Patents by Inventor Andrew K. Brown
Andrew K. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929556Abstract: An apparatus includes multiple patch antenna elements configured to transmit multiple electromagnetic beams in multiple beam directions. The apparatus also includes multiple inputs each configured to receive one of multiple input signals, where each input signal is associated with one of the electromagnetic beams. The apparatus further includes multiple phase-tapered splitters each configured to receive one of the input signals, divide the received input signal into a set of sub-signals, and provide a phase taper that adjusts phases of at least some of the sub-signals in the set of sub-signals. Different phase tapers are associated with different ones of the beam directions. In addition, the apparatus includes multiple 90° hybrid transformers each configured to receive sub-signals associated with different ones of the input signals, isolate the received sub-signals from each other, and provide the isolated sub-signals to one of the patch antenna elements.Type: GrantFiled: September 8, 2020Date of Patent: March 12, 2024Assignee: Raytheon CompanyInventors: Andrew D. Gamalski, Andrew K. Brown
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Patent number: 11917746Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.Type: GrantFiled: April 22, 2022Date of Patent: February 27, 2024Assignee: Raytheon CompanyInventors: Miroslav Micovic, Brandon W. Pillans, Andrew D. Gamalski, Andrew K. Brown
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Publication number: 20230345616Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.Type: ApplicationFiled: April 22, 2022Publication date: October 26, 2023Applicant: Raytheon CompanyInventors: Miroslav Micovic, Brandon W. Pillans, Andrew D. Gamalski, Andrew K. Brown
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Patent number: 11424551Abstract: A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.Type: GrantFiled: June 19, 2019Date of Patent: August 23, 2022Assignee: Raytheon CompanyInventors: Andrew Gamalski, Andrew K. Brown, Darren Himbaza, Kenneth W. Brown
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Publication number: 20220077594Abstract: An apparatus includes multiple patch antenna elements configured to transmit multiple electromagnetic beams in multiple beam directions. The apparatus also includes multiple inputs each configured to receive one of multiple input signals, where each input signal is associated with one of the electromagnetic beams. The apparatus further includes multiple phase-tapered splitters each configured to receive one of the input signals, divide the received input signal into a set of sub-signals, and provide a phase taper that adjusts phases of at least some of the sub-signals in the set of sub-signals. Different phase tapers are associated with different ones of the beam directions. In addition, the apparatus includes multiple 90° hybrid transformers each configured to receive sub-signals associated with different ones of the input signals, isolate the received sub-signals from each other, and provide the isolated sub-signals to one of the patch antenna elements.Type: ApplicationFiled: September 8, 2020Publication date: March 10, 2022Inventors: Andrew D. Gamalski, Andrew K. Brown
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Publication number: 20200403320Abstract: A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.Type: ApplicationFiled: June 19, 2019Publication date: December 24, 2020Inventors: Andrew Gamalski, Andrew K. Brown, Darren Himbaza, Kenneth W. Brown
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Patent number: 9362609Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.Type: GrantFiled: March 31, 2014Date of Patent: June 7, 2016Assignee: Raytheon CompanyInventors: Kenneth W. Brown, Darin M. Gritters, Michael J. Sotelo, Andrew K. Brown, Travis B. Feenstra
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Patent number: 9226385Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (?), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼?, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.Type: GrantFiled: November 16, 2012Date of Patent: December 29, 2015Assignee: RAYTHEON COMPANYInventors: Andrew K. Brown, Shane A. O'Connor
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Publication number: 20150280650Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.Type: ApplicationFiled: March 31, 2014Publication date: October 1, 2015Applicant: Raytheon CompanyInventors: Kenneth W. Brown, Darin M. Gritters, Michael J. Sotelo, Andrew K. Brown, Travis B. Feenstra
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Patent number: 9078371Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.Type: GrantFiled: October 15, 2012Date of Patent: July 7, 2015Assignee: RAYTHEON COMPANYInventors: Andrew K. Brown, Thomas L. Obert, Michael J. Sotelo, Darin M. Gritters, Kenneth W. Brown
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Publication number: 20140139300Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (?), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼?, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.Type: ApplicationFiled: November 16, 2012Publication date: May 22, 2014Applicant: RAYTHEON COMPANYInventors: Andrew K. Brown, Shane A. O'Connor
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Publication number: 20140102774Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.Type: ApplicationFiled: October 15, 2012Publication date: April 17, 2014Applicant: RAYTHEON COMPANYInventors: Andrew K. Brown, Thomas L. Obert, Michael J. Sotelo, Darin M. Gritters, Kenneth W. Brown
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Patent number: 8552813Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.Type: GrantFiled: November 23, 2011Date of Patent: October 8, 2013Assignee: Raytheon CompanyInventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft
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Publication number: 20130127563Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.Type: ApplicationFiled: November 23, 2011Publication date: May 23, 2013Applicant: Raytheon CompanyInventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft
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Patent number: 8305280Abstract: A transition for coupling a microwave signal between a transmission line formed on a planar dielectric substrate and a hollow waveguide may include a half-notch antenna formed on a portion of the dielectric substrate extending into an open end of the hollow waveguide.Type: GrantFiled: November 4, 2009Date of Patent: November 6, 2012Assignee: Raytheon CompanyInventors: Kenneth W. Brown, Andrew K. Brown, Darin M. Gritters, Michael J. Sotelo, Thanh C. Ta
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Patent number: 8107894Abstract: A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements.Type: GrantFiled: February 16, 2009Date of Patent: January 31, 2012Assignee: Raytheon CompanyInventors: Reid F. Lowell, Kenneth W. Brown, Darin M. Gritters, Andrew K. Brown, Michael J. Sotelo, William E. Dolash, Travis B. Feenstra
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Patent number: 7969245Abstract: Embodiments of a high-frequency millimeter-wave amplifier are generally described herein. The high-frequency millimeter-wave amplifier may be constructed on a substrate to operate at a frequency of at least 75 GHz. In some embodiments, the millimeter-wave amplifier may include at least first, second, third and fourth amplifier stages coupled in series. A single drain bias bond pad provided on the substrate to provide a drain bias voltage to the drains of the first, second, third and fourth amplifier stages. Drain bias lines may be electrically coupled to the single drain bias bond pad and extend at least partially alongside and between some of the amplifier stages. A signal path through the second amplifier stage extends in a direction opposite of signal paths through the first and third amplifier stages. In some embodiments, a 95 GHz amplifier is provided and configured occupy an area on the substrate of no greater than approximately four square millimeters.Type: GrantFiled: October 14, 2010Date of Patent: June 28, 2011Assignee: Raytheon CompanyInventors: Kenneth W. Brown, Andrew K. Brown
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Publication number: 20110102284Abstract: A transition for coupling a microwave signal between a transmission line formed on a planar dielectric substrate and a hollow waveguide may include a half-notch antenna formed on a portion of the dielectric substrate extending into an open end of the hollow waveguide.Type: ApplicationFiled: November 4, 2009Publication date: May 5, 2011Inventors: Kenneth W. Brown, Andrew K. Brown, Darin M. Gritters, Michael J. Sotelo, Thanh C. Ta
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Publication number: 20110025423Abstract: Embodiments of a high-frequency millimeter-wave amplifier are generally described herein. The high-frequency millimeter-wave amplifier may be constructed on a substrate to operate at a frequency of at least 75 GHz. In some embodiments, the millimeter-wave amplifier may include at least first, second, third and fourth amplifier stages coupled in series. A single drain bias bond pad provided on the substrate to provide a drain bias voltage to the drains of the first, second, third and fourth amplifier stages. Drain bias lines may be electrically coupled to the single drain bias bond pad and extend at least partially alongside and between some of the amplifier stages. A signal path through the second amplifier stage extends in a direction opposite of signal paths through the first and third amplifier stages. In some embodiments, a 95 GHz amplifier is provided and configured occupy an area on the substrate of no greater than approximately four square millimeters.Type: ApplicationFiled: October 14, 2010Publication date: February 3, 2011Applicant: Raytheon CompanyInventors: Kenneth W. Brown, Andrew K. Brown
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Patent number: 7843273Abstract: A description is provided of a high-frequency, multi-stage, millimeter wave amplifier integrated circuit, and of a method for designing and constructing the circuit. The methods and structures have been created to enable the construction of an amplifier offering substantial gain at a relatively high power and high frequency, but occupying minimal area of an integrated circuit die. Various structures and methodologies are described which each contribute to the practical feasibility of constructing an amplifier with such performance in a relatively compact space.Type: GrantFiled: November 6, 2008Date of Patent: November 30, 2010Assignee: Raytheon CompanyInventors: Kenneth W. Brown, Andrew K. Brown