Abstract: A description is provided of a high-frequency, multi-stage, millimeter wave amplifier integrated circuit, and of a method for designing and constructing the circuit. The methods and structures have been created to enable the construction of an amplifier offering substantial gain at a relatively high power and high frequency, but occupying minimal area of an integrated circuit die. Various structures and methodologies are described which each contribute to the practical feasibility of constructing an amplifier with such performance in a relatively compact space.

Abstract: A millimeter wave amplifier constructed on a substrate and configured for use at a frequency of 75 GHz or higher, may include four amplifier stages. A first inter-stage filter, resonant at an operating frequency of the amplifier, may couple the output of the first stage to the input of the second stage. A second inter-stage filter, resonant at the operating frequency, may couple the output of the second stage to the input of the third stage. A third inter-stage filter, resonant at the operating frequency, may couple the output of the third stage to the input of the fourth stage. A plurality of bias supply leads that couple a gate bias voltage and a drain bias voltage to each of the amplifier stages. A plurality of bias line filters, resonant at the operating frequency, may be connected from at least some of the bias supply leads to a ground plane.

Abstract: A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements.

Abstract: A description is provided of a high-frequency, multi-stage, millimeter wave amplifier integrated circuit, and of a method for designing and constructing the circuit. The methods and structures have been created to enable the construction of an amplifier offering substantial gain at a relatively high power and high frequency, but occupying minimal area of an integrated circuit die. Various structures and methodologies are described which each contribute to the practical feasibility of constructing an amplifier with such performance in a relatively compact space.

Abstract: A millimeter wave amplifier constructed on a substrate and configured for use at a frequency of 75 GHz or higher, may include four amplifier stages. A first inter-stage filter, resonant at an operating frequency of the amplifier, may couple the output of the first stage to the input of the second stage. A second inter-stage filter, resonant at the operating frequency, may couple the output of the second stage to the input of the third stage. A third inter-stage filter, resonant at the operating frequency, may couple the output of the third stage to the input of the fourth stage. A plurality of bias supply leads that couple a gate bias voltage and a drain bias voltage to each of the amplifier stages. A plurality of bias line filters, resonant at the operating frequency, may be connected from at least some of the bias supply leads to a ground plane.

Abstract: Embodiments of active array antennas are generally described herein. Other embodiments may be described and claimed. In some embodiments, a reflect array antenna includes an array of rectangular monolithic sub-array modules arranged in a non-uniform pattern to leave a plurality of rectangular gaps in the pattern. A DC feed pin located within each gap may provide DC bias current to the sub-array modules. The sub-array modules may be mounted on a heat sink in the non-uniform pattern. The heat sink may have holes aligned with the gaps to allow passage of the DC feed pins. In some embodiments, an array cooling assembly may be coupled to the back of the heat sink to cool the reflect array antenna with a coolant.

Abstract: An area-protection system uses an active-array antenna to generate a high-power millimeter-wave wavefront to deter an intruder within a protected area. One or more reflectors may be positioned within the protected area to help retain energy of the wavefront within the area. The area-protection system may include an intrusion-detection subsystem to detect presence of the intruder within the protected area and to generate a detection signal. The active-array antenna may generate the high-power millimeter-wave wavefront in response to the detection signal. In some embodiments, the intrusion-detection subsystem may detect the presence of a tag worn by the intruder, and may instruct the array antenna to refrain from generating the wavefront when tag is authenticated. In some embodiments, an illuminator may be used detect intruder movement based on return signals. In some embodiments, the array antenna includes semiconductor wafers arranged together on a substantially flat surface.