Abstract: A method of producing an organic optoelectronic component includes: forming a first electrode layer comprising a contact region, arranging an electrically conductive contact lug on the first electrode layer. A first section of the contact lug is secured in the contact region on the first electrode layer such that a second section projects beyond the contact region. The method further includes forming an organic functional layer structure laterally alongside the contact lug on the first electrode layer, forming a second electrode on the organic functional layer structure, forming an encapsulation layer such that it extends over the second electrode and over the first section, and severing the first electrode layer and the encapsulation layer in the region of the lug such that subsequently the first section is arranged between the contact region and the encapsulation layer and the second section projects between the encapsulation layer and the first electrode layer.

Abstract: Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

Abstract: In various embodiments, an optoelectronic assembly may include at least one organic light emitting diode including a first light emitting diode element and a second light emitting diode element, and an electronic circuit. The first light emitting diode element and the second light emitting diode element are electrically connected in parallel and are deposited monolithically on a common substrate, and the electronic circuit is designed to compare an electric current through the first light emitting diode element that flows during operation with an electric current through the second light emitting diode element that flows during operation and, depending on the comparison, to detect a short circuit of the first light emitting diode element or of the second light emitting diode element and to initiate an electrical switching off of one of the light emitting diode elements and/or of the assembly.

Abstract: A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Abstract: An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.

Abstract: An organic light-emitting diode provides a substrate having a top side and one or a plurality of substrate side surfaces running transversely to the top side and connected thereto via a substrate edge; and an organic layer sequence applied to the top side with an emitter layer, which generates electromagnetic radiation coupled out from the diode via a luminous surface during intended operation of the diode. In a plan view of the luminous surface, the sequence adjoins at least a partial region of substrate edge(s), and in the region the luminous surface extends at least as far as the corresponding edge. An encapsulation formed in an uninterrupted and continuous fashion is applied to the sequence. The encapsulation, at least in the region of the edge adjoining the sequence, is led onto the associated substrate side surface, at least partly covers the latter and is in direct contact with the surface.

Abstract: An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.

Abstract: A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.

Abstract: An organic light-emitting component (100) is specified, which comprises a carrier (1) and an organic layering sequence (2) arranged on the carrier (1). The organic layering sequence (2) comprises at least two organic layers, wherein at least one of the organic layers is designed as an emitting layer (23). The emitting layer (23) emits light (200) of a first wavelength range, which has an intensity maximum at a first wavelength. Further, the organic light-emitting component (100) comprises an anode (3) and a cathode (4) which provide the electrical contacting of the organic layering sequence (2). Further, the organic light-emitting component (100) has at least one nanoparticle layer (20), wherein one nanoparticle layer (20) is an organic layer of the organic layering sequence (2) provided with first nanoparticles (5). The first nanoparticles (5) have a refractive index (nN) that is smaller than at least one refractive index of an organic material of one of the organic layers.

Abstract: An organic device is disclosed. In an embodiment the organic device includes an organic component designed to emit and/or detect radiation, wherein the organic component has a first layer stack and a radiation passage surface and an organic protection diode having a second layer stack, wherein the organic protection diode is arranged directly after the organic component in a stacking direction (Z), and wherein the organic protection diode is designed to protect the organic component from an electrostatic discharge and/or from a polarity reversal of the organic component.

Abstract: An optoelectronic device is disclosed. In an embodiment the optoelectronic device includes a light-transmissive first electrode, an electrically conductive track including a metal, and a functional organic region having at least one active region, wherein the electrically conductive track is arranged between the first electrode and the functional organic region and wherein the electrically conductive track is in direct contact with the first electrode and the functional organic region.

Abstract: An OLED and a method for producing an OLED are disclosed. In an embodiment, the OLED includes a substrate and an organic layer stack with at least one active light-generating layer, which is suitable for generating electromagnetic radiation, wherein the organic layer stack is arranged between a first electrode and a second electrode. The OLED further includes a buffer layer arranged between the substrate and the first electrode, wherein the buffer layer includes an organic material, wherein a polymeric planarization layer is in direct contact with the substrate, wherein the buffer layer is in direct contact with the polymeric planarization layer, and wherein the first electrode is in direct contact with the buffer layer.

Abstract: An organic light-emitting device and a method for producing an organic light emitting device are disclosed. In an embodiment the device includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. The at least one layer sequence includes at least one first electrode surface arranged on the substrate, at least one second electrode surface arranged on the first electrode surface and an organic functional layer stack having organic functional layers between the first electrode surface and the second electrode surface. The organic functional layer stack includes at least one organic light-emitting layer, wherein the at least one organic light-emitting layer is configured to emit light, wherein the organic functional layer stack includes at least one inhomogeneity layer, and wherein a thickness of the at least one inhomogeneity layer varies in a lateral direction.

Abstract: A light-emitting device includes a carrier, an organic layer sequence arranged on the carrier and having at least one emitter layer containing a light-emitting material configured to emit light of a first wavelength range, a first electrode and a second electrode, and a multiplicity of nanostructures, wherein the nanostructures have a refractive index smaller than a refractive index of the light-emitting material of the emitter layer and at least some of the nanostructures project into the emitter layer or pierce through the emitter layer.

Abstract: In various exemplary embodiments, an optoelectronic component device is provided. The optoelectronic component device includes a first organic light emitting diode and a second organic light emitting diode, which are connected to one another in physical contact one above the other. The first organic light emitting diode is electrically connected in parallel with the second organic light emitting diode. The first organic light emitting diode and the second organic light emitting diode have at least an approximately identical or identical electronic diode characteristic and/or an approximately identical or identical electronic diode characteristic variable.

Abstract: An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.

Abstract: In various embodiments, an optoelectronic assembly may include at least one organic light emitting diode including a first light emitting diode element and a second light emitting diode element, and an electronic circuit. The first light emitting diode element and the second light emitting diode element are electrically connected in parallel and are deposited monolithically on a common substrate, and the electronic circuit is designed to compare an electric current through the first light emitting diode element that flows during operation with an electric current through the second light emitting diode element that flows during operation and, depending on the comparison, to detect a short circuit of the first light emitting diode element or of the second light emitting diode element and to initiate an electrical switching off of one of the light emitting diode elements and/or of the assembly.

Abstract: Various embodiments may relate to a method for producing an optoelectronic component, including forming a first electrode on a substrate, arranging a first mask structure on or above the substrate, wherein the first mask structure comprises a first structuring region including an opening and/or a region prepared for forming an opening, arranging a second mask structure on or above the first mask structure, forming a second structuring region in the first mask structure and in the second mask structure in such a way that at least one part of the first structuring region in the first mask structure is formed outside the second structuring region in the first mask structure.

Abstract: A lighting device may include a substrate having a carrier, a first electrical busbar, a second electrical busbar, and an optically functional structure on or above the carrier, wherein the optically functional structure is formed laterally between the first and the second electrical busbar, and a first electrode electrically coupled to the first electrical busbar and/or the second electrical busbar, on or above the carrier, and an organic functional layer structure on or above the first electrode, wherein the organic functional layer structure is formed for converting an electric current into an electromagnetic radiation, and a second electrode on or above the organic functional layer structure. The optically functional structure is formed in such a way that the beam path of the electromagnetic radiation which passes through the substrate and/or the spectrum of the electromagnetic radiation passing through the substrate are/is variable by means of the optically functional structure.

Abstract: An organic radiation-emitting component and a method for manufacturing an organic radiation-emitting component are disclosed. In an embodiment, the component includes a base substrate and a plurality of light-emitting units disposed on the base substrate, wherein the light-emitting units are arranged laterally offset with respect to one another, wherein the plurality of light-emitting units is divided into light-emitting units of a first type and light-emitting units of a second type, wherein a current flow through the light-emitting units of the first type is directed in an opposite direction to a current flow through the light-emitting units of the second type during operation, and wherein the light-emitting units are grouped in neighboring pairs, each neighboring pair consists of a light-emitting unit of a first type and a light-emitting unit of a second type, both first electrodes or both second electrodes of which are electrically connected to one another.