Abstract: Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

Abstract: Apparatuses and methods related to memory authentication. Memory devices can be authenticated utilizing authentication codes. An authentication code can be generated based on information stored in a fuse array of the memory device. The authentication code can be stored in the memory device. The stored authentication code can be compared to a captured authentication code based on fuse array information broadcast to memory components of the memory device. The authenticity of the memory device can be determined based on the comparison and can result in placing the memory device in an unlocked state.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

Abstract: Apparatuses and methods related to memory authentication. Memory devices can be authenticated utilizing authentication codes. An authentication code can be generated based on information stored in a fuse array of the memory device. The authentication code can be stored in the memory device. The stored authentication code can be compared to a captured authentication code based on fuse array information broadcast to memory components of the memory device. The authenticity of the memory device can be determined based on the comparison and can result in placing the memory device in an unlocked state.

Abstract: Apparatuses and methods related to detecting synchronization between multiple devices. The security of a device may be compromised if the device receives commands from unauthorized sources. A state of a device can be affected by the commands the device receives. A different device can determine whether there is synchronicity between device and the different device to determine whether the security of the device may have been compromised.

Abstract: Systems and methods for read operations and management are disclosed. More specifically, this disclosure is directed to receiving a first read command directed to a first logical address and receiving, after the first read command, a second read command directed to a second logic address. The method also includes receiving, after the second read command, a third read command directed to a third logical address and determining that the first logical address and the third logical address correspond to a first physical address and a third physical address, respectively. The first physical address and the third physical address can be associated with a first word line of a memory component while the second logical address corresponds to a second physical address associated with a second word line of the memory component. The method includes executing the first read command and the third read command sequentially.

Abstract: Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a signaling can be received that indicates a request from a controller to migrate valid data from a first data block to a second data block. For example, the first data block can be a data block of a plurality of memory cells configured as single-level-cell (SLC) memory. The second data block can be configured as multi-level-cell (MLC) memory. The data migration operation can include an error control operation that is performed using the memory component, the error control operation excluding transferring the data to the controller. The data can be migrated from the first data block configured as SLC memory to the second data block configured as MLC memory after the error control operation is performed using the memory component.

Abstract: Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a battery state associated with the memory system or sub-system may be used as an indicator or basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a battery state or condition satisfies a criterion. Based on determining that the criterion is satisfied the, the garbage collection operation may be postponed until the battery state changes to satisfy a different battery condition.

Abstract: Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a criticality value can be determined and used as a basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a criticality value associated with performing a garbage collection operation satisfies a condition. Based on determining that the condition is satisfied, a parameter associated with performing the garbage collection operation can be adjusted. The garbage collection operation is performed on the data block stored on the memory component using the adjusted parameter.

Abstract: Methods and apparatuses associated with updating a map using images are described. An apparatus can include a processing resource and a memory resource having instructions executable to a processing resource to monitor a map including a plurality of locations, receive, at the processing resource, the memory resource, or both, and from a first source, image data associated with a first location, identify the image data as being associated with a missing portion, an outdated portion, or both, of the map, and update the missing portion, the outdated portion, or both, of the map with the image data.

Abstract: Memories having a first pool of memory cells having a first storage density and a second pool of memory cells having a second storage density greater than the first storage density, and a controller configured to cause the memory to determine whether a value of an indication of available power of a power supply for the memory is less than a threshold, and in response to determining that the value of the indication of available power is less than the threshold, increase a size of the first pool of memory cells, limit programming of data received by the memory to the first pool of memory cells, and cease movement of data from the first pool of memory cells to the second pool of memory cells, as well as apparatus including similar memories.

Abstract: Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. Example memory devices, systems and methods include a multiplexer circuit to further facilitate use of slower, and wider bandwidth memory devices. Devices and methods described may be configured to substantially match the capacity of a narrower, higher speed host interface.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

Abstract: Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, at least one surface mount component operably coupled to conductive traces of at least one dielectric material, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate.