Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).

Abstract: Ali apparatus for supporting at least one electrical connector body, the apparatus includes a mechanical frame assembly mountable to a printed circuit board (PCB) and separable from the at least one connector body and the PCB. The frame assembly includes at least one base member for attachment to the PCB; and a plurality of rigid body members each spaced apart from one another and extending from the at least one base member or an adjacent rigid body member. The plurality of rigid body members receive a grouping of one or more connector bodies and a pair of adjacent rigid body members are configured to receive and support at least a portion of an entire length of respective opposing side surfaces defining each connector body. When a lateral force is applied to the connector body, the frame assembly acts as a support and transfers the lateral force to the PCB, thereby reducing a rotational moment at a base of each connector body connected to the PCB.

Abstract: Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level.

Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).

Abstract: Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract: Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

Abstract: A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An apparatus measures residual stress in a sample under test by measuring the penetration of an indenter on a unprocessed sample under test, and after processing of the sample under test, measuring again the penetration of the indenter on the processed sample under test, and deriving from the two penetration measurements the residual stress in a sample under test. The apparatus and method of the preferred embodiments are especially useful in determining residual stress in a printed wiring board. In this manner a direct measurement of residual stress is possible without destroying the printed wiring board.

Abstract: An apparatus and method allow accurately determining properties of an anisotropic material, such as a multilayer printed wiring board, in a non-destructive manner using scanning acoustic microscopy. The apparatus and method includes special signal processing that allows determining the time of flight of an input waveform from a transmitter transducer on one side of the printed wiring board to a receiver transducer positioned on the opposite side of the printed wiring board in a position that opposes the transmitter transducer. The special signal processing includes an auto-correlation function and a cepstrum analysis. Once the time of flight is determined, the velocity of the input waveform may be computed. The Young's modulus and shear modulus for the printed wiring board may then be computed from the velocity of the input waveform. The preferred embodiments allow determining properties of a printed wiring board without the necessity of destructive testing.

Abstract: An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and spring plate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

Abstract: A method and system for determining material properties of a cross-section of an anisotropic sample material. An ultrasonic signal is applied to the surface of the anisotropic sample material, which comprises multiple constituent material layers, such that a characteristic medium wave is induced within each of the constituent materials. Each of these characteristic medium waves is sampled over a time interval to obtain a test waveform. This resultant test waveform is then spectrum analyzed utilizing cepstrum noise filtration, such that the material properties of said anisotropic sample material may be determined.