Patents by Inventor Ashok Prabhu
Ashok Prabhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11906533Abstract: A chemical sensing system is described. The chemical sensing system can include a plurality of sensors arranged on at least one substrate. The sensors may have differing sensitivities to sense different analytes, and may each be configured to output a signal in response to sensing one or more of the different analytes. The chemical sensing system can further include a computer processor programmed to receive the signals output from the plurality of sensors. The computer processor may be further programmed to determine a concentration of analytes in the sample based, at least in part, on the received signals and a model relating the signals or information derived from the signals to an output representation having bases corresponding to analytes.Type: GrantFiled: June 28, 2019Date of Patent: February 20, 2024Assignee: Stratuscent Inc.Inventors: Mojtaba Khomami Abadi, Amir Bahador Gahroosi, Matthew V. Gould, Ashok Prabhu Masilamani
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Publication number: 20240055331Abstract: An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.Type: ApplicationFiled: August 15, 2022Publication date: February 15, 2024Inventors: Hau Nguyen, Ashok Prabhu, Kurt Sincerbox
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Patent number: 11788985Abstract: Some embodiments presented here relate to chemical sensors with enhanced sensitivity and selectivity. In an embodiment, the sensor is a composite thin film that comprises (e.g., is made of) chemically-modified carbon black and a chemically-sensitive polymer base. By grafting gold nanoparticles on carbon black, the number of binding sites on the sensor thin film is increased, thereby increasing the sensitivity. Furthermore, ligand attached gold nanoparticles are grafted on carbon black to increase the binding sites on the sensor thin film in some embodiments, which results in increased sensitivity as well as improved selectivity in some cases.Type: GrantFiled: February 7, 2019Date of Patent: October 17, 2023Assignee: Stratuscent Inc.Inventors: Nicolas Levaray, Jayan Ozhikandathil, Ashok Prabhu Masilamani, Tullio Panarello
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Patent number: 11644451Abstract: Described herein is a chemical sensing system that can be deployed in an environment and automatically monitor the environment. The chemical sensing system includes one or more chemical sensing units with sensing elements that sense chemicals in the environment. The chemical sensing system analyzes measured values output by the sensing elements to identify patterns indicative of events. After identifying an event, the chemical sensing system may generate an inference about the environment using measured values output by the sensing elements during the event.Type: GrantFiled: March 9, 2021Date of Patent: May 9, 2023Assignee: Stratuscent, Inc.Inventors: Amir Bahador Gahroosi, Neven Maric, Ashok Prabhu Masilamani, Mojtaba Khomami Abadi
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Patent number: 11450638Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.Type: GrantFiled: September 1, 2020Date of Patent: September 20, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dibyajat Mishra, Ashok Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino, Hau Nguyen
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Patent number: 11410875Abstract: An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).Type: GrantFiled: December 19, 2018Date of Patent: August 9, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Hau Thanh Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar, Masamitsu Matsuura, Kengo Aoya, Mutsumi Masumoto
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Patent number: 11367699Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.Type: GrantFiled: September 1, 2020Date of Patent: June 21, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar, Yi Yan, Hau Nguyen
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Publication number: 20210285923Abstract: Described herein is a chemical sensing system that can be deployed in an environment and automatically monitor the environment. The chemical sensing system includes one or more chemical sensing units with sensing elements that sense chemicals in the environment. The chemical sensing system analyzes measured values output by the sensing elements to identify patterns indicative of events. After identifying an event, the chemical sensing system may generate an inference about the environment using measured values output by the sensing elements during the event.Type: ApplicationFiled: March 9, 2021Publication date: September 16, 2021Inventors: Amir Bahador Gahroosi, Neven Maric, Ashok Prabhu Masilamani, Mojtaba Khomami Abadi
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Patent number: 11106977Abstract: Systems and methods for training models across multiple sensing units in a chemical sensing system are described. The chemical sensing system comprises at least one computer processor and at least one computer readable medium including instructions that, when executed by the at least one computer processor, cause the chemical sensing system to perform a training process. The training process comprises accessing a training dataset including first values representing first signals output from a first chemical sensing unit of multiple chemical sensing units, and second values representing second signals output from a second chemical sensing unit of the multiple chemical sensing units, and training a set of models to relate the first values and the second values to a mutual latent representation using the training dataset.Type: GrantFiled: February 21, 2020Date of Patent: August 31, 2021Assignee: Stratuscent Inc.Inventors: Mojtaba Khomami Abadi, Amir Bahador Gahroosi, Ashok Prabhu Masilamani, Neven Maric
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Patent number: 11021786Abstract: In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 ?m on a surface of the copper corrosion inhibitor layer.Type: GrantFiled: December 4, 2018Date of Patent: June 1, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Luu Thanh Nguyen, Mahmud Halim Chowdhury, Ashok Prabhu, Anindya Poddar
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Publication number: 20210035932Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.Type: ApplicationFiled: September 1, 2020Publication date: February 4, 2021Inventors: Hiroyuki SADA, Shoichi IRIGUCHI, Genki YANO, Luu Thanh NGUYEN, Ashok PRABHU, Anindya PODDAR, Yi YAN, Hau NGUYEN
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Publication number: 20200402938Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.Type: ApplicationFiled: September 1, 2020Publication date: December 24, 2020Inventors: Dibyajat Mishra, Ashok Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino, Hau Nguyen
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Patent number: 10763230Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.Type: GrantFiled: December 21, 2018Date of Patent: September 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar, Yi Yan, Hau Nguyen
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Patent number: 10763231Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.Type: GrantFiled: July 27, 2018Date of Patent: September 1, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dibyajat Mishra, Ashok Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino, Hau Nguyen
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Publication number: 20200272900Abstract: Systems and methods for training models across multiple sensing units in a chemical sensing system are described. The chemical sensing system comprises at least one computer processor and at least one computer readable medium including instructions that, when executed by the at least one computer processor, cause the chemical sensing system to perform a training process. The training process comprises accessing a training dataset including first values representing first signals output from a first chemical sensing unit of multiple chemical sensing units, and second values representing second signals output from a second chemical sensing unit of the multiple chemical sensing units, and training a set of models to relate the first values and the second values to a mutual latent representation using the training dataset.Type: ApplicationFiled: February 21, 2020Publication date: August 27, 2020Applicant: Stratuscent Inc.Inventors: Mojtaba Khomami Abadi, Amir Bahador Gahroosi, Ashok Prabhu Masilamani, Neven Maric
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Publication number: 20200203219Abstract: An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).Type: ApplicationFiled: December 19, 2018Publication date: June 25, 2020Inventors: Hau Thanh Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar, Masamitsu Matsuura, Kengo Aoya, Mutsumi Masumoto
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Publication number: 20200203295Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.Type: ApplicationFiled: December 21, 2018Publication date: June 25, 2020Inventors: Hiroyuki SADA, Shoichi IRIGUCHI, Genki YANO, Luu Thanh NGUYEN, Ashok PRABHU, Anindya PODDAR, Yi YAN, Hau NGUYEN
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Publication number: 20200173013Abstract: In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 ?m on a surface of the copper corrosion inhibitor layer.Type: ApplicationFiled: December 4, 2018Publication date: June 4, 2020Inventors: Luu Thanh Nguyen, Mahmud Halim Chowdhury, Ashok Prabhu, Anindya Poddar
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Patent number: 10650957Abstract: Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.Type: GrantFiled: October 31, 2018Date of Patent: May 12, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Yi Yan, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar
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Publication number: 20200135632Abstract: In a described example, an apparatus includes a substrate with a first surface and an opposing second surface. The substrate includes a trench extending into the substrate from the first surface, a die mounting area adjacent to the trench, a first plurality of leads, and a second plurality of leads. The second plurality of leads are spaced from the trench to electrically isolate the second plurality of leads. The apparatus further includes a first mold compound in the trench forming a filled trench and in the space between the trench and the second plurality of leads. A first die is attached to the first surface of the substrate and a second die is attached to a surface of the first mold compound in the filled trench.Type: ApplicationFiled: October 24, 2018Publication date: April 30, 2020Inventors: Dibyajat Mishra, Vivek Arora, Ashok Prabhu, Ken Pham