Patents by Inventor Anshuman Thakur

Anshuman Thakur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11657781
    Abstract: Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: May 23, 2023
    Assignee: INTEL CORPORATION
    Inventors: Anshuman Thakur, DongHo Hong, Karthik Veeramani, Arvind Tomar, Brent Insko, Atsuo Kuwahara, Zhengmin Li
  • Publication number: 20220114125
    Abstract: A processor having a system on a chip (SOC) architecture comprises one or more central processing units (CPUs) comprising multiple cores. An optical Compute Express Link (CXL) communication path incorporating a logical optical CXL protocol stack path transmits and receives an optical bit stream directly after the link layer, bypassing multiple levels of the CXL protocol stack. A CXL interface controller is connected to the one or more CPUs to enable communication between the CPUs and one or more CXL devices over the optical CXL communication path.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 14, 2022
    Inventors: Anshuman THAKUR, Dheeraj SUBBAREDDY, MD Altaf HOSSAIN, Ankireddy NALAMALPU, Mahesh KUMASHIKAR
  • Publication number: 20220114121
    Abstract: A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 14, 2022
    Inventors: Anshuman THAKUR, Dheeraj SUBAREDDY, MD Altaf HOSSAIN, Ankireddy NALAMALPU, Mahesh KUMASHIKAR, Sandeep SANE
  • Publication number: 20220100692
    Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventors: Dheeraj SUBBAREDDY, Ankireddy NALAMALPU, Anshuman THAKUR, MD Altaf HOSSAIN, Mahesh KUMASHIKAR, Kemal AYGÜN, Casey THIELEN, Daniel KLOWDEN, Sandeep B. SANE
  • Publication number: 20220094434
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to characterizing data being transferred from one device to another via an optical link based upon the wavelengths within the optical link on which the data is being carried. In embodiments, the characteristics of this data may include quality of service for the data to be implemented by a field programmable gate array within a heterogeneous storage pool coupled with storage devices, where the quality of service includes minimum threshold values for bandwidth and latency. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 24, 2022
    Inventors: Dheeraj SUBBAREDDY, Anshuman THAKUR, Ankireddy NALAMALPU, MD Altaf HOSSAIN
  • Publication number: 20220092016
    Abstract: Embodiments herein relate to systems, apparatuses, or techniques for using an optical physical layer die within a system-on-a-chip to optically couple with an optical physical layer die on another package to provide high-bandwidth memory access between the system-on-a-chip and the other package. In embodiments, the other package may be a large optically connected memory device that includes a memory controller coupled with an optical physical layer die, where the memory controller is coupled with memory. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 24, 2022
    Inventors: Mahesh K. KUMASHIKAR, Dheeraj SUBBAREDDY, Anshuman THAKUR, MD Altaf HOSSAIN, Ankireddy NALAMALPU, Casey G. THIELEN, Daniel S. KLOWDEN, Kevin P. MA, Sergey Yuryevich SHUMARAYEV, Sandeep SANE, Conor O'KEEFFE
  • Publication number: 20220044123
    Abstract: Processors may be enhanced by embedding programmable logic devices, such as field-programmable gate arrays. For instance, an application-specific integrated circuit device may include main fixed function circuitry operable to perform a main fixed function of the application-specific integrated circuit device. The application-specific integrated circuit also includes a support processor that performs operations outside of the main fixed function of the application-specific integrated circuit device, wherein the support processor comprises an embedded programmable fabric to provide programmable flexibility to application-specific integrated circuit device.
    Type: Application
    Filed: September 24, 2021
    Publication date: February 10, 2022
    Inventors: Rajesh Vivekanandham, Dheeraj Subbareddy, Dheemanth Nagaraj, Vijay S. R. Degalahal, Anshuman Thakur, Ankireddy Nalamalpu, MD Altaf Hossain, Mahesh Kumashikar, Atul Maheshwari
  • Publication number: 20220011811
    Abstract: A semiconductor device may include a programmable fabric and a processor. The processor may utilize one or more extension architectures. At least one of these extension architectures may be used to integrate and/or embed the programmable fabric into the processor as part of the processor. Systems and methods for transitioning data between the programmable fabric and the processor associated with different clock domains is described.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Dheeraj Subbareddy, Anshuman Thakur, Atul Maheshwari, Mahesh Kumashikar, MD Altaf Hossain, Ankireddy Nalamalpu
  • Publication number: 20220014202
    Abstract: The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Rahul Pal, Dheeraj Subbareddy, Mahesh Kumashikar, Dheemanth Nagaraj, Rajesh Vivekanandham, Anshuman Thakur, Ankireddy Nalamalpu, MD Altaf Hossain, Atul Maheshwari
  • Publication number: 20210326135
    Abstract: A semiconductor device may include a programmable fabric and a processor. The processor may utilize one or more extension architectures. At least one of these extension architectures may be used to integrate and/or embed the programmable fabric into the processor as part of the processor. Specifically, a buffer of the extension architecture may be used to load data to and store data from the programmable fabric.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 21, 2021
    Inventors: Dheeraj Subbareddy, Anshuman Thakur, Ankireddy Nalamalpu, MD Altaf Hossain
  • Publication number: 20210256934
    Abstract: Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.
    Type: Application
    Filed: March 1, 2019
    Publication date: August 19, 2021
    Inventors: Anshuman Thakur, DongHo Hong, Karthik Veeramani, Arvind Tomar, Brent Insko, Atsuo Kuwahara, Zhengmin Li
  • Patent number: 10388255
    Abstract: Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: August 20, 2019
    Assignee: INTEL CORPORATION
    Inventors: Anshuman Thakur, DongHo Hong, Karthik Veeramani, Arvind Tomar, Brent Insko, Atsuo Kuwahara, Zhengmin Li
  • Publication number: 20190043448
    Abstract: Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.
    Type: Application
    Filed: June 29, 2018
    Publication date: February 7, 2019
    Inventors: Anshuman Thakur, DongHo Hong, Karthik Veeramani, Arvind Tomar, Brent Insko, Atsuo Kuwahara, Zhengmin Li
  • Patent number: 10015117
    Abstract: In one embodiment, a method is provided. The method of this embodiment provides storing a packet header at a set of at least one page of memory allocated to storing packet headers, and storing the packet header and a packet payload at a location not in the set of at least one page of memory allocated to storing packet headers.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: July 3, 2018
    Assignee: Intel Corporation
    Inventors: Linden Cornett, David B. Minturn, Sujoy Sen, Hemal V. Shah, Anshuman Thakur, Gary Tsao, Anil Vasudevan
  • Publication number: 20180159803
    Abstract: In one embodiment, a method is provided. The method of this embodiment provides storing a packet header at a set of at least one page of memory allocated to storing packet headers, and storing the packet header and a packet payload at a location not in the set of at least one page of memory allocated to storing packet headers.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Applicant: Intel Corporation
    Inventors: Linden Cornett, David B. Minturn, Sujoy Sen, Hemal V. Shah, Anshuman Thakur, Gary Y. Tsao, Anil Vasudevan
  • Patent number: 9658861
    Abstract: Following a restart or a reboot of a system that includes a multi-core processor, the multi-core processor may assign one of the cores as a boot strap processor (BSP). Initialization logic may detect a state of each of the plurality of processing cores as active or inactive. The initialization logic may detect an attribute of each of the plurality of processing cores as eligible to be assigned as a BSP or as ineligible to be assigned as the BSP. The initialization logic may detect a last processing core of the plurality of processing cores in the interconnect that is an active processing core based at least in part on the state and is eligible to be assigned as the BSP based at least in part on the attribute. In various embodiments, the initialization information may assign the last processing core as the BSP.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: May 23, 2017
    Assignee: Intel Corporation
    Inventors: Steven S. Chang, Anshuman Thakur, Ramacharan Sundararaman, Ramon Matas, Jay S. Lawlor, Robert F. Netting
  • Patent number: 9602443
    Abstract: In one embodiment, a method is provided. The method of this embodiment provides storing a packet header at a set of at least one page of memory allocated to storing packet headers, and storing the packet header and a packet payload at a location not in the set of at least one page of memory allocated to storing packet headers.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: March 21, 2017
    Assignee: Intel Corporation
    Inventors: Linden Cornett, David B. Minturn, Sujoy Sen, Hemal V. Shah, Anshuman Thakur, Gary Tsao, Anil Vasudevan
  • Patent number: 9389657
    Abstract: An initialization core may include reset logic that may detect a global reset signal (GRS). The initialization core may generate one or more packets that enable communication with the cores. The initialization core may send reset packets to each of the cores that instruct the cores to perform a reset. In some embodiments, the reset command may power-off the cores. The initialization core may then transmit unreset packets to each of the cores that instruct the cores to perform an unreset and power-on the cores. In some embodiments, the cores may resume operation automatically without receipt of the unreset packet. The transmission of the packets may be staggered (staged) to control the power-on of the processor and enable the processor unit to more slowly increase its power state.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: July 12, 2016
    Assignee: Intel Corporation
    Inventors: Steven S. Chang, Anshuman Thakur, Ramacharan Sundararaman, Ramon Matas
  • Patent number: 9372816
    Abstract: Following a restart or a reboot of a system that includes a multi-core processor, the multi-core processor may assign each active and eligible core a unique advanced programmable interrupt controller (APIC) identifier (ID). Initialization logic may detect a state of each of the plurality of processing cores as active or inactive. The initialization logic may detect an attribute of each of the plurality of processing cores as eligible to be assigned an APIC ID or as ineligible to be assigned the APIC ID.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: June 21, 2016
    Assignee: Intel Corporation
    Inventors: Steven S. Chang, Anshuman Thakur, Ramacharan Sundararaman, Ramon Matas, Jay S. Lawlor, Robert F. Netting
  • Patent number: 9367329
    Abstract: This disclosure is directed to use of shared initialization and configuration vectors, which are delivered to processing cores in a multi-core processor using packets. An initialization core may include reset logic that may read initialization and configuration vectors from a centralized storage location, which may be on a die containing the processing cores (e.g., a fuse, etc.), off the die (e.g., in volatile memory, flash memory, etc.), or a combination of both. The initialization core may then generate packets to transmit the initialization and configuration vectors to processing cores that await initialization (e.g., following a reset). In some instances, the initialization and configuration vector information may be shared by two or more cores of a same type.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: June 14, 2016
    Assignee: Intel Corporation
    Inventors: Steven S. Chang, Anshuman Thakur, Ramacharan Charan Sundararaman, Ramon Matas