet etch rate silicon nitride films having low hydrogen content using atomic layer deposition are described herein. Methods involve depositing a silicon nitride film at a first temperature using a bromine-containing and/or iodine-containing silicon precursor and nitrogen by atomic layer deposition and treating the silicon nitride film using a plasma at a temperature less than about 100° C. Methods and apparatuses are suitable for forming conformal, dense, low wet etch rate silicon nitride films as encapsulation layers over chalcogenide materials for memory applications.Type: GrantFiled: November 11, 2016Date of Patent: October 22, 2019Assignee: Lam Research CorporationInventors: Andrew John McKerrow, Dennis M. Hausmann
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Patent number: 10347547Abstract: Disclosed are methods of and apparatuses and systems for depositing a film in a multi-station deposition apparatus. The methods may include: (a) providing a substrate to a first station of the apparatus, (b) adjusting the temperature of the substrate to a first temperature, (c) depositing a first portion of the material on the substrate while the substrate is at the first temperature in the first station, (d) transferring the substrate to the second station, (e) adjusting the temperature of the substrate to a second temperature, and (f) depositing a second portion of the material on the substrate while the substrate is at the second temperature, such that the first portion and the second portion exhibit different values of a property of the material. The apparatuses and systems may include a multi-station deposition apparatus and a controller having control logic for performing one or more of (a)-(f).Type: GrantFiled: August 9, 2016Date of Patent: July 9, 2019Assignee: LAM RESEARCH CORPORATIONInventors: Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, James Samuel Sims, Ramesh Chandrasekharan, Jon Henri
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Patent number: 10319582Abstract: Thin layer of silicon oxide is deposited on a substrate having an exposed layer of metal (e.g., W, Cu, Ti, Co, Ta) without causing substantial oxidation of the metal. The method involves: (a) contacting the substrate having an exposed metal layer with a silicon-containing precursor and adsorbing the precursor on the substrate; (b) removing the unadsorbed precursor from a process chamber; and (c) contacting the adsorbed precursor with a plasma formed in a process gas comprising an oxygen source (e.g., O2, CO2, N2O, O3) and H2, to form silicon oxide from the silicon-containing precursor while suppressing metal oxidation. These steps can be repeated until a silicon oxide film of a desired thickness is formed. In some embodiments, the silicon oxide film is used to improve nucleation of subsequently deposited silicon carbide.Type: GrantFiled: April 27, 2017Date of Patent: June 11, 2019Assignee: Lam Research CorporationInventors: Bhadri N. Varadarajan, Zhe Gui, Bo Gong, Andrew John McKerrow
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Patent number: 10240236Abstract: Apparatuses and methods for cleaning a semiconductor processing chamber is provided. The semiconductor processing chamber may include a UV radiation source, a substrate holder, and a UV transmissive window. The UV transmissive window may include one or multiple panes. One or more panes of the UV transmissive window may be non-reactive with fluorine containing chemistries. In multi-pane windows a purge gas flow path may be formed in the gap between windows. A purge gas may be flowed through the purge gas flow path to prevent process gases used in the chamber interior from reaching one or more panes of the UV transmissive window.Type: GrantFiled: March 6, 2015Date of Patent: March 26, 2019Assignee: Lam Research CorporationInventors: James Lee, George Andrew Antonelli, Kevin M. McLaughlin, Andrew John McKerrow, Curtis Bailey, Alexander R. Fox, Stephen Lau, Eugene Smargiassi, Casey Holder, Troy Daniel Ribaudo, Xiaolan Chen
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Publication number: 20180315597Abstract: Thin layer of silicon oxide is deposited on a substrate having an exposed layer of metal (e.g., W, Cu, Ti, Co, Ta) without causing substantial oxidation of the metal. The method involves: (a) contacting the substrate having an exposed metal layer with a silicon-containing precursor and adsorbing the precursor on the substrate; (b) removing the unadsorbed precursor from a process chamber; and (c) contacting the adsorbed precursor with a plasma formed in a process gas comprising an oxygen source (e.g., O2, CO2, N2O, O3) and H2, to form silicon oxide from the silicon-containing precursor while suppressing metal oxidation. These steps can be repeated until a silicon oxide film of a desired thickness is formed. In some embodiments, the silicon oxide film is used to improve nucleation of subsequently deposited silicon carbide.Type: ApplicationFiled: April 27, 2017Publication date: November 1, 2018Inventors: Bhadri N. Varadarajan, Zhe Gui, Bo Gong, Andrew John McKerrow
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Patent number: 10020188Abstract: A method of depositing ALD films on semiconductor substrates processed in a micro-volume of a plasma enhanced atomic layer deposition (PEALD) reaction chamber wherein a single semiconductor substrate is supported on a ceramic surface of a pedestal and process gas is introduced through gas outlets in a ceramic surface of a showerhead into a reaction zone above the semiconductor substrate, includes (a) cleaning the ceramic surfaces of the pedestal and showerhead with a fluorine plasma such that aluminum-rich byproducts are formed on the ceramic surfaces, (b) depositing a conformal halide-free atomic layer deposition (ALD) oxide undercoating on the ceramic surfaces so as to cover the aluminum-rich byproducts, (c) depositing a pre-coating on the halide-free ALD oxide undercoating, and (d) processing a batch of semiconductor substrates by transferring each semiconductor substrate into the reaction chamber and depositing a film on the semiconductor substrate supported on the ceramic surface of the pedestal.Type: GrantFiled: November 20, 2017Date of Patent: July 10, 2018Assignee: LAM RESEARCH CORPORATIONInventors: James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Seshasayee Varadarajan, Kathryn Merced Kelchner
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Publication number: 20180138405Abstract: Methods and apparatuses for forming conformal, low wet etch rate silicon nitride films having low hydrogen content using atomic layer deposition are described herein. Methods involve depositing a silicon nitride film at a first temperature using a bromine-containing and/or iodine-containing silicon precursor and nitrogen by atomic layer deposition and treating the silicon nitride film using a plasma at a temperature less than about 100° C. Methods and apparatuses are suitable for forming conformal, dense, low wet etch rate silicon nitride films as encapsulation layers over chalcogenide materials for memory applications.Type: ApplicationFiled: November 11, 2016Publication date: May 17, 2018Inventors: Andrew John McKerrow, Dennis M. Hausmann
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Publication number: 20180102245Abstract: A method of depositing ALD films on semiconductor substrates processed in a micro-volume of a plasma enhanced atomic layer deposition (PEALD) reaction chamber wherein a single semiconductor substrate is supported on a ceramic surface of a pedestal and process gas is introduced through gas outlets in a ceramic surface of a showerhead into a reaction zone above the semiconductor substrate, includes (a) cleaning the ceramic surfaces of the pedestal and showerhead with a fluorine plasma such that aluminum-rich byproducts are formed on the ceramic surfaces, (b) depositing a conformal halide-free atomic layer deposition (ALD) oxide undercoating on the ceramic surfaces so as to cover the aluminum-rich byproducts, (c) depositing a pre-coating on the halide-free ALD oxide undercoating, and (d) processing a batch of semiconductor substrates by transferring each semiconductor substrate into the reaction chamber and depositing a film on the semiconductor substrate supported on the ceramic surface of the pedestal.Type: ApplicationFiled: November 20, 2017Publication date: April 12, 2018Applicant: LAM RESEARCH CORPORATIONInventors: James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Seshasayee Varadarajan, Kathryn Merced Kelchner
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Publication number: 20180047645Abstract: Disclosed are methods of and apparatuses and systems for depositing a film in a multi-station deposition apparatus. The methods may include: (a) providing a substrate to a first station of the apparatus, (b) adjusting the temperature of the substrate to a first temperature, (c) depositing a first portion of the material on the substrate while the substrate is at the first temperature in the first station, (d) transferring the substrate to the second station, (e) adjusting the temperature of the substrate to a second temperature, and (f) depositing a second portion of the material on the substrate while the substrate is at the second temperature, such that the first portion and the second portion exhibit different values of a property of the material. The apparatuses and systems may include a multi-station deposition apparatus and a controller having control logic for performing one or more of (a)-(f).Type: ApplicationFiled: August 9, 2016Publication date: February 15, 2018Inventors: Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, James Samuel Sims, Ramesh Chandrasekharan, Jon Henri
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Publication number: 20180038007Abstract: In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.Type: ApplicationFiled: October 16, 2017Publication date: February 8, 2018Inventors: Kousik Ganesan, Tighe A. Spurlin, Jonathan David Reid, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan
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Patent number: 9824884Abstract: A method of depositing silicon nitride films on semiconductor substrates processed in a micro-volume of a plasma enhanced atomic layer deposition (PEALD) reaction chamber wherein a single semiconductor substrate is supported on a ceramic surface of a pedestal and process gas is introduced through gas outlets in a ceramic surface of a showerhead into a reaction zone above the semiconductor substrate, includes (a) cleaning the ceramic surfaces of the pedestal and showerhead with a fluorine plasma, (b) depositing a halide-free atomic layer deposition (ALD) oxide undercoating on the ceramic surfaces, (c) depositing a precoating of ALD silicon nitride on the halide-free ALD oxide undercoating, and (d) processing a batch of semiconductor substrates by transferring each semiconductor substrate into the reaction chamber and depositing a film of ALD silicon nitride on the semiconductor substrate supported on the ceramic surface of the pedestal.Type: GrantFiled: October 6, 2016Date of Patent: November 21, 2017Assignee: LAM RESEARCH CORPORATIONInventors: James S. Sims, Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Seshasayee Varadarajan, Kathryn Merced Kelchner
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Patent number: 9502255Abstract: Methods of repairing damaged low-k dielectric films using UV-activated photosensitive organic compounds are described herein. Methods of sealing pores by exposing porous dielectric films to UV-activated large photosensitive organic compounds are also described. Methods also include mechanically reinforcing dielectric films using photosensitive organic compounds activated by UV radiation. Compounds include at least one photosensitive end group, such as an unsaturated bond or group with high ring strain.Type: GrantFiled: October 17, 2014Date of Patent: November 22, 2016Assignee: Lam Research CorporationInventors: George Andrew Antonelli, Andrew John McKerrow
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Publication number: 20160258057Abstract: Apparatuses and methods for cleaning a semiconductor processing chamber is provided. The semiconductor processing chamber may include a UV radiation source, a substrate holder, and a UV transmissive window. The UV transmissive window may include one or multiple panes. One or more panes of the UV transmissive window may be non-reactive with fluorine containing chemistries. In multi-pane windows a purge gas flow path may be formed in the gap between windows. A purge gas may be flowed through the purge gas flow path to prevent process gases used in the chamber interior from reaching one or more panes of the UV transmissive window.Type: ApplicationFiled: March 6, 2015Publication date: September 8, 2016Inventors: James Lee, George Andrew Antonelli, Kevin M. McLaughlin, Andrew John McKerrow, Curtis Bailey, Alexander R. Fox, Stephen Lau, Eugene Smargiassi, Casey Holder, Troy Daniel Ribaudo, Xiaolan Chen