Abstract: A monolithic stacked integrated circuit (IC) is provided with a known-good-layer (KGL) test circuit and a scan segment in one of its upper layers. The test circuit includes a plurality of inputs, outputs, and multiplexers coupled to the scan segment and to a second layer of the IC. The test circuit further includes a plurality of control elements such that scan testing of the stacked IC may be conducted on a layer-by-layer basis.

Abstract: Provided is a system that includes a monitoring unit, processing units, and peripheral units. Each of the processing units is linked to the monitoring unit and each of the peripheral units is also linked to the monitoring unit. Each of the processing units is configured to transmit requests to and subsequently receive responses from at least one of the peripheral units through the monitoring unit. The monitoring unit is configured to measure and store delays between the responses and the respective requests.

Abstract: A method of transmitting data is disclosed. At least one system block of a system-on-chip (SoC) is modeled at an untimed functional level in first and second untimed functional models. First and second transaction level (TL) models of the at least one system block system block are modeled at a transaction level (TL) using the first and second untimed functional models, respectively. First and second cycle accurate (CA) models are modeled at a cycle accurate (CA) level using the first and second TL models, respectively. Data is transmitted from the first untimed functional model to the first CA model, from the first CA model to the second CA model via a CA bus, and from the second CA model to the second untimed functional model.

Abstract: A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.

Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.

Abstract: A method of transmitting data is disclosed. At least one system block of a system-on-chip (SoC) is modeled at an untimed functional level in first and second untimed functional models. First and second transaction level (TL) models of the at least one system block system block are modeled at a transaction level (TL) using the first and second untimed functional models, respectively. First and second cycle accurate (CA) models are modeled at a cycle accurate (CA) level using the first and second TL models, respectively. Data is transmitted from the first untimed functional model to the first CA model, from the first CA model to the second CA model via a CA bus, and from the second CA model to the second untimed functional model.

Abstract: A monolithic stacked integrated circuit (IC) is provided with a known-good-layer (KGL) test circuit and a scan segment in one of its upper layers. The test circuit includes a plurality of inputs, outputs, and multiplexers coupled to the scan segment and to a second layer of the IC. The test circuit further includes a plurality of control elements such that scan testing of the stacked IC may be conducted on a layer-by-layer basis.

Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.

Abstract: Provided is a method of assigning a first set of probe pads to an interposer for maximizing a defect coverage for the interposer. The interposer includes a second set of nets and the defect coverage is based on a ratio between a tested net length and an overall net length. The method includes processing the second set such that every net interconnecting more than two micro-bumps is divided into a plurality of nets and every two of the more than two micro-bumps are interconnected by one of the plurality of nets. The method further includes calculating an untested length of each net in the second set; selecting a first net from the second set with the maximum untested length; selecting two probe pads from the first set based on a user-defined cost function; and connecting the two probe pads to the first net with two dummy nets.

Abstract: Systems and methods are disclosed for testing a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack, particularly where the defect is located in the inter-die data transfer path. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.

Abstract: A system for functional verification of a chip design includes the chip design, a test generator, a test bench, a verification tool, and a coverage tool. The coverage tool is configured to receive chip design, user input, and coverage files from the verification tool to generate information for the test generator to improve the test coverage of the verification tool. The method includes receiving a chip design, functionally testing the chip design, generating coverage files, receiving user options, including a coverage basis, a report basis, and a defined coverage, calculating coverage impact and new overall coverage using the defined coverage and coverage files, and ranking each report basis according to coverage impact of each coverage basis.

Abstract: Systems and methods are disclosed for testing a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack, particularly where the defect is located in the inter-die data transfer path. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.

Abstract: A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.

Abstract: A method for dynamic frequency scaling (DFS) on the electronic systems level (ESL). The method can run in a virtual environment and dynamically scale the frequency of a virtual component based on a first transaction time and a second transaction time.

Abstract: A method for verifying functionality of a system-on-chip (SoC) comprises modeling a system block in first and second models at a first level and a second level lower than the first level, respectively. A stimulus transaction is generated at a first testbench at the first level. The stimulus transaction is transmitted from the first testbench to a second testbench at the second level. The stimulus transaction is transformed into a first response transaction, using the first model, at the first level. The stimulus transaction received at the second testbench is transformed into a second response transaction, using the second model, at the second level. Functionality of the SoC at the first and second levels is verified based on the first and second response transactions.

Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.

Abstract: A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.

Abstract: A system includes an automated place and route tool to generate a layout of an integrated circuit (IC) die based on a gate level circuit description. A machine readable persistent storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second IC dies, respectively, and a second portion encoded with a second gate level description of the plurality of circuit patterns received from the tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented verification module is provided for comparing the first and second gate level descriptions and outputting an error report if the second gate level description has an error. The verification module outputs a verified second gate-level description of the first and second circuit patterns.

Abstract: A method for verifying functionality of a system-on-chip (SoC) comprises modeling a system block in first and second models at a first level and a second level lower than the first level, respectively. A stimulus transaction is generated at a first testbench at the first level. The stimulus transaction is transmitted from the first testbench to a second testbench at the second level. The stimulus transaction is transformed into a first response transaction, using the first model, at the first level. The stimulus transaction received at the second testbench is transformed into a second response transaction, using the second model, at the second level. The first and second response transactions are stored in first and second response queues, respectively. Functionality of the SoC at the first and second levels is verified based on a comparison at the first testbench between head entries of the first and second response queues.

Abstract: A method of transmitting data is disclosed. At least one system block of a system-on-chip (SoC) is modeled at an untimed functional level in first and second untimed functional models. First and second transaction level (TL) models of the at least one system block system block are modeled at a transaction level (TL) using the first and second untimed functional models, respectively. First and second cycle accurate (CA) models are modeled at a cycle accurate (CA) level using the first and second TL models, respectively. Data is transmitted from the first untimed functional model to the first CA model, from the first CA model to the second CA model via a CA bus, and from the second CA model to the second untimed functional model.