Abstract: An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.

Abstract: Micro light-emitting diodes (LED) are distanced from a mirror layer that reflects light emitted by the LEDs to increase the light extraction efficiency of the LEDs. In some embodiments, micro LEDs are electrically coupled to the mirror layer by vias positioned at an end of the LED positioned proximate to the mirror layer. In other embodiments, a conductive layer is positioned adjacent to an electrode of multiple micro LEDs and a pillar contacts the conductive layer at a location where the conductive layer is not positioned adjacent to a micro LED electrode. Vias and pillars allow the mirror height to be increased relative to structures where micro LEDs extend into a mirror layer. Increasing the mirror height can reduce the amount of destructive interference at a release layer caused by reflections of LED-emitted light by the mirror layer when the release layer is ablated via laser irradiation.

Abstract: Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesive layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

Abstract: Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.

Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material. The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.

Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.

Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material. The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.

Abstract: Aspects of the embodiments are directed to an optical component with at least one substantially flat surface. The flat surface can be used as a surface onto which a pick and place tool can contact the optical component for assembly. The optical component can be formed from a mold that includes an insertable pin. For example, the mold can include a three-piece mold: a core and a cavity can be brought together to define a negative space conforming to a shape of the optical component. The core and the cavity, when brought together, also define an opening. The opening can have a shape that conforms to a desired cross-sectional shape of the flat surface of the optical component. An insertable pin, with a substantially flat end surface, can be inserted through the opening during the mold process to form the substantially flat surface.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

Abstract: An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.