Patents by Inventor ARVIND SUNDARAM

ARVIND SUNDARAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11895803
    Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: February 6, 2024
    Assignee: Intel Corporation
    Inventors: Krishnakumar Varadarajan, Arvind Sundaram, Srinivasarao Konakalla, Yogesh Channaiah, Satyajit Siddharay Kamat, Raghavendra N
  • Publication number: 20230409100
    Abstract: Embodiments herein relate to a power monitor that can be used to dynamically change a power level of an electronic device and/or operational settings of a processor of the electronic device. Specifically, the power monitor may be configured to identify “droop” of power, and logic to update the power level and/or operational settings in accordance with identification of the droop. Other embodiments may be described and claimed.
    Type: Application
    Filed: June 15, 2022
    Publication date: December 21, 2023
    Inventors: Shailendra Singh Chauhan, Arvind Sundaram, Manasa Nagamangala Sridhara, Anil Kumar Nama, Ramesh Vankunavath, Manjunath Channipura Hombaiah, Siva Prasad Jangili Ganga, Kunal Shah, Venkata Mahesh Gunnam, Chuen Ming Tan, Venkataramana Kotakonda
  • Publication number: 20230324981
    Abstract: An apparatus can include universal serial bus type C (USB-C) connection circuitry. The apparatus can also include input/output (I/O) circuitry coupled to the USB-C connection circuitry. The I/O circuitry can receive a power signal over the USB-C connection circuitry. The apparatus can include baseband circuitry to initiate wireless wide area network (WWAN) communication responsive to receiving a wake signal from the I/O circuitry. The WWAN communication can include messages received from the USB-C connection circuitry. Other apparatuses, systems, and methods are described.
    Type: Application
    Filed: March 23, 2022
    Publication date: October 12, 2023
    Inventors: Arvind Sundaram, Santhosh Ap, Shailendra Singh Chauhan, Nagalakshmi Shashidhara Guptha, Nirmala Bailur, Mythili Hegde
  • Patent number: 11726278
    Abstract: This document discusses, among other things, systems and methods to transmit laser energy to a first hollow-core transmission medium of a board, and to detect laser energy from a second hollow-core transmission medium of the board using a photodiode of the communication interface. A system can include a communication interface configured to be coupled to a chip carrier, the communication interface including a laser emitter configured to transmit laser energy to a first hollow-core transmission medium of a board, and a photodiode configured to detect laser energy communicated from a second hollow-core transmission. The system can further include the chip carrier and the board, as well as one or more alignment features to position the laser emitter and the photodiode over inputs of the first and second hollow-core transmission mediums, and an optically clear resin optionally between the communication interface and the board.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 11450936
    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 20, 2022
    Assignee: Intel Corporation
    Inventors: Ramaswamy Parthasarathy, Punit Ashok Rathod, Jayprakash Thakur, Arvind Sundaram, Ajay Sharma, Nikita Bipin Ambasana, Satish Ramachandra, Vishram Shriram Pandit
  • Publication number: 20220187552
    Abstract: This document discusses, among other things, systems and methods to transmit laser energy to a first hollow-core transmission medium of a board , and to detect laser energy from a second hollow-core transmission medium of the board using a photodiode of the communication interface. A system can include a communication interface configured to be coupled to a chip carrier, the communication interface including a laser emitter configured to transmit laser energy to a first hollow-core transmission medium of a board, and a photodiode configured to detect laser energy communicated from a second hollow-core transmission. The system can further include the chip carrier and the board, as well as one or more alignment features to position the laser emitter and the photodiode over inputs of the first and second hollow-core transmission mediums, and an optically clear resin optionally between the communication interface and the board.
    Type: Application
    Filed: March 3, 2022
    Publication date: June 16, 2022
    Inventor: Arvind Sundaram
  • Patent number: 11294127
    Abstract: This document discusses, among other things, systems and methods to transmit laser energy to a first hollow-core transmission medium of a board, and to detect laser energy from a second hollow-core transmission medium of the board using a photodiode of the communication interface. A system can include a communication interface configured to be coupled to a chip carrier, the communication interface including a laser emitter configured to transmit laser energy to a first hollow-core transmission medium of a board, and a photodiode configured to detect laser energy communicated from a second hollow-core transmission. The system can further include the chip carrier and the board, as well as one or more alignment features to position the laser emitter and the photodiode over inputs of the first and second hollow-core transmission mediums, and an optically clear resin optionally between the communication interface and the board.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Publication number: 20220059302
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a keycap with photoluminescent material, a light energy source to emit light energy at a wavelength to activate the photoluminescent material, and an ambient light sensor to activate the light energy source during low ambient light conditions. In an example, the photoluminescent material is quantum dot material.
    Type: Application
    Filed: September 25, 2021
    Publication date: February 24, 2022
    Applicant: INTEL CORPORATION
    Inventors: Khader Shareef Ismail Sherif, Arvind Sundaram, Rajesh Chandran, Charuhasini Sunder Raman
  • Patent number: 11126235
    Abstract: A first apparatus is disclosed, including: a detection circuitry to detect a first voltage level of reference current received from a second apparatus, where the second apparatus is to provide the reference current at a second voltage level; and a controller to negotiate a power transmission agreement with the second apparatus for transmission of power from the second apparatus to the first apparatus, based at least in part on a difference between the first voltage level and the second voltage level.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: September 21, 2021
    Assignee: Intel Corporation
    Inventors: Jagadish Vasudeva Singh, Tarakesava Reddy Koki, Arvind Sundaram, Vinaya Kumar Chandrasekhara
  • Patent number: 11119542
    Abstract: Particular embodiments described herein provide for an electronic device that includes a first housing, a second housing, and a hinge. The hinge rotatably couples the first housing to the second housing and includes an off-center lobe that generates a field. The second housing includes a detection engine to detect a strength of the field generated by the off-center lobe and determines a hinge angle (or a position of the first housing relative to the second housing) based on the detected strength of the field generated by the off-center lobe.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Arvind Sundaram, Samarth Alva, Yogesh Channaiah
  • Publication number: 20210278612
    Abstract: This document discusses, among other things, systems and methods to transmit laser energy to a first hollow-core transmission medium of a board, and to detect laser energy from a second hollow-core transmission medium of the board using a photodiode of the communication interface. A system can include a communication interface configured to be coupled to a chip carrier, the communication interface including a laser emitter configured to transmit laser energy to a first hollow-core transmission medium of a board, and a photodiode configured to detect laser energy communicated from a second hollow-core transmission. The system can further include the chip carrier and the board, as well as one or more alignment features to position the laser emitter and the photodiode over inputs of the first and second hollow-core transmission mediums, and an optically clear resin optionally between the communication interface and the board.
    Type: Application
    Filed: September 29, 2016
    Publication date: September 9, 2021
    Inventor: Arvind Sundaram
  • Publication number: 20210218102
    Abstract: Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Prasanna Pichumani, Jagadish Vasudeva Singh, Prakash Kurma Raju, Vinay Kumar Chandrasekhara, Arvind Sundaram, Naoki Matsumura
  • Publication number: 20210218845
    Abstract: Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Aleksander Magi, Soethiha Soe, Marko Bartscherer, Prakash Kurma Raju, Arvind Sundaram, Ayeshwarya B. Mahajan, Akarsha Rajeshwar Kadadevaramath, Gokul V. Subramaniam, Raghavendra Doddi, Prasanna Pichumani
  • Patent number: 11054870
    Abstract: Particular embodiments described herein provide for an electronic device that can include a first housing, a second housing, where the second housing is rotatably coupled to the first housing using a hinge, and at least one thermal sensor to detect the position of a user relative to the electronic device, wherein the thermal sensor includes an array of thermopiles.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: July 6, 2021
    Assignee: Intel Corporation
    Inventors: Gokul V. Subramaniam, Arvind Sundaram
  • Publication number: 20210203053
    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.
    Type: Application
    Filed: September 24, 2020
    Publication date: July 1, 2021
    Inventors: Ramaswamy Parthasarathy, Punit Ashok Rathod, Jayprakash Thakur, Arvind Sundaram, Ajay Sharma, Nikita Bipin Ambasana, Satish Ramachandra, Vishram Shriram Pandit
  • Patent number: 10903913
    Abstract: A system includes a communication interface including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of: a laser emitter configured to transmit laser energy across an air gap to a separate device; or a photodiode configured to detect laser energy received across the air gap from the separate device.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: January 26, 2021
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 10847859
    Abstract: Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Arvind Sundaram, Ramaswamy Parthasarathy, Vikas Mishra
  • Publication number: 20200329583
    Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.
    Type: Application
    Filed: June 27, 2020
    Publication date: October 15, 2020
    Inventors: Krishnakumar Varadarajan, Arvind Sundaram, Srinivasarao Konakalla, Yogesh Channaiah, Satyajit Siddharay Kamat, Raghavendra N
  • Patent number: 10756824
    Abstract: A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: August 25, 2020
    Assignee: Intel Corporation
    Inventor: Arvind Sundaram
  • Patent number: 10747284
    Abstract: An apparatus is provided which includes: an input/output (I/O) port to be coupled to a device external to the apparatus; a battery having an output node; a voltage regulator to selectively supply power from the I/O port to the battery, to charge the battery; and a switch coupled between the I/O port and the output node, wherein the switch is to selectively allow flow of current from the device to the output node by bypassing the voltage regulator.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Tarakesava Reddy Koki, Jagadish Vasudeva Singh, Arvind Sundaram, Vinaya Kumar Chandrasekhara, Shobhit Chahar