Abstract: Disclosed is a manipulator for removing a cassette holding articles, such as semiconductor wafers, to be processed from a container supported on a processing station in a standard mechanical interface (SMIF) system. The container is supported on an interface port on the canopy of the processing station and has a removeable door on which the cassette is supportable. A first platform is transportable along a shaft below the interface port and is operable to mate with the interface port and receive the cassette from the container. The first platform is transported down the shaft, thereby removing the cassette from the container. A second platform mounted in the shaft includes a manipulator arm which swings to engage the cassette on the first platform and support the cassette off of the first platform. The manipulator arm then pivots to transport the cassette to a location in the processing station away from the shaft.

Abstract: Disclosed is a manipulator for removing a cassette holding articles, such as semiconductor wafers, to be processed from a container supported on a processing station in a standard mechanical interface (SMIF) system. The container is supported on an interface port on the canopy of the processing station. A first platform is transportable along a shaft below the interface port. The platform is operable to mate with the interface port and receive the cassette from the container. The first platform is transported down the shaft, thereby removing the cassette from the container. An arm orthogonal to the shaft and mounted in the shaft supports a pivoting arm which swings to engage the cassette on the first platform and support the cassette off of the first platform. The pivoting arm pivots to transport the cassette to a location away from the shaft. The first platform is then transported back up the shaft to the interface port to seal the container to prevent particulate contamination.

Abstract: Infrared radiation is focused to a line at a site at which a semiconductor wafer is expected to appear when a wafer is transferred with, i.e., loaded onto or unloaded from, a semiconductor wafer conveyor. A cylindrical lens of selected focal length is positioned to receive and focus to a line at an image plane radiation reflected by a wafer arriving at the site. An apertured stop defines an opening at the image plane to pass reflected radiation to an infrared sensor positioned on the side of the stop opposite the cylindrical lens.

Abstract: Several embodiments of a replenishment arrangement for furnishing molten semiconductor material to furnaces for growing monocrystalline boules are described. A replenishment crucible within which a melt of the material from which the boules are to be grown is communicated either intermittently or continuously with a plurality of growth furnaces.

Abstract: A carrier for semiconductor wafers to be polished is described, as well as mounting structure for securing the carrier within a polishing machine. The carrier is a relatively thick metal plate having on one of its faces, a sheet of material to which wafers can be adhered. An annular flange is on its opposite face to receive pressure loading from the polishing machine during the wafer polishing operation. Radially extending webs connect the annular flange with that area of the plate to distribute the pressure loading over substantially the full area of the plate opposed to the area on the opposite face on which wafers are to be adhered. An arrangement is included in the holder of the polishing machine for the carrier which applies a vacuum to the carrier to maintain the carrier selectively on the polishing machine, which arrangement releases the vacuum during the polishing operation and also enables simple intentional removal of the carrier.

Abstract: Semiconductor wafer polishing apparatus is described having a sheet of wafer mounting material on its carrier to rigidly hold a plurality of wafers to be polished during the polishing operation. The mounting material includes a lamina of a polymeric material which exhibits surface wetting characteristics to aid in adhering the back side of wafers thereto and a lamina of a volume compressible material which absorbs without wafer deformation any asperities on the back side of such wafers.

Abstract: Apparatus for mounting a battery on an electrically powered vehicle, as for example a bicycle, including a bracket slidably mounted on the vehicle frame upon which in turn are mounted one of the sprockets of a belt drive system and the battery, the weight of the battery urging the sprocket to tension the belt. The battery is mounted on the bracket by a hinge packed with a compressible resilient material to permit damped rotation of the battery about a transverse axis while dampingly constraining all other movement of the battery. The bracket is further provided with pad means having resilient frictional surfaces to absorb impact of the battery against the bracket and damp transverse movement of the battery.

Abstract: A kickstand for supporting a parked two-wheeled vehicle and a footrest for supporting the feet of the vehicle operator when the vehicle is in motion is provided by a single device comprising a lever pivoted about an axis parallel to the longitudinal axis of the vehicle on a horizontal beam rigidly affixed to the vehicle frame. The center of gravity of the lever portion is located relative to the pivot axis so that the lever portion is stable both when pivoted to contact the ground for vehicle support and when pivoted to a position parallel to the beam to act as a footrest.

Abstract: In the Czochralsky method of crystal growing, a crystal or ingot is pulled from a melt. The control of the present invention will find particular application in the Czochralsky pulling of large crystals such as those of silicon which typically are 40 inches long and 3 inches in diameter. The control assures a uniform diameter over the entire length of the crystal as well as avoids the formation of "flats" on the surface of the crystal. This is achieved by optically sighting the crystal melt interface and adjusting the sighting for variations in melt level.