Abstract: Apparatus, systems and methods for characteristics of glass components through use of one or more coatings are disclosed. The coatings are typically thin coatings, such as thin film coatings. The coatings can serve to increase strength of the glass components and/or provide durable user interfacing surfaces. Accordingly, glass articles that have received coatings are able to be not only thin but also sufficiently strong so as to resist damage from impact events. The coated glass articles are well suited for use in consumer products, such as consumer electronic devices (e.g., electronic devices).

Abstract: Embodiments of the present disclosure provide a circuit board in which the need for board-to-board connectors is substantially reduced or eliminated. Specifically embodiments disclosed herein describe a flexible substrate for use with a computing device. A first module is surface mounted on a first side of the flexible substrate and a second module is surface mounted on a second side of the flexible substrate. A rigid circuit board is coupled to either the first side of the flexible substrate or the second side of the flexible substrate. Further, the flexible substrate is bendable such that at least one of the first module and the second module are positionable with respect to the rigid circuit board and with respect to the other of the first module and the second module.

Abstract: An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures.

Abstract: A housing for a personal electronic device includes a first housing portion, a second housing portion, and a pivoting member pivotally attached to the second housing portion. The first housing portion defines a first plane and has a first support member arranged thereon at a first angle to the first plane. The first support member includes at least one through hole for engaging a fastener. The second housing portion defines a second plane and has a second support member arranged thereon at a second angle to the second plane. The second support member includes at least one retaining hole configured to align with the at least one through hole and retain the fastener. The pivoting member is configured to pivot between at least two positions to obscure the fastener.

Abstract: An electronic device may have a housing, electrical components, and other electronic device structures. A display may be mounted in the housing. The display may have a transparent display cover layer and a display layer such as an organic light-emitting diode display layer that is mounted to the underside of the transparent display cover layer. A flexible printed circuit with metal traces may be mounted under the organic light-emitting diode display layer. The metal traces may form coils for a near-field communications inductive loop antenna. A magnetic shielding layer may be interposed between the housing and the flexible printed circuit. The magnetic shielding layer may include a polymer magnetic shielding layer having magnetic material particles embedded in a polymer matrix. The magnetic shielding layer may also have a polymer-binder-free magnetic shielding layer.

Abstract: Flexible printed circuit structures may be provided that have regions with different electrical and mechanical properties. A flexible printed circuit substrate may be formed from a sheet of polymer having different regions with different thicknesses. The flexible printed circuit substrate may be bent in a thin region of the substrate. Additional flexible printed circuit substrate portions may be coupled to the flexible printed circuit substrate. The additional portions may have different substrate thicknesses. A groove or other recess may be formed in a flexible printed circuit substrate to promote bending. Openings may also be formed in the substrate to promote bending.

Abstract: An electronic device is provided, with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated, light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer.

Abstract: Embodiments of the present disclosure provide a method for creating a connection mechanism for a circuit board. The method includes securing a plurality of electrical conductors to a sleeve. Once the electrical conductors have been coupled to the sleeve, the sleeve and the plurality of conductors are coupled to, and molded with, the circuit board. At least one side of the circuit board, such as, for example, the molding over the plurality of electrical conductors, is subsequently reduced to expose at least a portion of at least one of the plurality of electrical conductors. An electrical connector is then coupled to the at least the portion of the one or more of the plurality of electrical conductors that was exposed when the first side of the printed circuit board was reduced.

Abstract: An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

Abstract: In a first embodiment, an elastomeric connector may include conductive and nonconductive portions and a guide that at least partially surrounds the connector and transfers compression in at least two directions. In a second embodiment, an elastomeric connector includes conductive portions at least partially surrounded by a nonconductive portion that is at least partially surrounded by conductive material connectible to ground to shield. In a third embodiment, an elastomeric connector may include multiple conductive portions and a nonconductive portion. One of the conductive portions may be separated from a first other in a cross section of a first connection surface and a second one of the others outside the cross section. At least one of the conductive portions may be connected to at least one of the others within the connector. In a fourth embodiment, a sealing component may include conductive and nonconductive elastomeric material.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame.

Abstract: A waterproof button assembly. The waterproof button assembly may include a housing including an opening and a button. The button may be positioned at least partially within the housing via the opening. The assembly may also include a plurality of engagement components positioned on opposite-distal ends of the button. The plurality of engagement components may be configured to retain the button within the housing. The engagement components may extend distally from the button, such that a portion of the engagement components may be positioned within apertures formed in the sidewall of the housing. The assembly may also include a plurality of supports, a tactile dome in contact with the button and at least one of the plurality of supports. A sensing component of the assembly may be positioned adjacent the housing and in alignment with the button and/or tactile dome for sensing actuation of the button within the assembly.

Abstract: Systems and methods for providing input component assemblies with anti-rotational buttons in electronic devices are provided. The input component assembly includes a switch, a button positioned over the switch, where the button is operative to close at least one circuit of the switch when the button is depressed towards the switch, and at least one pin positioned underneath the button, where the at least one pin is operative to engage with a surface to assist in preventing rotation of the button, when the button is depressed towards the switch.

Abstract: Systems and methods for routing cables in an electronic device are provided. In some embodiments, the electronic device may include a touch sensor having a number of traces, a display component, and a mechanical button, each of which may be coupled to a circuit board via a single flexible circuit cable. This may save valuable space within the electronic device.

Abstract: An electronic device is provided with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer.

Abstract: A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

Abstract: A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold material. The modularized printed circuit board may also include a feature formed from the overmold material.

Abstract: Apparatus, systems and methods for shock mounting glass for an electronic device are disclosed. The glass for the electronic device can provide an outer surface for at least a portion of a housing for the electronic device. In one embodiment, the shock mounting can provide a compliant interface between the glass and the electronic device housing. In another embodiment, the shock mounting can provide a mechanically actuated retractable. For example, an outer glass member for an electronic device housing can be referred to as cover glass, which is often provided at a front surface of the electronic device housing.