Patents by Inventor Aritharan Thurairajaratnam

Aritharan Thurairajaratnam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having capacitive extension spokes and method for making the same
    Patent number: 5903050
    Abstract: Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: May 11, 1999
    Assignee: LSI Logic Corporation
    Inventors: Aritharan Thurairajaratnam, Wheling Cheng, Scott L. Kirkman