Abstract: A system includes a communication interface including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of: a laser emitter configured to transmit laser energy across an air gap to a separate device; or a photodiode configured to detect laser energy received across the air gap from the separate device.

Abstract: An apparatus comprises a plurality of laser emitters each having a different center frequency; a plurality of photodiodes arranged to receive laser energy from the laser emitters via an air space; and a plurality of laser bandpass filters arranged between the plurality of laser emitters and the plurality of photodiodes, wherein each one of the photodiodes is arranged to receive laser energy respectively via one of the laser bandpass filters, and wherein each laser bandpass filter has one of the different center frequencies included in a passband of the laser bandpass filter and has the other of the different center frequencies excluded from the passband.

Abstract: An apparatus comprises a substrate; a laser emitter arranged on the substrate, wherein laser energy emitted by the laser emitter includes a center frequency; a photodiode arranged on the substrate; and a laser bandpass filter arranged above the photodiode, wherein the bandpass filter has a passband that excludes the center frequency of the laser energy.

Abstract: An apparatus comprises a substrate; a laser emitter arranged on the substrate; a photodiode arranged on the substrate; resin encapsulating the laser emitter and the photodiode, wherein the resin includes a top surface above the laser emitter and photodiode; and a lens arranged on the top surface of the resin.

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Abstract: Techniques and mechanisms for delivering power with a transformer. In an embodiment, the transformer comprises a dielectric slab structure, a first conductor, a layer of ferromagnetic material disposed around first windings of the first conductor, and a second conductor which forms second windings around the layer of ferromagnetic material. For one of the first windings or one of the second windings, a cross-section of the winding conforms to a rectangle, wherein a width of the cross-section which is more than a height of the cross-section. A ferromagnetic material of the ferrite layer extends between successive ones of the first windings. In another embodiment, a volume fraction of the ferromagnetic material in the ferrite layer is equal to or less than ninety seven percent (97%).

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly comprises a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.

Abstract: A communication interface apparatus can include a free-air optical transceiver for communicating signals at a first speed and an electrical contact for communicating at least one of: signals at a second speed or power. The communication interface can include a substrate having a plurality of electrical circuits. The optical transceiver can be electrically coupled to the substrate and configured to transceive an optical signal in free air. In an example, the optical transceiver can convert the optical signal to the signal at the first speed, such as an electrical signal. In an example, the electrical contact can be communicatively coupled to the substrate. The electrical contact and the free-air optical transceiver can be attached to the substrate in fixed relation with respect to one another.

Abstract: Embodiments of the invention describe apparatuses, systems and methods for capturing, selecting and analyzing image data of a user of a computing device display from multiple viewpoints. Embodiments of the invention capture or receive data comprising a plurality of images from an image capture system, wherein the plurality of images comprises images of a user of a computing system from multiple viewpoints. A gaze direction of the user with respect to the display is determined based, at least in part, on the plurality of images. Embodiments further determine a target area on the computing device display based, at least in part, on the determined gaze direction of the user, and execute an application operation in response to determining the target area of the user's gaze.

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Abstract: Techniques and mechanisms for providing connectivity to integrated circuitry using a lead frame. In an embodiment, the lead frame includes a conductor which forms a frame portion and a plurality of branch structures each extending from the frame portion. The frame portion is disposed in a region between a first plane and a second plane, wherein a portion of a first branch structure extends outside of the region. In another embodiment, the plurality of branch structures are coupled to integrated circuitry, and the frame portion is subsequently removed to form from the plurality of branch structures a plurality of leads. Removal of the frame portion forms a first lead from the first branch structure, wherein the first lead extends over or under one or more other structures in the region between the first plane and the second plane.

Abstract: Techniques and mechanisms for providing a flexible inductor. In an embodiment, the flexible inductor comprises a metal foil or other planar conductor, and inductive bodies disposed on opposite respective sides of the planar conductor. The inductive bodies each comprise a respective flexible suspension media and ferromagnetic particles disposed therein. A thickness of the planar conductor is in a range of 0.1 millimeters (mm) to 0.3 mm. In another embodiment, different layers of one inductive body vary from one another with respect to a thickness, a ferromagnetic material, a suspension media, an average size of ferromagnetic particles or a volume fraction of ferromagnetic particles.

Abstract: Techniques and mechanisms for providing an inductor with integrated heat dissipation structures. In an embodiment, the inductor includes an electrical conductor and a ferromagnetic body, wherein a portion of the conductor extends through the ferromagnetic body. The conductor further includes other portions which extend from the ferromagnetic body, wherein the other portions each further form or couple to respective fin structures. In another embodiment, the inductor includes multiple distinct ferromagnetic bodies, where different portions of the conductor variously extend each through a respective one of the ferromagnetic bodies.

Abstract: Techniques and mechanisms for delivering power with a transformer. In an embodiment, the transformer comprises a dielectric slab structure, a first conductor, a layer of ferromagnetic material disposed around first windings of the first conductor, and a second conductor which forms second windings around the layer of ferromagnetic material. For one of the first windings or one of the second windings, a cross-section of the winding conforms to a rectangle, wherein a width of the cross-section which is more than a height of the cross-section. A ferromagnetic material of the ferrite layer extends between successive ones of the first windings. In another embodiment, a volume fraction of the ferromagnetic material in the ferrite layer is equal to or less than ninety seven percent (97%).

Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

Abstract: The present disclosure relates to devices and techniques for an interconnect bridge to communicatively couple two or more dies. In an example, the interconnect bridge can include a base element having a first material. A first layer, including a second material, can be attached to the base element. A second layer, including a third material, can be disposed on the first layer. A two-dimensional electron gas (2DEG) can be located between the first layer and the second layer. A first contact, adapted to electrically couple to the first die, can be disposed in a first side of the 2DEG. A second contact, adapted to electrically couple to the second die, can be disposed in a second side of the 2DEG. Accordingly, the first die can be electrically coupled to the second die through the 2DEG.

Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.

Abstract: Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide techniques and configurations for a cable assembly for single wire communications (SWC). In one instance, the cable assembly may comprise a wire having a wire end to couple with a signal launcher of an electronic device, and a first cover portion to house a first portion of the wire that extends from the wire end. The first cover portion may comprise a shape to conform to a shape of the signal launcher, and may be fabricated of a material with a dielectric constant above a threshold. The assembly may further comprise a second cover portion coupled with the first cover portion to house a second portion of the wire that extends from the first wire portion and protrudes from the first cover portion. The second cover portion may be fabricated of a ferrite material. Other embodiments may be described and/or claimed.