Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.

Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.

Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.

Abstract: A method of forming a nano-structured substrate is provided, the method comprising including forming non-integral nano-pillars on a substrate surface and directionally etching the substrate surface using the non-integral nano-pillars as a mask to form integral nano-structures in the substrate.

Abstract: In one example implementation, a printhead die includes a SiO2 layer grown into a surface of a silicon substrate, a dielectric layer formed on the surface over an interior area of the substrate, a first termination ring surrounding the interior area and defined by an absence of the dielectric layer, a berm surrounding the first termination ring and defined by the presence of the dielectric layer, a damage detection conductor formed under the berm on the SiO2 layer, and a second termination ring surrounding the berm and defined by an absence of the dielectric layer.

Abstract: A method of depositing nano-dots on a substrate includes forming a template on the base, the template defining nano-pores, at least partially filling the nano-pores with a pillar material to define nano-pillars, depositing a dot material on the nano-pillars to define nano-dots on the nano-pillars, and contact printing the substrate with the array of nano-dots.

Abstract: Formation of an article having capped nano-pillars is provided for herein, the article including a substrate with a nano-structure array formed thereon, the nano-structure array including a plurality of nano-pillars having stem portions of a first thickness and cap portions of a second thickness, different than the first thickness.

Abstract: An article is provided, the article including a substrate having a surface, a nano-structure array formed on the substrate, the nano-structure array including a plurality of nano-structures extending from the surface of the substrate, and a cover layer formed on and around the nano-structures to anchor the cover layer to the substrate.

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract: Nano-scale structures are provided wherein nano-structures are formed on a substrate surface and a base material is applied between the nano-structures.

Abstract: A method of forming a nano-structured substrate is provided, the method comprising including forming non-integral nano-pillars on a substrate surface and directionally etching the substrate surface using the non-integral nano-pillars as a mask to form integral nano-structures in the substrate.

Abstract: A method of forming a nano-structure (100?) involves forming a multi-layered structure (10) including an oxidizable material layer (14) established on a substrate (12), and another oxidizable material layer (16) established on the oxidizable material layer (14). The oxidizable material layer (14) is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. Anodizing the other oxidizable material layer (16) forms a porous anodic structure (16?), and anodizing the oxidizable material layer (14) forms a dense oxidized layer (14?) and nano-pillars (20) which grow through the porous anodic structure (16?) into pores (18) thereof. The porous structure (16?) is selectively removed to expose the nano-pillars (20). A surface (I) between the dense oxidized layer (14?) and a remaining portion of the oxidizable material layer (14) is anodized to consume a substantially cone-shaped portion (32) of the nano-pillars (20) to form cylindrical nano-pillars (20?).

Abstract: A method of forming a micro-structure (100, 100?, 100?, 100??) involves forming a multi-layered structure (10) including i) an oxidizable material layer (14) on a substrate (12) and ii) another oxidizable material layer (16) on the oxidizable material layer (14). The oxidizable material layer (14) is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template (16?), including a plurality of pores (18), from the other oxidizable material layer (16), and growing a nano-pillar (20) inside each pore (18). The nano-pillar (18) has a predefined length (L) that terminates at an end (21). A portion of the template (16?) is selectively removed to form a substantially even plane (23) that is oriented in a position opposed to the substrate (12).

Abstract: A nano-structure (100, 100?) includes an oxidized layer (14?), and at least two sets (24, 24?) of super nano-pillars (20) positioned on the oxidized layer (14?). Each of the at least two sets (24, 24?) of super nano-pillars (20) includes a plurality of super nano-pillars (20), where each set (24, 24?) is separated a spaced distance from each other set (24, 24?).

Abstract: A method of forming a nano-structure (100, 100?) includes forming a multi-layered structure (10) including an oxidizable material layer (14) established on a substrate (12), and another oxidizable material layer (16) established on the oxidizable material layer (14). The oxidizable material layer (14) is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. A template (16?), including a plurality of pores (18), is formed out of the other oxidizable material layer (16). An oxide structure (14?) is grown from the oxidizable material layer (14) through each of the pores (18) and over a template surface. Growing the oxide structure (14?) includes forming an individual nano-pillar (20) inside each of the pores (18) that is oriented in a position that is substantially normal to the substrate (12).

Abstract: A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.

Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.

Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.

Abstract: A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.

Abstract: Embodiments of a heating element of a fluid ejection device are disclosed.