Patents by Inventor Arne Fleissner

Arne Fleissner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220223823
    Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Applicant: Pictiva Displays International Limited
    Inventor: Arne Fleissner
  • Patent number: 11322717
    Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 3, 2022
    Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITED
    Inventor: Arne Fleissner
  • Patent number: 11201310
    Abstract: An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: December 14, 2021
    Assignee: Pictiva Displays International Limited
    Inventors: Philipp Schwamb, Erwin Lang, Arne Fleissner
  • Publication number: 20210359268
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Application
    Filed: June 1, 2021
    Publication date: November 18, 2021
    Applicant: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Patent number: 11056660
    Abstract: The invention relates to an organic optoelectronic component (10) comprising a first electrode layer (2), having a doped matrix material and metal nanowires, an organic active layer (3), which is suitable for emitting or detecting electromagnetic radiation, and a second electrode layer (6). The organic active layer (3) is directly adjacent to the first electrode layer (2). The invention further relates to a method for producing the organic optoelectronic component (10).
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: July 6, 2021
    Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITED
    Inventors: Silke Scharner, Daniel Riedel, Arne Fleissner, Thomas Wehlus, Nina Riegel, Johannes Rosenberger
  • Patent number: 11043654
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: June 22, 2021
    Assignee: OSRAM OLED Gmbh
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Publication number: 20210184175
    Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.
    Type: Application
    Filed: January 13, 2021
    Publication date: June 17, 2021
    Applicant: Pictiva Displays International Limited
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
  • Publication number: 20210151708
    Abstract: A component module is disclosed that includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side. In some implementations, the radiation emitting component includes a substrate. In some implementations, a neutral fiber runs outside the substrate.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Applicant: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10944081
    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: March 9, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10930890
    Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: February 23, 2021
    Assignee: PICTIVA DISPLAYS INTERNATIONAL LIMITED
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
  • Publication number: 20200381666
    Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
  • Patent number: 10804497
    Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 13, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Riedel, Nina Riegel, Thomas Wehlus, Arne Fleissner, Armin Heinrichsdobler
  • Publication number: 20200266370
    Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.
    Type: Application
    Filed: May 7, 2020
    Publication date: August 20, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Publication number: 20200227683
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.
    Type: Application
    Filed: March 25, 2020
    Publication date: July 16, 2020
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang
  • Publication number: 20200212343
    Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 2, 2020
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10693088
    Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: June 23, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Sebastian Wittmann, Arne Fleissner, Erwin Lang, Nina Riegel
  • Patent number: 10644262
    Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 5, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Sebastian Wittmann, Arne Fleißner, Erwin Lang
  • Patent number: 10637005
    Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: April 28, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Erwin Lang, Thomas Wehlus, Arne Fleißner, Sebastian Wittmann
  • Patent number: 10529785
    Abstract: The invention relates to an optoelectronic component, the optoelectronic component comprises a light-emitting layer stack, and an electrothermal protection element, which is connected to the layer stack in the component and has a temperature-dependent resistor.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: January 7, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Daniel Riedel, Carola Diez, Arne Fleissner, Ulrich Niedermeier, Dominik Pentlehner, Andreas Rausch, Nina Riegel, Johannes Rosenberger, Thomas Wehlus
  • Patent number: 10490767
    Abstract: An organic light-emitting diode includes a carrier; at least two electrodes; an organic layer sequence having at least one active zone that generates light; and light-opaque visual protection layers that have no influence on an emission characteristic of the organic layer sequence and the organic light-emitting diode, one of which is located directly on the carrier, the organic layer sequence is located between the two electrodes and one of the electrodes is attached directly to the carrier, the visual protection layer, viewed in a plan view, completely surrounds the organic layer sequence, at least one of the electrodes is provided with a structuring in a region adjacent to the organic layer sequence in a plan view, in a plan view, the structuring is located completely beside the organic layer sequence, and the structuring is hidden by the visual protection layer for a viewer from outside the organic light-emitting diode.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: November 26, 2019
    Assignee: OSRAM OLED GmbH
    Inventors: Nina Riegel, Daniel Riedel, Thomas Wehlus, Arne Fleißner, Armin Heinrichsdobler