Patents by Inventor Arvind K. Sinha

Arvind K. Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120018666
    Abstract: The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
    Type: Application
    Filed: July 23, 2010
    Publication date: January 26, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joseph Kuczynski, Arvind K. Sinha, Kevin A. Splittstoesser, Timothy J. Tofil
  • Publication number: 20110303403
    Abstract: An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber.
    Type: Application
    Filed: June 11, 2010
    Publication date: December 15, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Maurice F. Holahan, Eric V. Kline, Paul N. Krystek, Michael R. Rasmussen, Arvind K. Sinha, Stephen M. Zins
  • Publication number: 20110182575
    Abstract: A method and circuit are provided for implementing reduced signal degradation for fiber optic modules, and a design structure on which the subject circuit resides. Responsive to a detected signal input, an optical misalignment calculation is performed. A voltage potential for a lens shape control is selected responsive to the optical misalignment calculation. An optical signal loss calculation and threshold compare are performed. Responsive to the optical signal loss calculation less than the threshold, the lens shape and voltage potential are fixed.
    Type: Application
    Filed: January 22, 2010
    Publication date: July 28, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joseph Kuczynski, Arvind K. Sinha
  • Patent number: 7929314
    Abstract: The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: April 19, 2011
    Assignee: International Business Machines Corporation
    Inventors: Arvind K. Sinha, Thomas S. Thompson
  • Publication number: 20110085313
    Abstract: A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon.
    Type: Application
    Filed: October 14, 2009
    Publication date: April 14, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John L. Colbert, Arvind K. Sinha, Roger D. Weekly
  • Patent number: 7903411
    Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: March 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr., Arvind K. Sinha
  • Publication number: 20100243716
    Abstract: A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.
    Type: Application
    Filed: March 25, 2009
    Publication date: September 30, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Joseph Kuczynski, Arvind K. Sinha, Kevin A. Splittstoesser, Timothy J. Tofil
  • Patent number: 7777329
    Abstract: An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: August 17, 2010
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Jason R. Eagle, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha, Terry L. Sobotta
  • Patent number: 7751918
    Abstract: Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr., Arvind K. Sinha
  • Patent number: 7701720
    Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: April 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Jason R. Eagle, Arvind K. Sinha, Christopher L. Tuma
  • Publication number: 20090316376
    Abstract: The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.
    Type: Application
    Filed: June 20, 2008
    Publication date: December 24, 2009
    Applicant: International Business Machines Corporation
    Inventors: Arvind K. Sinha, Thomas S. Thompson
  • Publication number: 20090119902
    Abstract: Forming a stacked multiple electronic component interconnect structure includes mounting a first double sided land grid to a first surface of a flexible cable and attaching a second double sided land grid array to a second surface of the flexible cable. A first electronic component is attached to a first surface of the first double sided land grid array and a second electronic component is secured to a second surface of the second double sided land grid array to form a stacked multiple electronic component interconnect structure. The stacked multiple electronic component interconnect structure is attached to a circuit board having an electronic component interface cavity. The second electronic component is mounted in the electronic component interface cavity. Finally, the method includes attaching a force member to apply a compressive force to the stacked multiple electronic component interconnect structure to maintain electrical contact between the first and second electronic components.
    Type: Application
    Filed: July 17, 2008
    Publication date: May 14, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mark D. Plucinski, Arvind K. Sinha
  • Publication number: 20090119911
    Abstract: Forming a three-dimensional die configuration for an electronic circuit board includes locating a first electronic component in at least one cavity formed in a circuit board, and positioning a first substrate member in the at least one cavity. The first substrate member includes a first surface electrically connected to the first electronic component, and a second surface. A first surface of a double-sided land grid array is connected to the second surface of the first substrate member, and a first surface of a second substrate member is connected to a second surface of the double-sided land grid array. A second electronic component is mounted to a second surface of the second substrate member, and a portion of the second electronic component is covered with a thermal interface member. A cap member is mounted to the second electronic component and the thermal interface member to form a three-dimensional die configuration.
    Type: Application
    Filed: July 22, 2008
    Publication date: May 14, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Arvind K. Sinha
  • Publication number: 20090083972
    Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Inventors: John L. Colbert, John S. Corbin, JR., Jason R. Eagle, Arvind K. Sinha, Christopher L. Tuma
  • Patent number: 7499279
    Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: March 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Jr., Arvind K. Sinha
  • Publication number: 20090034198
    Abstract: An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 5, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John L. Colbert, John S. Corbin, Jr., Jason R. Eagle, Arvind K. Sinha, Christopher L. Tuma
  • Publication number: 20080308260
    Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.
    Type: Application
    Filed: August 4, 2008
    Publication date: December 18, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, JR., Arvind K. Sinha
  • Publication number: 20080266799
    Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Levi A. Campbell, John L. Colbert, Michael J. Ellsworth, Arvind K. Sinha
  • Publication number: 20080265402
    Abstract: A system and method for utilizing lead-free multi-core modules with organic substrates,including a base portion configured to attach a semiconductor chip;and a cap portion further comprising: a bottom portion configured to be sealed to the base portion;and a vacuum port;wherein when a vacuum is drawn at the vacuum port,a re-workable seal between the base portion and the cap portion is provided to enable rework.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Arvind K. Sinha
  • Patent number: 7442053
    Abstract: An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: October 28, 2008
    Assignee: International Business Machines Corporation
    Inventors: William L. Brodsky, Mark G. Clark, Amanda E. E. Mikhail, Arvind K. Sinha, Scott A. Shurson, Jason T. Stoll