Patents by Inventor Arun S. Veeramani

Arun S. Veeramani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180078276
    Abstract: Various embodiments of a tissue cutting device and methods for using are described. In some variations devices include an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a cutting portion at its distal; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a cutting portion at its distal end, the first and second annular elements being rotatable relative to one another to cause the first annular element and the second annular element to pass each other to shear tissue.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 22, 2018
    Applicant: Microfabrica Inc.
    Inventors: Richard T. Chen, Ming Ting Wu, Arun S. Veeramani, Vacit Arat, Gregory P. Schmitz, Juan Diego Perea, Ronald Leguidleguid, Gregory B. Arcenio, Eric C. Miller
  • Publication number: 20180078274
    Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 22, 2018
    Applicant: Microfabrica Inc.
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Gregory P. Schmitz, Eric C. Miller, Ming Ting Wu, Arun S. Veeramani, Juan Diego Perea, Ronald Leguidleguid, Gregory B. Arcenio
  • Patent number: 9878401
    Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: January 30, 2018
    Assignee: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
  • Patent number: 9533376
    Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: January 3, 2017
    Assignee: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen
  • Publication number: 20140197145
    Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
    Type: Application
    Filed: January 15, 2014
    Publication date: July 17, 2014
    Inventors: Arun S. Veeramani, Heath A. Jensen, Uri Frodis, Christopher G. Wiita, Michael S. Lockard, Irina Boguslavsky, Pavel Lembrikov, Dennis R. Smalley, Richard T. Chen