Abstract: Gateway devices can use dual cellular interfaces, each assignable to at least one of a plurality of network services, to provide reliable communications for client machines. A gateway device can use one of the dual cellular interfaces assigned to a first network service as a primary interface and the other assigned to a second network service as a hot backup interface. The backup interface remains connected to a cellular network while communications are routed on the primary interface. Accordingly, the gateway device can rapidly switch communications between from the primary interface to the backup interface. Applications, for example, for ATM payment processing, vending machine telemetry, point of sale payment processing, kiosk internet connectivity, remote monitoring and control, mobile or electronic health, and remote information displays, may run on the gateway devices, on servers, on user devices, or a combination of these devices.

Abstract: Example embodiments of systems and methods for data transmission system between transmitting and receiving devices are provided. In an embodiment, each of the transmitting and receiving devices can contain a master key. The transmitting device can generate a diversified key using the master key, protect a counter value and encrypt data prior to transmitting to the receiving device, which can generate the diversified key based on the master key and can decrypt the data and validate the protected counter value using the diversified key.

Abstract: Example embodiments of systems and methods for data transmission system between transmitting and receiving devices are provided. In an embodiment, each of the transmitting and receiving devices can contain a master key. The transmitting device can generate a diversified key using the master key, protect a counter value and encrypt data prior to transmitting to the receiving device, which can generate the diversified key based on the master key and can decrypt the data and validate the protected counter value using the diversified key.

Abstract: An aircraft includes a cabin wall defining a cabin and a convertible monument in the cabin adjacent the cabin wall. The convertible monument has a plurality of monument walls defining sides, a front and a rear of the monument surrounding a chamber defined by the monument walls. The convertible monument has a closet component positioned in the chamber for supporting non-perishable items in the chamber. The chamber has a convertible area convertible between a cooling compartment and an uncooled compartment. A chiller is positioned in the chamber proximate the convertible area. The chiller is configured to supply cool air to the cooling compartment when operated for cooling perishable items stowed in the cooling compartment. The convertible area is used as an uncooled compartment for stowing non-perishable items when the chiller is inactive.

Abstract: An aircraft includes a cooling compartment and an evaporative chiller configured to cool the cooling compartment. The evaporative chiller includes a compressor, an evaporator having airflow to the cooling compartment, and a condenser. The condenser has an exhaust airflow to cool the condenser. The evaporative chiller has a condensate removal system removing condensate produced by the evaporator using the exhaust airflow of the condenser to discharge the condensate.

Abstract: An aircraft includes a cooling compartment and an evaporative chiller configured to cool the cooling compartment. The evaporative chiller includes a compressor, an evaporator having airflow to the cooling compartment, and a condenser. The condenser has an exhaust airflow to cool the condenser. The evaporative chiller has a condensate removal system removing condensate produced by the evaporator using the exhaust airflow of the condenser to discharge the condensate.

Abstract: An aircraft includes a cabin wall defining a cabin and a convertible monument in the cabin adjacent the cabin wall. The convertible monument has a plurality of monument walls defining sides, a front and a rear of the monument surrounding a chamber defined by the monument walls. The convertible monument has a closet component positioned in the chamber for supporting non-perishable items in the chamber. The chamber has a convertible area convertible between a cooling compartment and an uncooled compartment. A chiller is positioned in the chamber proximate the convertible area. The chiller is configured to supply cool air to the cooling compartment when operated for cooling perishable items stowed in the cooling compartment. The convertible area is used as an uncooled compartment for stowing non-perishable items when the chiller is inactive.

Abstract: This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.

Abstract: A method for repairing a gas turbine engine component includes the steps of repairing one of a suction side or a pressure side of the component; repairing internal geometry of the component after one of the suction side or the pressure side of the component is repaired; and repairing the other of the suction side and the pressure side of the component after the internal geometry of the component is repaired, wherein a backing material is utilized to preserve the internal geometry of the component when the other of the suction side and the pressure side of the component is being repaired.

Abstract: The method for repairing a part composed of a superalloy combines both welding and brazing steps in order to effectively, reproducibly and reliably seal surface and subsurface defects while also ensuring oxides and contaminant removal.

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4-n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a

Abstract: A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4−n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound hav

Abstract: A silicone composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) an effective amount of a titanium or zirconium compound having at least one aliphatic carbon-carbon multiple bond, and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone product formed from the composition.

Abstract: A silicone composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) an effective amount of a titanium or zirconium compound having at least one aliphatic carbon-carbon multiple bond, and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone product formed from the composition.

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: A silicone composition prepared by mixing (A) 100 parts by weight of an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) 0.5 to 50 parts by weight of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group and at least one aliphatic carbon-carbon multiple bond per molecule, (D) 1 to 10 parts by weight of a titanium chelate, and (E) a catalytic amount of a hydrosilylation catalyst; and a cured product formed from the composition.

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecules; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: A silicone composition for preparing a cured silicone product, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an alumina filler in a concentration sufficient to impart thermal conductivity to the cured silicone product; (D) an effective amount product; (D) an effective amount of a polyether; and (E) a catalytic amount of a hydrosilylation catalyst. A cured silicone product comprising a reaction product of the silicon composition.