Patents by Inventor Ashish Bhatnagar
Ashish Bhatnagar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110217208Abstract: A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle.Type: ApplicationFiled: March 4, 2011Publication date: September 8, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Kadthala R. NARENDRNATH, Ashish BHATNAGAR, Daniel L. MARTIN, Robert T. HIRAHARA, Gangadhar SHEELAVANT
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Publication number: 20110180983Abstract: The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring.Type: ApplicationFiled: January 25, 2011Publication date: July 28, 2011Applicant: APPLIED MATERIALS, INC.Inventors: SANDHYA ARUN, Prashanth Kodigepalli, Padma Gopalakrishnan, Ashish Bhatnagar, Dan Martin, Christopher Heath John Hossack
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Publication number: 20110114519Abstract: A process has been developed that significantly reduces moisture absorption of components, resulting in a component which is less susceptible to moisture and adsorption/absorption effects to the components functionality. In one embodiment, a component having reduced susceptibility to moisture exposure includes a component disposed in an air-tight package, the component having a blocking gas disposed in pores on a surface of the component. In another embodiment, a method for preparing a component having reduced susceptibility to moisture exposure includes driving water from a component in a controlled environment, exposing the component in the controlled environment to a blocking gas, removing the component in the controlled environment, and optionally sealing the component in an air-tight package.Type: ApplicationFiled: November 11, 2010Publication date: May 19, 2011Applicant: APPLIED MATERIALS, INC.Inventors: KADTHALA R. NARENDRNATH, ASHISH BHATNAGAR
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Publication number: 20110105000Abstract: A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.Type: ApplicationFiled: September 27, 2010Publication date: May 5, 2011Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Ashish Bhatnagar
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Publication number: 20110013669Abstract: Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.Type: ApplicationFiled: July 17, 2010Publication date: January 20, 2011Applicant: APPLIED MATERIALS, INC.Inventors: GOVINDA RAJ, Bopanna Ichettria, Ashish Bhatnagar, Cariappa Baduvamanda
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Publication number: 20100330879Abstract: In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and a solid light-transmissive window is secured in the recess. In another aspect, a polishing pad includes a polishing layer having a polishing surface, and the polishing surface includes a first region having a first plurality of grooves with a first depth extending partially but not entirely through the polishing layer and a second region surrounded by the first region and having a second plurality of grooves with a second depth extending partially but not entirely through the polishing layer, the second depth greater than the first depth.Type: ApplicationFiled: June 28, 2010Publication date: December 30, 2010Inventors: Young J. Paik, Christopher R. Mahon, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Publication number: 20100311311Abstract: A flexible membrane includes a horizontal central portion, a vertical portion coupled to the central portion, a thick rim portion coupled to the vertical portion, and an extension coupled to the thick rim portion. An outer surface of the horizontal central portion provides a mounting surface configured to receive a substrate. The thick rim portion has a thickness that is greater than a portion directly adjacent to the thick rim portion. The thick rim portion is between the extension and the vertical portion and a greatest dimension of the extension is less than the thickness of the thick rim portion.Type: ApplicationFiled: December 4, 2009Publication date: December 9, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Publication number: 20100267122Abstract: The disclosure encompasses, among other aspects, mixed algal populations able to survive and proliferate on culture media that have a high proportion of carpet industry wastewater. Embodiments further encompass methods of cultivating mixed populations of freshwater and marine alga comprising a plurality of genera and species to provide a biomass from which may be extracted lipids, or converted into biodiesel by such procedures as pyrolysis. Lipid material extracted from the algae may be converted to biodiesel or other organic products. A combined stream of carpet industry untreated wastewater with 10-15% sewage was found to be a good growth medium for cultivation of microalgae and biodiesel production. Native algal strains were isolated from carpet wastewater inoculated with mixed populations derived from environments exposed to such wastewater. Both fresh water and marine algae showed good growth in wastewaters.Type: ApplicationFiled: April 8, 2010Publication date: October 21, 2010Inventors: Senthil Chinnasamy, Ashish Bhatnagar, Ryan W. Hunt, Ronald Claxton, Mark Marlowe, Keshav C. Das
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Publication number: 20100173566Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.Type: ApplicationFiled: December 4, 2009Publication date: July 8, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Young J. Paik, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
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Patent number: 7732056Abstract: A method of providing a corrosion-resistant coating on a surface of an aluminum component comprises anodizing the surface of the aluminum component to form an anodized aluminum oxide layer and sputter coating a sputtered layer on the anodized aluminum oxide layer. A coated aluminum component can be used in a substrate processing chamber and comprises an aluminum body, an anodized aluminum oxide layer formed on the aluminum body, and a sputtered layer comprising aluminum oxide on the anodized aluminum oxide layer.Type: GrantFiled: January 18, 2005Date of Patent: June 8, 2010Assignee: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Laxman Murugesh
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Publication number: 20090305609Abstract: The present invention relates to methods and apparatus for improving productivity of chemical mechanical polishing (CMP) processes and lowering operating costs of CMP systems. Embodiments of the present invention provide a method for improving the ratio of the layer thickness of composite polishing pads for improved removal rates. Embodiments of the present also provide specific polishing pad identification for monitoring and controlling processes developed for the specific pad to improve overall productivity and reduce downtime of the CMP system.Type: ApplicationFiled: June 3, 2009Publication date: December 10, 2009Applicant: APPLIED MATERIALS, INC.Inventors: MICHAEL E. KHAU, Nishal Shah, Ashish Bhatnagar
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Publication number: 20090278081Abstract: A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material.Type: ApplicationFiled: March 25, 2009Publication date: November 12, 2009Applicant: APPLIED MATERIALS, INC.Inventors: Hichem M'Saad, Lakshmanan Karuppiah, Hung Chih Chen, Jeonghoon Oh, Robert Lum, Stan D. Tsai, Cassio Conceicao, Ashish Bhatnagar, Michael Perry, Kadthala Narendrnath, Yosi Shacham-Diamand
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Publication number: 20090242125Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.Type: ApplicationFiled: March 23, 2009Publication date: October 1, 2009Inventors: Young J. Paik, Melvin Barrentine, Abhijit Y. Desai, Hai Nguyen, Ashish Bhatnagar, Rajkumar Alagarsamy
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Publication number: 20090199765Abstract: The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck.Type: ApplicationFiled: February 11, 2008Publication date: August 13, 2009Inventor: ASHISH BHATNAGAR
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Publication number: 20070014949Abstract: A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed by conventional means, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.Type: ApplicationFiled: July 13, 2005Publication date: January 18, 2007Inventors: Ashish Bhatnagar, Laxman Murugesh, Padma Gopalakrishnan
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Publication number: 20060159940Abstract: A method of providing a corrosion-resistant coating on a surface of an aluminum component comprises anodizing the surface of the aluminum component to form an anodized aluminum oxide layer and sputter coating a sputtered layer on the anodized aluminum oxide layer. A coated aluminum component can be used in a substrate processing chamber and comprises an aluminum body, an anodized aluminum oxide layer formed on the aluminum body, and a sputtered layer comprising aluminum oxide on the anodized aluminum oxide layer.Type: ApplicationFiled: January 18, 2005Publication date: July 20, 2006Inventors: Ashish Bhatnagar, Laxman Murugesh
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Patent number: 7045020Abstract: Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.Type: GrantFiled: May 22, 2003Date of Patent: May 16, 2006Assignee: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Charles S. Kunze
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Patent number: 6824748Abstract: A substrate processing apparatus has a process chamber with a substrate support, a gas supply to introduce a gas into the chamber, and a gas energizer to energize the gas in the processing of a substrate, thereby generating an effluent gas. A catalytic reactor has an effluent gas inlet to receive the effluent gas and an effluent gas outlet to exhaust treated effluent gas. A heater is adapted to heat the effluent gas in the catalytic reactor. The heated catalytic treatment of the effluent gas abates the hazardous gases in the effluent. An additive gas source and a prescrubber may also be used to further treat the effluent.Type: GrantFiled: June 1, 2001Date of Patent: November 30, 2004Assignee: Applied Materials, Inc.Inventors: Tony S. Kaushal, Shamouil Shamouilian, Harshad Borgaonkar, Kwok Manus Wong, Michael G. Chafin, Ashish Bhatnagar
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Publication number: 20040231706Abstract: Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.Type: ApplicationFiled: May 22, 2003Publication date: November 25, 2004Applicant: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Charles S. Kunze
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Patent number: 6673323Abstract: A method for reducing hazardous gases exhausted from a process chamber includes an effluent gas treatment system with a gas energizing reactor and an additive gas source. Additive gas comprising reactive gas is introduced into the effluent from the process chamber in a volumetric flow rate in relation to the hazardous gas content in the effluent.Type: GrantFiled: March 24, 2000Date of Patent: January 6, 2004Assignee: Applied Materials, Inc.Inventors: Ashish Bhatnagar, Tony S. Kaushal, Kwok Manus Wong, Shamouil Shamouilian