Abstract: The write lines of a color laser printer are maintained substantially equal throughout the printer's operation by an electronic control arrangement. At the factory, the write lines on all photoconductors of the color laser printer are calibrated to be substantially equal, and the ratio of each write line to a measuring line for each photoconductor is ascertained. During operation of the printer, the length of each of the measuring lines is periodically determined through counting the number of PELslice clock timing pulses produced from a PELslice clock operating at a fixed frequency determined during factory calibration. The length of the write line is determined by the product of the length of the measuring line and the factory calibrated ratio of the length of the write line to the length of the measuring line.

Abstract: The write lines of a color laser printer are maintained substantially equal throughout the printer's operation by an electronic control arrangement. At the factory, the write lines on all photoconductors of the color laser printer are calibrated to be substantially equal, and the ratio of each write line to a measuring line for each photoconductor is ascertained. During operation of the printer, the length of each of the measuring lines is periodically determined through counting the number of PELslice clock timing pulses produced from a PELslice clock operating at a fixed frequency determined during factory calibration. The length of the write line is determined by the product of the length of the measuring line and the factory calibrated ratio of the length of the write line to the length of the measuring line.

Abstract: A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16).

Abstract: A method for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with a thermally activated source of fluorine, such as nitrogen trifluoride, at an elevated temperature, typically at the process operation temperature, wherein the cleaning is terminated prior to complete cleaning and removal of undesired substances allowing rapid restart of fabrication equipment so cleaned.

Abstract: The present invention is a method and apparatus for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with thermally activated nitrogen trifluoride wherein the cleaning effluent is safely removed and cleaning by-products isolated or diluted to provide for efficient cleaning and rapid restarts of fabrication equipment so cleaned.

Abstract: A method for the dynamic cleaning of semiconductor fabrication equipment and particularly quartzware with thermally activated diluted nitrogen trifluoride at elevated temperatures, typically at the process operation temperature, wherein the cleaning effluent is safely removed and cleaning by-products isolated or diluted to provide for efficient cleaning and rapid restarts of fabrication equipment so cleaned.