Abstract: The structure and devices described herein provide an improved attachment for a peripheral device, such as a stylus, to a computing device when not in use. A stylus may have magnets contained therein that cooperate with magnets in a computing device to magnetically secure the stylus to the computing device when not in use. In addition, a retractable interlock may automatically extend from the stylus when the stylus is in proximity of the computing device. The interlock is received in a receptacle of the computing device to provide an improved attachment through the mechanical interaction of the interlock and the receptacle. The interlock is biased in a retracted position and automatically extends through magnetic attraction with the computing device.

Abstract: The structure and devices described herein provide an improved attachment for a peripheral device, such as a stylus, to a computing device when not in use. A stylus may have magnets contained therein that cooperate with magnets in a computing device to magnetically secure the stylus to the computing device when not in use. In addition, a retractable interlock may automatically extend from the stylus when the stylus is in proximity of the computing device. The interlock is received in a receptacle of the computing device to provide an improved attachment through the mechanical interaction of the interlock and the receptacle. The interlock is biased in a retracted position and automatically extends through magnetic attraction with the computing device.

Abstract: A structure for housing electronic components. The structure includes a first layer and a second layer. One or more layers may each have a modulus of elasticity of less than 2.41 MPa. One or more layers may be at least partially affixed to form a combined layer. The combined layer may have a combined modulus of elasticity of less than 2300 MPa. The combined layer may be transparent to electromagnetic waves. The combined layer may be not electrically conductive across an entire surface area of the combined layer. The combined layer may be polycarbonate free. An outermost layer may be a textile layer.