Patents by Inventor Anindya Dasgupta
Anindya Dasgupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955532Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.Type: GrantFiled: October 26, 2020Date of Patent: April 9, 2024Assignee: Intel CorporationInventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
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Patent number: 11857655Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and a nonionic triblock copolymer. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one a nonionic triblock copolymer. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.Type: GrantFiled: November 25, 2019Date of Patent: January 2, 2024Assignee: Conopco. Inc.Inventors: Shanthi Appavoo, Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
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Publication number: 20230329989Abstract: The present invention relates to a personal care composition for protection of skin against undesirable bacteria. The present invention is especially useful in formulating compositions which ensure growth of skin commensal bacteria like S. epidermidis while inhibiting growth of harmful bacteria like E. coli, S. aureus among others. The present invention which comprises a mixture of very select amino acids thus provides for microbiome balancing on the skin.Type: ApplicationFiled: September 26, 2021Publication date: October 19, 2023Applicant: Conopco, Inc., d/b/a UNILEVERInventors: Anindya DASGUPTA, Prathyusha MALLEMALA, Morris WASKAR
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Publication number: 20230255868Abstract: The invention is directed to a sanitizing composition that comprises at least 80% by weight water, and a cationic surfactant. The composition provides superior antimicrobial benefits while simultaneously delivering excellent antiviral activity after being topically applied and even when formulated with little to no ethanol.Type: ApplicationFiled: June 28, 2021Publication date: August 17, 2023Applicant: Conopco, Inc., d/b/a UNILEVERInventors: Anindya DASGUPTA, Suzanne Lynn GENCARELLI, Jessica Ann KRISIAK, Maya Treesa SAJI, Neha SALGAONKAR, Vivek SUBRAMANIAN, Leonora H. YOKUBINAS
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Publication number: 20230149274Abstract: The present invention relates to an antimicrobial composition, more particularly to a method and a composition to prevent or treat malodour, especially body malodor. This is achieved through a composition that comprises alkyl substituted dihydroxy benzene in combination with thymol or terpineol. The composition is also seen to have anti-acne benefits.Type: ApplicationFiled: June 3, 2021Publication date: May 18, 2023Applicant: Conopco, Inc., d/b/a UNILEVERInventors: Anindya DASGUPTA, Maya Treesa SAJI, Neha SALGAONKAR
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Patent number: 11342445Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.Type: GrantFiled: July 1, 2020Date of Patent: May 24, 2022Assignee: Intel CorporationInventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
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Publication number: 20220062119Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and biphenol. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one biphenol compound. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.Type: ApplicationFiled: November 26, 2019Publication date: March 3, 2022Inventors: Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
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Publication number: 20220040066Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and a nonionic triblock copolymer. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one a nonionic triblock copolymer. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.Type: ApplicationFiled: November 25, 2019Publication date: February 10, 2022Inventors: Shanthi Appavoo, Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
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Publication number: 20210386835Abstract: The present invention relates to a method and a composition to prevent or treat acne by selective inhibition of P. acnes bacteria. The method comprises treating skin with P. acnes phage-derived endolysins and nucleic acid molecules encoding the same C in combination with selective essential oils.Type: ApplicationFiled: November 8, 2019Publication date: December 16, 2021Applicant: CONOPCO, INC., D/B/A UNILEVERInventors: Sayandip MUKHERJEE, Sandip Bhanudas PATHAK, Anindya DASGUPTA
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Publication number: 20210169758Abstract: The present invention relates to an antimicrobial composition. The present invention provides an antimicrobial composition comprising at least one biphenol and monohydric non-phenolic alcohol in certain amounts. The antimicrobial composition provides synergistic antimicrobial benefit, particularly synergistic antiviral benefit.Type: ApplicationFiled: December 13, 2018Publication date: June 10, 2021Applicant: Conopco, Inc., d/b/a UNILEVERInventors: Anindya DASGUPTA, Nivedita Jagdish PATIL, Maya Treesa SAJI, Morris WASKAR
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Publication number: 20210043754Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.Type: ApplicationFiled: October 26, 2020Publication date: February 11, 2021Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
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Patent number: 10854732Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.Type: GrantFiled: June 22, 2020Date of Patent: December 1, 2020Assignee: Intel CorporationInventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
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Publication number: 20200335603Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.Type: ApplicationFiled: July 1, 2020Publication date: October 22, 2020Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
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Publication number: 20200330408Abstract: The present invention relates to an antimicrobial composition. The present invention provides an antimicrobial composition comprising at least one biphenol; and at least one antimicrobial quaternary ammonium compound, wherein the biphenol is a diallylbiphenol.Type: ApplicationFiled: December 17, 2018Publication date: October 22, 2020Applicant: Conopco, Inc., d/b/a UNILEVERInventors: Shanthi APPAVOO, Anindya DASGUPTA, Srilaxmi Venkata MEDEPALLI, Rohini Sukumaran NAIR, Maya Treesa SAJI, Morris WASKAR
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Publication number: 20200323903Abstract: The present disclosure is generally related to methods for combining chemotherapy and immunotherapy for the treatment of a cancer.Type: ApplicationFiled: December 9, 2019Publication date: October 15, 2020Applicants: Emory University, The UAB Research Foundation, Children's Healthcare of Atlanta, Inc.Inventors: Harold Trent Spencer, Anindya Dasgupta, Lawrence S. Lamb
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Publication number: 20200321449Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.Type: ApplicationFiled: June 22, 2020Publication date: October 8, 2020Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
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Patent number: 10741669Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.Type: GrantFiled: December 30, 2017Date of Patent: August 11, 2020Assignee: Intel CorporationInventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
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Patent number: 10727313Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.Type: GrantFiled: December 30, 2017Date of Patent: July 28, 2020Assignee: Intel CorporationInventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
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Patent number: 10653597Abstract: The present invention relates to an antimicrobial composition and more particularly an antimicrobial composition for leave-on applications. The present invention discloses an antimicrobial composition comprising; a) 0.01 to 2% by weight of thymol; b) 0.01 to 2% by weight of terpineol; and c) 0.1 to 2% by weight of a cationic phospholipid complex.Type: GrantFiled: March 30, 2017Date of Patent: May 19, 2020Assignee: CONOPCO, INC.Inventors: Anindya Dasgupta, Qiong Gu, Kevin David Hermanson, Teanoosh Moaddel, Neha Salgaonkar, Bo Shen, Qiang Qiu
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Patent number: 10543233Abstract: The present disclosure is generally related to methods for combining chemotherapy and immunotherapy for the treatment of a cancer. The methods also relate to generating a drug-resistant cytotoxic immune cell line and uses thereof in conjunction with cytotoxic drugs.Type: GrantFiled: February 22, 2019Date of Patent: January 28, 2020Assignees: Emory University, The UAB Research Foundation, Children's Healthcare of Atlanta, Inc.Inventors: Harold Trent Spencer, Anindya Dasgupta, Lawrence S. Lamb