Abstract: A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 ?m to 13 ?m.

Abstract: An optoelectronic switch for transferring an optical signal from a source external client device to a destination external client device, includes a leaf rack unit having thereon a leaf switch assembly including: a leaf switch having a plurality of fabric ports including a first fabric port and a second fabric port; and a fabric port multiplexer associated with the leaf switch, arranged to combine a first signal from the first fabric port and a second signal from the second fabric port onto a first connection, in the form of an outgoing first multiplexed signal.

Abstract: A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 ?m to 13 ?m.

Abstract: An optoelectronic switch for switching data from a source external client device to a destination external client device, the optoelectronic switch includes: an array of client-side transceivers, each having an array of client-facing optical ports to connect to an external client device, and an array of leaf-facing electrical ports; an array of leaf switches, each including an array of client-side electrical ports and an array of fabric-side electrical ports; a first electrical interconnecting region providing electrical connections between the leaf-facing electrical ports of the client-side transceivers and the client-side electrical ports of the leaf switches, an array of fabric-side transceivers, each having an array of leaf-facing electrical ports, and an array of fabric-facing optical ports; a second electrical interconnecting region providing electrical connections between the fabric-side electrical ports of the leaf switches and the leaf-facing electrical ports of the fabric-side transceivers; an array

Abstract: A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 ?m to 13 ?m.

Abstract: An optoelectronic switch for transferring an optical signal from a source external client device to a destination external client device, includes a leaf rack unit having thereon a leaf switch assembly including: a leaf switch having a plurality of fabric ports including a first fabric port and a second fabric port; and a fabric port multiplexer associated with the leaf switch, arranged to combine a first signal from the first fabric port and a second signal from the second fabric port onto a first connection, in the form of an outgoing first multiplexed signal.

Abstract: An optoelectronic device and method of making the same. The device comprising: a substrate; an epitaxial crystalline cladding layer, on top of the substrate; and an optically active region, above the epitaxial crystalline cladding layer; wherein the epitaxial crystalline cladding layer has a refractive index which is less than a refractive index of the optically active region, such that the optical power of the optoelectronic device is confined to the optically active region.

Abstract: An optoelectronic device and method of making the same. The device comprising: a substrate; an epitaxial crystalline cladding layer, on top of the substrate; and an optically active region, above the epitaxial crystalline cladding layer; wherein the epitaxial crystalline cladding layer has a refractive index which is less than a refractive index of the optically active region, such that the optical power of the optoelectronic device is confined to the optically active region.

Abstract: An optoelectronic switch for switching data from a source external client device to a destination external client device, the optoelectronic switch includes: an array of client-side transceivers, each having an array of client-facing optical ports to connect to an external client device, and an array of leaf-facing electrical ports; an array of leaf switches, each including an array of client-side electrical ports and an array of fabric-side electrical ports; a first electrical interconnecting region providing electrical connections between the leaf-facing electrical ports of the client-side transceivers and the client-side electrical ports of the leaf switches, an array of fabric-side transceivers, each having an array of leaf-facing electrical ports, and an array of fabric-facing optical ports; a second electrical interconnecting region providing electrical connections between the fabric-side electrical ports of the leaf switches and the leaf-facing electrical ports of the fabric-side transceivers; an array

Abstract: A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 ?m to 13 ?m.

Abstract: An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.

Abstract: An optoelectronic device and method of making the same. The device comprising: a substrate; an epitaxial crystalline cladding layer, on top of the substrate; and an optically active region, above the epitaxial crystalline cladding layer; wherein the epitaxial crystalline cladding layer has a refractive index which is less than a refractive index of the optically active region, such that the optical power of the optoelectronic device is confined to the optically active region.

Abstract: A silicon-on-insulator chip including an arrayed waveguide grating (AWG) and an array of detector remodulators (DRMs) in a planar arrangement with the AWG such that the modulators or modulators and detectors of said DRMs are located within the same plane as the waveguides of the AWG; and wherein each DRM is located at an input or output of the AWG.

Abstract: A switch module and optoelectronic switch incorporating the same. The optoelectronic switch includes an N-dimensional array of switch modules arranged in a topology in which each switch module is a member of N sub-arrays, the sub-arrays defined with reference to the coordinates of the constituent switch modules, and wherein all of the members of each sub-array are connected by an active switch, which in some embodiments may be an optical active switch or an electronic active switch.

Abstract: An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.

Abstract: An optoelectronic switch comprising: a first plurality of detector remodulators (DRMs) (C3, D1), each DRM having an integer number M of optical inputs and an integer number N of optical outputs; a second plurality of DRMs (C7, D5), each DRM having N optical inputs and M optical outputs; a passive optical switch fabric (C4+C5+C6, D2+D3+D4) connecting the N optical outputs of each of the first plurality of DRMs with the N optical inputs of each of the second plurality of DRMs, the path of an optical signal through the optical switch fabric depending upon its wavelength; wherein each DRM (C3, D1) of the first plurality of DRMs is configured to act as a tunable wavelength converter to select the desired path of an optical signal through the optical switch fabric (C4+C5+C6, D2+D3+D4); and wherein each of the first plurality of DRMs (C3, D1) includes a concentrator, the concentrator configured to aggregate optical signals received from any of the M inputs of that DRM and to buffer them according to the one of the p

Abstract: An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.

Abstract: An optoelectronic switch comprising: a first plurality of detector remodulators (DRMs) (C3, D1), each DRM having an integer number M of optical inputs and an integer number N of optical outputs; a second plurality of DRMs (C7, D5), each DRM having N optical inputs and M optical outputs; a passive optical switch fabric (C4+C5+C6, D2+D3+D4) connecting the N optical outputs of each of the first plurality of DRMs with the N optical inputs of each of the second plurality of DRMs, the path of an optical signal through the optical switch fabric depending upon its wavelength; wherein each DRM (C3, D1) of the first plurality of DRMs is configured to act as a tunable wavelength converter to select the desired path of an optical signal through the optical switch fabric (C4+C5+C6, D2+D3+D4); and wherein each of the first plurality of DRMs (C3, D1) includes a concentrator, the concentrator configured to aggregate optical signals received from any of the M inputs of that DRM and to buffer them according to the one of the p

Abstract: The present invention provides an optoelectronic switch for transferring an optical signal from an input device to an output device, the optoelectronic switch including an array of interconnected switch modules, which are interconnected by an interconnecting fabric. The switch modules are arranged in an N-dimensional array, the ith dimension having a size Ri (i=1, 2, . . . , N), each switch module having an associated set of coordinates giving its location with respect to each of the N dimensions. Each switch module is a member of N such sub-arrays Si, each sub-array Si comprising Ri switch modules whose coordinates differ only in respect of their location in the ith dimension, and each of the N sub-arrays being associated with a different dimension.

Abstract: A switch module and optoelectronic switch incorporating the same. The optoelectronic switch includes an N-dimensional array of switch modules arranged in a topology in which each switch module is a member of N sub-arrays, the sub-arrays defined with reference to the coordinates of the constituent switch modules, and wherein all of the members of each sub-array are connected by an active switch, which in some embodiments may be an optical active switch or an electronic active switch.