Patents by Inventor Andrew Wank

Andrew Wank has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10272541
    Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 30, 2019
    Assignees: Rohm and Haas Electronic Matericals CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Scott Chang, Jeff Tsai, Francis V. Acholla, Andrew Wank, Mark Gazze, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Patent number: 10144115
    Abstract: A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 5 to 1,000 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: December 4, 2018
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: David Michael Veneziale, Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, Yuhua Tong, Jeffrey B. Miller, Diego Lugo, George C. Jacob, Marty W. DeGroot, Andrew Wank, Fengji Yeh
  • Publication number: 20180311792
    Abstract: The present invention provides methods of manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing substrates, such as semiconductor wafers comprising providing a composition of a plurality of liquid-filled microelements having a polymeric shell; classifying the composition via centrifugal air classification to remove fines and coarse particles and to produce liquid-filled microelements having a density of 800 to 1500 g/liter; and, forming the CMP polishing layer by (i) converting the classified liquid-filled microelements into gas-filled microelements by heating them, then mixing them with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) combining the classified liquid-filled microelements directly with the liquid polymer matrix forming material, and casting or molding.
    Type: Application
    Filed: May 1, 2017
    Publication date: November 1, 2018
    Inventors: Bainian Qian, George C. Jacob, Andrew Wank, David Shidner, Kancharla-Arun K. Reddy, Donna Marie Alden, Marty W. DeGroot
  • Patent number: 10105825
    Abstract: A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: October 23, 2018
    Assignees: Rohm and Haas Electronics Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: David Michael Veneziale, Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, Yuhua Tong, Jeffrey B. Miller, Diego Lugo, George C. Jacob, Marty W. DeGroot, Andrew Wank, Fengji Yeh
  • Patent number: 10092998
    Abstract: A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: October 9, 2018
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, David Michael Veneziale, Yuhua Tong, Diego Lugo, George C. Jacob, Jeffrey B. Miller, Tony Quan Tran, Marc R. Stack, Andrew Wank, Jeffrey James Hendron
  • Patent number: 10011002
    Abstract: A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: July 3, 2018
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, David Michael Veneziale, Yuhua Tong, Diego Lugo, George C. Jacob, Jeffrey B. Miller, Tony Quan Tran, Marc R. Stack, Andrew Wank, Jeffrey James Hendron
  • Patent number: 10005172
    Abstract: The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: June 26, 2018
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Yuhua Tong, Andrew Wank, Diego Lugo, Marc R. Stack, David Michael Veneziale, Marty W. DeGroot, George C. Jacob, Jeffrey B. Miller
  • Patent number: 9776300
    Abstract: A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ?10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: October 3, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings Inc., Dow Global Technologies LLC
    Inventors: Bainian Qian, Julia Kozhukh, Teresa Brugarolas Brufau, David Michael Veneziale, Yuhua Tong, Diego Lugo, Jeffrey B. Miller, George C. Jacob, Marty W. DeGroot, Tony Quan Tran, Marc R. Stack, Andrew Wank, Fengji Yeh
  • Patent number: 9770808
    Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: September 26, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Patent number: 9737971
    Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: August 22, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Publication number: 20170209979
    Abstract: A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 27, 2017
    Inventors: Scott Chang, Jeff Tsai, Francis V. Acholla, Andrew Wank, Mark Gazze, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Publication number: 20170197290
    Abstract: A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Publication number: 20170197295
    Abstract: A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Francis V. Acholla, Andrew Wank, Mark Gazze, Scott Chang, Jeff Tsai, William A. Heeschen, James David Tate, Leo H. Chiang, Swee-Teng Chin
  • Patent number: 9586305
    Abstract: A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ?10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: March 7, 2017
    Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLC
    Inventors: Bainian Qian, Julia Kozhukh, Teresa Brugarolas Brufau, David Michael Veneziale, Yuhua Tong, Diego Lugo, Jeffrey B. Miller, George C. Jacob, Marty W. DeGroot, Tony Quan Tran, Marc R. Stack, Andrew Wank, Fengji Yeh
  • Patent number: 9586304
    Abstract: The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material has a Tgel temperature and contains fluid-filled polymeric microspheres. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The preexpanded and unexpanded fluid-filled polymeric microspheres each have a Tstart temperature where diameter of the preexpanded and unexpanded fluid-filled polymeric microspheres increases and a Tmax temperature where gas escapes to decrease diameter of the expanded and unexpanded fluid-filled polymeric microspheres. The cured polyurethane matrix contains preexpanded and expanded fluid-filled polymeric microspheres.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: March 7, 2017
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bainian Qian, Andrew Wank, George C. Jacob
  • Publication number: 20160375553
    Abstract: A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Inventors: David Michael Veneziale, Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, Yuhua Tong, Jeffrey B. Miller, Diego Lugo, George C. Jacob, Marty W. DeGroot, Andrew Wank, Fengji Yeh
  • Publication number: 20160379840
    Abstract: A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of >10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 29, 2016
    Inventors: Bainian Qian, Julia Kozhukh, Teresa Brugarolas Brufau, David Michael Veneziale, Yuhua Tong, Diego Lugo, Jeffrey B. Miller, George C. Jacob, Marty W. DeGroot, Tony Quan Tran, Marc R. Stack, Andrew Wank, Fengji Yeh
  • Publication number: 20160375552
    Abstract: A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, David Michael Veneziale, Yuhua Tong, Diego Lugo, George C. Jacob, Jeffrey B. Miller, Tony Quan Tran, Marc R. Stack, Andrew Wank, Jeffrey James Hendron
  • Publication number: 20160375554
    Abstract: A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 29, 2016
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, David Michael Veneziale, Yuhua Tong, Diego Lugo, George C. Jacob, Jeffrey B. Miller, Tony Quan Tran, Marc R. Stack, Andrew Wank, Jeffrey James Hendron
  • Publication number: 20160375550
    Abstract: The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Inventors: Yuhua Tong, Andrew Wank, Diego Lugo, Marc R. Stack, David Michael Veneziale, Marty W. DeGroot, George C. Jacob, Jeffrey B. Miller