Patents by Inventor Anindya Dasgupta

Anindya Dasgupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955532
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
  • Patent number: 11857655
    Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and a nonionic triblock copolymer. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one a nonionic triblock copolymer. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: January 2, 2024
    Assignee: Conopco. Inc.
    Inventors: Shanthi Appavoo, Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
  • Publication number: 20230329989
    Abstract: The present invention relates to a personal care composition for protection of skin against undesirable bacteria. The present invention is especially useful in formulating compositions which ensure growth of skin commensal bacteria like S. epidermidis while inhibiting growth of harmful bacteria like E. coli, S. aureus among others. The present invention which comprises a mixture of very select amino acids thus provides for microbiome balancing on the skin.
    Type: Application
    Filed: September 26, 2021
    Publication date: October 19, 2023
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Anindya DASGUPTA, Prathyusha MALLEMALA, Morris WASKAR
  • Publication number: 20230255868
    Abstract: The invention is directed to a sanitizing composition that comprises at least 80% by weight water, and a cationic surfactant. The composition provides superior antimicrobial benefits while simultaneously delivering excellent antiviral activity after being topically applied and even when formulated with little to no ethanol.
    Type: Application
    Filed: June 28, 2021
    Publication date: August 17, 2023
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Anindya DASGUPTA, Suzanne Lynn GENCARELLI, Jessica Ann KRISIAK, Maya Treesa SAJI, Neha SALGAONKAR, Vivek SUBRAMANIAN, Leonora H. YOKUBINAS
  • Publication number: 20230149274
    Abstract: The present invention relates to an antimicrobial composition, more particularly to a method and a composition to prevent or treat malodour, especially body malodor. This is achieved through a composition that comprises alkyl substituted dihydroxy benzene in combination with thymol or terpineol. The composition is also seen to have anti-acne benefits.
    Type: Application
    Filed: June 3, 2021
    Publication date: May 18, 2023
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Anindya DASGUPTA, Maya Treesa SAJI, Neha SALGAONKAR
  • Patent number: 11342445
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: May 24, 2022
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
  • Publication number: 20220062119
    Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and biphenol. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one biphenol compound. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 3, 2022
    Inventors: Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
  • Publication number: 20220040066
    Abstract: The present invention is in the field of antimicrobial compositions, e.g. for personal care. In particular, the invention relates to antimicrobial compositions for oral care, such as toothpastes, comprising antimicrobial particles and a nonionic triblock copolymer. Accordingly, the present invention relates to antimicrobial compositions comprising a modified clay particle, the particle comprising an antimicrobial compound and a clay particle, and at least one a nonionic triblock copolymer. The invention further relates to the uses and methods of the antimicrobial compositions of the invention.
    Type: Application
    Filed: November 25, 2019
    Publication date: February 10, 2022
    Inventors: Shanthi Appavoo, Anindya Dasgupta, Srikala Kumaran, Maya Treesa Saji
  • Publication number: 20210386835
    Abstract: The present invention relates to a method and a composition to prevent or treat acne by selective inhibition of P. acnes bacteria. The method comprises treating skin with P. acnes phage-derived endolysins and nucleic acid molecules encoding the same C in combination with selective essential oils.
    Type: Application
    Filed: November 8, 2019
    Publication date: December 16, 2021
    Applicant: CONOPCO, INC., D/B/A UNILEVER
    Inventors: Sayandip MUKHERJEE, Sandip Bhanudas PATHAK, Anindya DASGUPTA
  • Publication number: 20210169758
    Abstract: The present invention relates to an antimicrobial composition. The present invention provides an antimicrobial composition comprising at least one biphenol and monohydric non-phenolic alcohol in certain amounts. The antimicrobial composition provides synergistic antimicrobial benefit, particularly synergistic antiviral benefit.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 10, 2021
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Anindya DASGUPTA, Nivedita Jagdish PATIL, Maya Treesa SAJI, Morris WASKAR
  • Publication number: 20210043754
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.
    Type: Application
    Filed: October 26, 2020
    Publication date: February 11, 2021
    Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
  • Patent number: 10854732
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: December 1, 2020
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
  • Publication number: 20200335603
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 22, 2020
    Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
  • Publication number: 20200330408
    Abstract: The present invention relates to an antimicrobial composition. The present invention provides an antimicrobial composition comprising at least one biphenol; and at least one antimicrobial quaternary ammonium compound, wherein the biphenol is a diallylbiphenol.
    Type: Application
    Filed: December 17, 2018
    Publication date: October 22, 2020
    Applicant: Conopco, Inc., d/b/a UNILEVER
    Inventors: Shanthi APPAVOO, Anindya DASGUPTA, Srilaxmi Venkata MEDEPALLI, Rohini Sukumaran NAIR, Maya Treesa SAJI, Morris WASKAR
  • Publication number: 20200323903
    Abstract: The present disclosure is generally related to methods for combining chemotherapy and immunotherapy for the treatment of a cancer.
    Type: Application
    Filed: December 9, 2019
    Publication date: October 15, 2020
    Applicants: Emory University, The UAB Research Foundation, Children's Healthcare of Atlanta, Inc.
    Inventors: Harold Trent Spencer, Anindya Dasgupta, Lawrence S. Lamb
  • Publication number: 20200321449
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Jeffrey S. LEIB, Jenny HU, Anindya DASGUPTA, Michael L. HATTENDORF, Christopher P. AUTH
  • Patent number: 10741669
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: August 11, 2020
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
  • Patent number: 10727313
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: July 28, 2020
    Assignee: Intel Corporation
    Inventors: Jeffrey S. Leib, Jenny Hu, Anindya Dasgupta, Michael L. Hattendorf, Christopher P. Auth
  • Patent number: 10653597
    Abstract: The present invention relates to an antimicrobial composition and more particularly an antimicrobial composition for leave-on applications. The present invention discloses an antimicrobial composition comprising; a) 0.01 to 2% by weight of thymol; b) 0.01 to 2% by weight of terpineol; and c) 0.1 to 2% by weight of a cationic phospholipid complex.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: May 19, 2020
    Assignee: CONOPCO, INC.
    Inventors: Anindya Dasgupta, Qiong Gu, Kevin David Hermanson, Teanoosh Moaddel, Neha Salgaonkar, Bo Shen, Qiang Qiu
  • Patent number: 10543233
    Abstract: The present disclosure is generally related to methods for combining chemotherapy and immunotherapy for the treatment of a cancer. The methods also relate to generating a drug-resistant cytotoxic immune cell line and uses thereof in conjunction with cytotoxic drugs.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: January 28, 2020
    Assignees: Emory University, The UAB Research Foundation, Children's Healthcare of Atlanta, Inc.
    Inventors: Harold Trent Spencer, Anindya Dasgupta, Lawrence S. Lamb