Abstract: A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R13SiO(R12SiO)nSiR13 wherein each R1 is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0.1 to 200 Pa·s at 25° C., and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R23SiO1/2 siloxane units and SiO4/2 siloxane units wherein each R2 is independently alkyl or alkenyl, the mole ratio of R23SiO1/2 units to SiO4/2 units is from 0.65 to 1.

Abstract: An electrically conductive hot-melt silicone adhesive composition, comprising (A) a hot-melt silicone adhesive; (B) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (C) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided that when the composition is curable, the compound does not substantially inhibit cure.

Abstract: A curable silicone composition for preparing a silicone adhesive, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound is free of acetylenic hydroxy groups and the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a hydrosilylation catalyst.

Abstract: A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin consisting essentially of R33 SiO1/2 units and SiO4/2 units, wherein the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) 25 to 200 parts by weight of a silica filler having an average surface area less than 25 m2/g; and (E) a catalytic amount of a hydrosilylation catalyst. Each R3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups. The mole ratio of R33SiO1/2 units to SiO4/2 units in the organopolysiloxane resin is from 0.6:1 to 1.

Abstract: A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin comprising R.sup.3.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups, the mole ratio of R.sup.3.sub.3 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.

Abstract: The adhesion of cured polyolefin compositions to a variety of substrates is improved using as the adhesion promoter the combination of 1) an organic or organosilicon compound containing at least one epoxy group and 2) at least one compound containing a) at least one silanol or carbinol group or a hydrolyzable silanol group precursor, and b) at least one group that reacts during curing of the polyolefin.

Abstract: The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.

Abstract: The present invention provides adhesion promoters for curable polyolefin compositions wherein said adhesion promoters are selected from a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds. At least one hydrocarbyloxy group on each silicon atom of the adhesion promoter is derived from a polyhydric alcohol containing at least two hydroxyl groups per molecule and substantially no ethylenic unsaturation.

Abstract: The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal containing catalyst, a conductive metal particulate, a precrosslinked elastomeric silicone particle, and a non-reactive volatile diluent. The electrically conductive silicone compositions of this invention are useful as electrically conductive adhesives and coatings for electrical and electronic devices. The cured electrically conductive silicone compositions of this invention have high electroconductivity and rubbery elasticity.

Abstract: This invention relates to organosilicon compositions useful as adhesion promoters for curable organopolysiloxanes, said organosilicon compositions being formed by reacting (A) a polyhydric alcohol, (B) an organosiloxane containing at least one organofunctional group and one hydroxyl or hydrolyzable group per molecule and (C) a silane containing at least three hydrolyzable groups per molecule.

Abstract: A foamable, curable organosiloxane composition comprising an alkenyl-functional polyorganosiloxane, an organohydrogensiloxane, a blowing agent, a platinum catalyst and an adhesion promoter comprising an epoxy-functional compound, a hydroxyl-functional compound, a tetraalkylorthosilicate, an organotitanate and an aluminum or zirconium compound.

Abstract: A foamable, curable organosiloxane composition comprising an alkenyl-functional polyorganosiloxane, an organohydrogensiloxane, a blowing agent, a platinum catalyst and an adhesion promoter comprising an epoxy-functional compound, a hydroxyl-functional compound, a tetraalkylorthosilicate, an organotitanate and an aluminum or zirconium compound.