Patents by Inventor Andrew Wank

Andrew Wank has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160375555
    Abstract: A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 5 to 1,000 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 29, 2016
    Inventors: David Michael Veneziale, Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh, Yuhua Tong, Jeffrey B. Miller, Diego Lugo, George C. Jacob, Marty W. DeGroot, Andrew Wank, Fengji Yeh
  • Publication number: 20160375543
    Abstract: A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ?10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Inventors: Bainian Qian, Julia Kozhukh, Teresa Brugarolas Brufau, David Michael Veneziale, Yuhua Tong, Diego Lugo, Jeffrey B. Miller, George C. Jacob, Marty W. DeGroot, Tony Quan Tran, Marc R. Stack, Andrew Wank, Fengji Yeh
  • Publication number: 20160176013
    Abstract: The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material has a Tgel temperature and contains fluid-filled polymeric microspheres. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The preexpanded and unexpanded fluid-filled polymeric microspheres each have a Tstart temperature where diameter of the preexpanded and unexpanded fluid-filled polymeric microspheres increases and a Tmax temperature where gas escapes to decrease diameter of the expanded and unexpanded fluid-filled polymeric microspheres. The cured polyurethane matrix contains preexpanded and expanded fluid-filled polymeric microspheres.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 23, 2016
    Inventors: Bainian Qian, Andrew Wank