Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Abstract: Various methods, carrier media, and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data are provided. One computer-implemented method includes combining pixel-level data acquired for the specimen by a bright field channel and a dark field channel of an inspection system. The method also includes detecting defects on the specimen by applying a two-dimensional threshold to the combined data. The two-dimensional threshold is defined as a function of a threshold for the data acquired by the bright field channel and a threshold for the data acquired by the dark field channel.

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for determining a position of inspection data in design data space includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The method also includes determining positions of the alignment sites on the wafer in design data space based on positions of the predetermined alignment sites in the design data space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the design data space based on the positions of the alignment sites on the wafer in the design data space. In one embodiment, the position of the inspection data is determined with sub-pixel accuracy.

Abstract: Systems and methods for detecting defects on a wafer and generating inspection results for the wafer are provided. One method includes detecting defects on a wafer by comparing output generated by scanning of the wafer performed by an inspection system to one or more defect detection thresholds. The method also includes sampling outliers in the output by selecting the output having the highest values from bins defined based on one or more predetermined criteria. In addition, the method includes selecting a portion of the sampled outliers based on wafer-level analysis of the sampled outliers. The method further includes generating inspection results for the wafer by combining information about the selected portion of the sampled outliers with information about the defects detected using the one or more defect detection thresholds.

Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.

Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.

Abstract: Systems and methods for creating inspection recipes are provided. One computer-implemented method for creating an inspection recipe includes acquiring a first design and one or more characteristics of output of an inspection system for a wafer on which the first design is printed using a manufacturing process. The method also includes creating an inspection recipe for a second design using the first design and the one or more characteristics of the output acquired for the wafer on which the first design is printed. The first and second designs are different. The inspection recipe will be used for inspecting wafers after the second design is printed on the wafers using the manufacturing process.

Abstract: Various methods, carrier media, and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data are provided. One computer-implemented method includes combining pixel-level data acquired for the specimen by a bright field channel and a dark field channel of an inspection system. The method also includes detecting defects on the specimen by applying a two-dimensional threshold to the combined data. The two-dimensional threshold is defined as a function of a threshold for the data acquired by the bright field channel and a threshold for the data acquired by the dark field channel.

Abstract: Various methods and systems for determining a position of inspection data in design data space are provided. One computer-implemented method includes determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by imaging the wafer. The method also includes aligning the centroid to a centroid of a geometrical shape describing the alignment target. In addition, the method includes assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space. The method further includes determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for determining a position of inspection data in design data space includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The method also includes determining positions of the alignment sites on the wafer in design data space based on positions of the predetermined alignment sites in the design data space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the design data space based on the positions of the alignment sites on the wafer in the design data space. In one embodiment, the position of the inspection data is determined with sub-pixel accuracy.

Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

Abstract: Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.

Abstract: Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.

Abstract: The present invention provides a process for the preparation of a 5-substituted-1-(4-fluorophenyl)-1,3-dihydro-isoben-zofuran of Formula (2), an intermediate for the manufacture of citalopram, which process comprises: (a) carrying out a Grignard reaction on a corresponding 5-substituted phthalide of Formula (3) in a co-solvent system, comprising adding (i) prepared 4-fluorophenyl magnesium halide in an ether solvent to (ii) the 5-substituted phthalide in a suitable organic co-solvent to the ether solvent, to form a corresponding 4-substituted-2-hydroxymethyl-4?-fluorobenzophenone of Formula (4); (b) carrying out a ketone reduction of the 4-substituted-2-hydroxymethyl-4?-fluorobenzophenone of Formula (4) following the Grignard reaction, to form a corresponding 4-substituted-2-hydroxymethylphenyl-1-(4-fluorophenyl) methanol of Formula (5); and (c) carrying out a cyclisation reaction on the 4-substituted-2 hydroxymethylphenyl-1-(4-fluorophenyl) methanol of Formula (5) following the reduction reaction, to form s

Abstract: A method is provided for the isolation of high purity crystalline citalopram (1-[3-dimethylamino)propyl]-1-(4-fluorophenyl)-1,3-dihydro-5-isobenzofurancarbonitrile) base directly from the alkylation reaction mixture of 5-cyanophthalane with N,N-dimethylaminopropylchloride in a polar aprotic solvent using a strong base. The method comprises: (a) diluting the reaction mixture with ice cold water and extracting the resulting mixture with a water-immiscible organic solvent; (b) re-extracting the water-immiscible organic solvent extract with an aqueous acid; (c) diluting the aqueous acid extract with a substantially equal volume of a water miscible organic solvent, based on the volume of water in the aqueous acid extract; (d) adjusting the pH to basic with an inorganic base to precipitate free crystalline base, and (e) further isolating the precipitated free crystalline base by filtration.

Abstract: A software system and method is disclosed for creating analytical graphics such as bar charts and the like with greater flexibility in an object-oriented Window® environment. The software is particularly applicable to analyzing production data in semiconductor quality control. The user customizes the analytical tools by selecting production parameters from a dialog box, and creates flowcharts on the computer display representing the sequence of production variables and production functions previously selected. The software is set up with a macro recording function to remember the production keystrokes previously selected. The analytical sequence represented by the flowchart is automatically executed whenever it is selected by the user, or this sequence can be preprogrammed to run at specified intervals in the future.

Abstract: A software system and method is disclosed for extending classification attributes in the analysis of production data. The software operates in an object-oriented Windows® environment with increased flexibility because it permits the user to add classifications by dragging and dropping with a computer mouse. Thus, the system can be changed without reprogramming the software code, and is not limited by preprogrammed classifications. The classifications are preferably cluster classifications of defects in semiconductor processing such as scratches, particles, pinholes and blowouts. When a cluster classification is executed, a production map is filtered to remove the non-defect data according to the selected classification; the defect attribute is then readily visible. The filtered production maps may also be color coded for better visibility so that a plurality of corresponding defects in the map are visible in a plurality of corresponding colors.

Abstract: A software system and method is disclosed for creating analytical graphics such as bar charts and the like with greater flexibility in an object-oriented Window.RTM. environment. The software is particularly applicable to analyzing production data in semiconductor quality control. The user customizes the analytical tools by selecting production parameters from a dialog box, and creates flowcharts on the computer display representing the sequence of production variables and production functions previously selected. The software is set up with a macro recording function to remember the production keystrokes previously selected. The analytical sequence represented by the flowchart is automatically executed whenever it is selected by the user, or this sequence can be preprogrammed to run at specified intervals in the future.