Patents by Inventor Antonio Di Giacomo
Antonio Di Giacomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10748726Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: GrantFiled: December 17, 2018Date of Patent: August 18, 2020Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Publication number: 20200083011Abstract: Methods of operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: November 12, 2019Publication date: March 12, 2020Inventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Patent number: 10510503Abstract: Methods of forming and operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: GrantFiled: December 30, 2015Date of Patent: December 17, 2019Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Publication number: 20190122845Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: ApplicationFiled: December 17, 2018Publication date: April 25, 2019Inventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Patent number: 10157720Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: GrantFiled: October 17, 2014Date of Patent: December 18, 2018Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 10026563Abstract: An integrated circuit, comprising an electrical-switching mechanical device in a housing having at least one first thermally deformable assembly including a beam held in at least two different locations by at least two arms secured to edges of the housing, the beam and the arms being metallic and situated within the same first metallization level and an electrically conductive body, wherein the said first thermally deformable assembly has at least one first configuration at a first temperature and a second configuration when at least one is at a second temperature different from the first temperature, wherein the beam is at a distance from the body in the first configuration and in contact with the said body and immobilized by the said body in the second configuration and establishing or prohibiting an electrical link passing through the body and through the beam.Type: GrantFiled: May 29, 2014Date of Patent: July 17, 2018Assignee: STMicroelectronics (Rousset) SASInventors: Antonio Di-Giacomo, Christian Rivero, Pascal Fornara
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Patent number: 9670058Abstract: An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.Type: GrantFiled: September 30, 2014Date of Patent: June 6, 2017Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Antonio Di-Giacomo, Pascal Fornara
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Patent number: 9355802Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: GrantFiled: May 23, 2014Date of Patent: May 31, 2016Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Publication number: 20160107886Abstract: Methods of forming and operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: December 30, 2015Publication date: April 21, 2016Inventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 9212053Abstract: An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.Type: GrantFiled: March 31, 2015Date of Patent: December 15, 2015Assignee: STMicroelectronics (Rousset) SASInventor: Antonio Di-Giacomo
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Publication number: 20150203349Abstract: An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.Type: ApplicationFiled: March 31, 2015Publication date: July 23, 2015Inventor: Antonio Di-Giacomo
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Publication number: 20150116072Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: ApplicationFiled: October 17, 2014Publication date: April 30, 2015Inventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 9006897Abstract: An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.Type: GrantFiled: January 7, 2014Date of Patent: April 14, 2015Assignee: STMicroelectronics (Rousset) SASInventor: Antonio Di-Giacomo
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Publication number: 20150014794Abstract: An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.Type: ApplicationFiled: September 30, 2014Publication date: January 15, 2015Inventors: Antonio Di-Giacomo, Pascal Fornara
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Publication number: 20140360851Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: May 23, 2014Publication date: December 11, 2014Applicant: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 8884289Abstract: An integrated circuit comprising a mechanical device for electrical switching comprising a first assembly being thermally deformable and having a beam held at at least two different locations by at least two arms, the beam and the arms being metal and disposed within the same metallization level, and further comprising at least one electrically conducting body. The first assembly has a first configuration at a first temperature and a second configuration at a second temperature different from the first temperature. The beam is out of contact with the electrically conducting body in one configuration in contact with the body in the other configuration. The beam establishes or breaks an electrical link passing through the said at least one electrically conducting body and through the said beam in the different configurations.Type: GrantFiled: February 20, 2014Date of Patent: November 11, 2014Assignee: STMicroelectronics (Rousset) SASInventors: Pascal Fornara, Christian Rivero, Antonio di-Giacomo
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Publication number: 20140266562Abstract: An integrated circuit, comprising an electrical-switching mechanical device in a housing having at least one first thermally deformable assembly including a beam held in at least two different locations by at least two arms secured to edges of the housing, the beam and the arms being metallic and situated within the same first metallization level and an electrically conductive body, wherein the said first thermally deformable assembly has at least one first configuration at a first temperature and a second configuration when at least one is at a second temperature different from the first temperature, wherein the beam is at a distance from the body in the first configuration and in contact with the said body and immobilized by the said body in the second configuration and establishing or prohibiting an electrical link passing through the body and through the beam.Type: ApplicationFiled: May 29, 2014Publication date: September 18, 2014Inventors: Antonio Di-Giacomo, Christian Rivero, Pascal Fornara
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Publication number: 20140191385Abstract: An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.Type: ApplicationFiled: January 7, 2014Publication date: July 10, 2014Applicant: STMicroelectronics (Rousset) SASInventor: Antonio Di-Giacomo
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Publication number: 20140167908Abstract: An integrated circuit comprising a mechanical device for electrical switching comprising a first assembly being thermally deformable and having a beam held at at least two different locations by at least two arms, the beam and the arms being metal and disposed within the same metallization level, and further comprising at least one electrically conducting body. The first assembly has a first configuration at a first temperature and a second configuration at a second temperature different from the first temperature. The beam is out of contact with the electrically conducting body in one configuration in contact with the body in the other configuration. The beam establishes or breaks an electrical link passing through the said at least one electrically conducting body and through the said beam in the different configurations.Type: ApplicationFiled: February 20, 2014Publication date: June 19, 2014Applicant: STMicroelectronics (Rousset) SASInventors: Pascal Fornara, Christian Rivero, Antonio di-Giacomo
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Patent number: 8704327Abstract: An integrated circuit, comprising a capacitive device having a thermally variable capacitive value and comprising a thermally deformable assembly disposed within an enclosure, and comprising an electrically-conducting fixed body and a beam held at least two different locations by at least two arms rigidly attached to edges of the enclosure, the beam and the arms being metal and disposed within the first metallization level. A part of the said thermally deformable assembly may form a first electrode of the capacitive device and a part of the said fixed body may form a second electrode of the capacitive device. The thermally deformable assembly has a plurality of configurations corresponding respectively to various temperatures of the said assembly and resulting in a plurality of distances separating the two electrodes and various capacitive values in the capacitive device corresponding to the plurality of distances.Type: GrantFiled: November 28, 2012Date of Patent: April 22, 2014Assignee: STMicroelectronics (Rousset) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo