Abstract: Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective supporting structure disposed on or around a periphery of that membrane portion. The transducer elements are initially formed on a sacrificial wafer, wherein supporting structures of the transducer elements facilitate subsequent removal of the sacrificial wafer and/or subsequent handling of the transducer elements. In another embodiment, a polymer layer is disposed on the transducer elements to provide for flexible support during such subsequent handling.

Abstract: A haptic actuator may include a housing having a top and a bottom, and first and second permanent magnets carried by the top and bottom, respectively, of the housing. The haptic actuator may also include a field member carried by the housing. The field member may include a coil between the first and second permanent magnets, first and second ends, and a first mass between the first end and the coil, and a second mass between the second end and the coil. A first shaft may slidably couple the first mass to the housing, and a second shaft may slidably couple the second mass to the housing. The haptic actuator may also include a first set of biasing members between the first end of the field member and the housing and a second set of biasing members between the second end of the field member and the housing.

Abstract: A haptic actuator may include a housing, at least one coil carried by the housing, and a field member having opposing first and second sides. The haptic actuator may also include a respective at least one flexure bearing mounting each of the first and second sides of the field member to be reciprocally movable within the housing responsive to the at least one coil. Each flexure bearing may include at least one flexible member having a wishbone shape with two diverging arms joined together at proximal ends and having spaced distal ends operatively coupled between adjacent portions of the field member and the housing.

Abstract: A haptic actuator may include a housing, at least one permanent magnet carried by the housing, a field member movable within the housing and comprising at least one coil cooperating with the at least one permanent magnet, and at least one mechanical limit stop between the housing and the field member. The haptic actuator may also include circuitry capable of generating a pulse width modulated (PWM) waveform for the at least one coil to move the field member from an initial at-rest position and without contacting the at least one mechanical limit stop.

Abstract: A haptic actuator may include a housing, at least one coil carried by the housing, a field member movable within the housing responsive to the at least one coil, and at least one mechanical limit stop between the housing and the field member. The haptic actuator may also include circuitry capable of generating a pulse width modulated (PWM) waveform for the at least one coil to move the field member from an initial at-rest position and without contacting the at least one mechanical limit stop.

Abstract: A haptic actuator may include a housing having a top and a bottom, and first and second coils carried by the top and bottom, respectively, of the housing. The haptic actuator may also include a field member carried by the housing. The field member may include a permanent magnet between the first and second coils, first and second ends, and a first mass between the first end and the permanent magnet, and a second mass between the second end and the permanent magnet. A first shaft may slidably couple the first mass to the housing, and a second shaft may slidably couple the second mass to the housing. The haptic actuator may also include a first set of biasing members between the first end of the field member and the housing and a second set of biasing members between the second end of the field member and the housing.

Abstract: A haptic actuator may include a housing, at least one coil carried by the housing, and a field member having opposing first and second sides. The haptic actuator may also include a respective flexure bearing mounting each of the first and second sides of the field member to be reciprocally movable within the housing responsive to the at least one coil. Each flexure bearing may include a first anchor member coupled to an adjacent portion of the housing, a second anchor member coupled to an adjacent side of the field member, and a first flexible arm coupling the first and second anchor members together and having at least one bend therein.

Abstract: Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

Abstract: A haptic actuator may include a housing, at least one permanent magnet carried by the housing, and a field member movable within the housing and comprising at least one coil cooperating with the at least one permanent magnet. The housing, at least one coil, and field member may define a resonant frequency. The haptic actuator may also include drive circuitry coupled to the at least one coil and being capable of generating first and second drive waveforms having respective different frequencies spaced about the resonant frequency to drive the field member at a beat frequency lower than the resonant frequency.

Abstract: A haptic actuator may include a housing, at least one coil carried by the housing, and a field member movable within the housing responsive to the at least one coil. The housing, at least one coil, and field member may define a resonant frequency. The haptic actuator may also include drive circuitry coupled to the at least one coil and being capable of generating first and second drive waveforms having respective different frequencies spaced about the resonant frequency to drive the field member at a beat frequency lower than the resonant frequency.

Abstract: A method of tuning a haptic actuator that includes a housing having an initial ferromagnetic mass, at least one coil carried by the housing, and a field member movable within the housing responsive to the at least one coil, wherein the haptic actuator operative as a resonator and having an initial quality (Q) factor, may include measuring the initial Q factor of the haptic actuator. The method may include determining a desired ferromagnetic mass for the housing to tune the initial Q factor to a desired Q factor. The method may also include changing the initial ferromagnetic mass of the housing to the desired ferromagnetic mass. Another embodiment changes the ferromagnetic mass of the field member.

Abstract: A method is directed to tuning a haptic actuator that includes a housing having a ferromagnetic mass, a coil carried by the housing, and a field member movable within the housing responsive to the coil. The haptic actuator is operative as a resonator and having an initial quality (Q) factor. The method may include determining whether the initial Q factor is within a desired Q factor range, and when the initial Q factor is not within the desired Q factor range, performing ferromagnetic mass change iterations until an updated Q factor is within the desired Q factor range. Each ferromagnetic mass change iteration may include changing the ferromagnetic mass of the housing, determining the updated Q factor based upon changing the ferromagnetic mass of the housing, and determining whether the updated Q factor is within the desired Q factor range. Another embodiment changes the ferromagnetic mass of the field member.

Abstract: Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

Abstract: Switchable micromachined transducer arrays are described where one or more switches, or relays, are monolithically integrated with transducer elements in a piezoelectric micromachined transducer array (pMUT). In embodiments, a MEMS switch is implemented on the same substrate as the transducer array for switching operational modes of the transducer array. In embodiments, a plurality of transducers are interconnected in parallel through MEMS switch(es) in a first operational mode (e.g., a drive mode) during a first time period, and are then interconnected through the MEMS switch(es) with at least some of the transducers in series in a second operational mode (e.g., a sense mode) during a second time period.

Abstract: Wide bandwidth piezoelectric micromachined ultrasonic transducers (pMUTs), pMUT arrays and systems having wide bandwidth pMUT arrays are described herein. For example, a piezoelectric micromachined ultrasonic transducer (pMUT) includes a piezoelectric membrane disposed on a substrate. A reference electrode is coupled to the membrane. First and second drive/sense electrodes are coupled to the membrane to drive or sense a first and second mode of vibration in the membrane.

Abstract: Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.

Abstract: In an embodiment, a probe device includes a portion having a curved surface and a plurality of tiles variously coupled to the curved surface. The tiles each include a plurality of piezoelectric transducer elements and a base adjoining and supporting the plurality of piezoelectric transducer elements. The probe device further comprises curved lens portions each coupled to a respective one of the plurality of tiles, wherein for each of the tiles, the plurality of piezoelectric transducer elements of the tile are to propagate a wave toward the respective curved lens portion. In another embodiment, the probe device further comprises a sheath material surrounding the curved lens portions.

Abstract: In an embodiment, a tile device includes a plurality of piezoelectric transducers elements and a base adjoining and supporting the plurality of piezoelectric transducers elements. The base includes integrated circuitry programmed to successively configure operational modes of the tile, according to a pre-programmed sequence, to successively select respective subsets of the piezoelectric transducers elements for activation. The integrated circuitry includes pulser logic to selectively activate such subsets, and demultiplexer logic to communicate from the tile sense signals resulting from such activation. In another embodiment, the demultiplexer logic is part of a first voltage domain of the tile, and the pulser logic is part of a second voltage domain of the tile. The base may include circuitry to protect the demultiplexer logic from a relatively high voltage level of the second voltage domain.

Abstract: In an embodiment, a transducer device comprises a flexible substrate and a plurality of tiles coupled to the substrate. The tiles each include a plurality of piezoelectric transducer elements and a base adjoining and supporting the plurality of piezoelectric transducer elements. The substrate has disposed therein or thereon signal lines to serve as a backplane for communication to, from and/or among integrated circuitry of the tiles. In another embodiment, the integrated circuitry of the tiles are each pre-programmed to implement any of a respective plurality of operational modes. Signals exchanged with the tiles via the flexible substrate facilitate operation of the transducer device to provide a phased array of transducer elements.

Abstract: Switchable micromachined transducer arrays are described where a MicroElectroMechanical Systems (MEMS) switch, or relay, is monolithically integrated with a transducer element. In embodiments, the MEMS switch is implemented in the same substrate as the transducer array to implement one or more logic, addressing, or transducer control function. In embodiments, each transducer element of an array is a piezoelectric element coupled to at least one MEMS switch to provide element-level addressing within the array. In certain embodiments the same piezoelectric material employed in the transducer is utilized in the MEMS switch.