Abstract: A display substrate and a method for manufacturing the same, and a display device are provided. The display substrate includes a base substrate, a plurality of sub-pixels and an isolation structure. A light-emitting element of each sub-pixel includes a light emitting functional layer, and a first electrode and a second electrode which are located on two sides of the light emitting functional layer, the first electrode being located between the light emitting functional layer and the base substrate, and the light emitting functional layer including a conductive sub-layer. The isolation structure is located between adjacent sub-pixels, and the conductive sub-layer in the light emitting functional layer is disconnected at the position of the isolation structure. The isolation structure includes a plurality of ring-shaped isolation parts, each of which surrounds one sub-pixel.

Abstract: The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.

Abstract: An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Abstract: A device and a method for manufacturing a thin film are provided. The device includes: a chamber; a substrate carrying member arranged within the chamber and configured to carry thereon a substrate on which the thin film is to be formed; a mask fixation member configured to fix a mask, wherein the mask includes a shielding region and an opening region, and a material for forming the thin film is allowed to pass through the opening region; and a position adjustment member configured to adjust a distance between the mask and the substrate to form the thin films of different sizes on the substrate, wherein orthogonal projections of the thin films of different sizes onto the substrate have different areas.

Abstract: The present disclosure provides an OLED panel, an OLED packaging method, and a display panel. The OLED panel includes a substrate; an OLED element on a surface of the substrate; an inorganic cover layer on the substrate and the OLED element, the inorganic cover layer being configured to cover a peripheral portion of the surface of the substrate; a bonding layer on the inorganic cover layer; and a barrier layer on the bonding layer, wherein a portion of the bonding layer on the peripheral portion includes at least one rib configured to form an airtight space for isolating the OLED element from the external.

Abstract: The present disclosure provides a display assembly, a display device, and a manufacturing process. The display assembly includes: a substrate; a display element arranged in a display region of the substrate; a package film covering the display element; a driving circuit arranged in a non-display region of the substrate; a chip-on-film bonded with the driving circuit; and a support portion arranged in the non-display region of the substrate and outside the package film.

Abstract: Electrochemical cells, and more specifically, release systems for the fabrication of electrochemical cells are described. In particular, release layer arrangements, assemblies, methods and compositions that facilitate the fabrication of electrochemical cell components, such as electrodes, are presented. In some embodiments, methods of fabricating an electrode involve the use of a release layer to separate portions of the electrode from a carrier substrate on which the electrode was fabricated. For example, an intermediate electrode assembly may include, in sequence, an electroactive material layer, a current collector layer, a release layer, and a carrier substrate. The carrier substrate can facilitate handling of the electrode during fabrication and/or assembly, but may be released from the electrode prior to commercial use.

Abstract: An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Abstract: The present disclosure provides a display assembly, a display device, and a manufacturing process. The display assembly includes: a substrate; a display element arranged in a display region of the substrate; a package film covering the display element; a driving circuit arranged in a non-display region of the substrate; a chip-on-film bonded with the driving circuit; and a support portion arranged in the non-display region of the substrate and outside the package film.

Abstract: A device and a method for manufacturing a thin film are provided. The device includes: a chamber; a substrate carrying member arranged within the chamber and configured to carry thereon a substrate on which the thin film is to be formed; a mask fixation member configured to fix a mask, wherein the mask includes a shielding region and an opening region, and a material for forming the thin film is allowed to pass through the opening region; and a position adjustment member configured to adjust a distance between the mask and the substrate to form the thin films of different sizes on the substrate, wherein orthogonal projections of the thin films of different sizes onto the substrate have different areas.

Abstract: An inorganic package film, a manufacturing method thereof, a manufacturing method of an OLED package film, a display panel, and a display device. The manufacturing method includes forming a first inorganic package film on a device to be packaged by a chemical vapor deposition process; and forming a second inorganic package film on the first inorganic package film by an atomic layer deposition process.

Abstract: A manipulator arm includes at least one arm body for carrying a to-be-carried object. The arm body is provided with a suction plate for sucking the to-be-carried object, and the suction plate is provided with a plurality of vacuum suction holes. The plurality of vacuum suction holes are uniformly distributed in the entire suction plate.

Abstract: The present disclosure provides an organic light-emitting diode (OLED) device, comprising at least two electron transport layers between a cathode and a light-emitting layer of the device, wherein energy barrier of different electron transport layers successively increase from the cathode to the light-emitting layer. The present disclosure also provides an evaporation equipment and an OLED device manufacturing method, wherein the electron transport layers of the OLED device are formed by an evaporation process using the evaporation equipment. The OLED device of the present disclosure improves the luminescence efficiency of OLED devices, and the evaporation equipment can readily effect a fast switching between different evaporation rates within a same evaporation chamber.

Abstract: The present disclosure provides an OLED panel, an OLED packaging method, and a display panel. The OLED panel includes a substrate; an OLED element on a surface of the substrate; an inorganic cover layer on the substrate and the OLED element, the inorganic cover layer being configured to cover a peripheral portion of the surface of the substrate; a bonding layer on the inorganic cover layer; and a barrier layer on the bonding layer, wherein a portion of the bonding layer on the peripheral portion includes at least one rib configured to form an airtight space for isolating the OLED element from the external.

Abstract: The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.

Abstract: Embodiments of the present disclosure provide a conference sound box, a conference recording method, apparatus, system, and a computer storage medium. The conference recording method may include: receiving conference audio data copied by the conference sound box; sending the conference audio data to a voice-to-text server for text conversion; and receiving texts from the voice-to-text server. In this way, the conference sound box, the conference recording method, apparatus, system, and the computer storage medium according to the embodiments of the present disclosure could conveniently realize text conversion of conference voices and automatic conference recording, thereby improving work efficiency and reducing resource waste.

Abstract: An organic light emission display device and an encapsulation method therefor are provided. The organic light emission display device includes a base substrate, and an organic light emission diode, a barrier layer and an organic thin film encapsulation layer which are disposed on the base substrate. The organic light emission display device further includes a detection layer disposed on the base substrate; and the detection layer is configured to contact with the organic thin film encapsulation layer and make a change in the case that the organic thin film encapsulation layer overflows the barrier layer.

Abstract: A sealing method of display panel, comprising: forming closed inner sealant layer in a sealing region of a first substrate; forming outer sealant layer which encloses the inner sealant layer, in which a communicating region is provided, the communicating region is configured to communicate a region between the inner sealant layer and the outer sealant layer and a region outside the outer sealant layer; affixing a second substrate to the first substrate in position to form a motherboard; and sealing the communicating region after cutting out the display panel from the motherboard. A display panel and a display device are also disclosed.