Patents by Inventor Atsumi Niwa

Atsumi Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11523079
    Abstract: To shorten time required for AD conversion when a solid-state imaging element that detects presence or absence of an address event further captures image data. In a detection block, a first pixel that generates a first analog signal by photoelectric conversion and a second pixel that generates a second analog signal by photoelectric conversion are arrayed. A first analog-digital converter converts the first analog signal into a digital signal on the basis of whether or not a change amount of an incident light amount of the detection block exceeds a predetermined threshold. A second analog-digital converter converts the second analog signal into a digital signal on the basis of whether or not the change amount exceeds the threshold.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: December 6, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Patent number: 11490045
    Abstract: A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: November 1, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Publication number: 20220345645
    Abstract: It is an object to extend event signal detection periods. An imaging device according to the present technology includes a solid-state imaging device including a plurality of pixels each including a light-receiving portion that photoelectrically converts incident light to generate an electrical signal and a detection circuit that executes event signal detection by comparing the amount of change in the electrical signal generated by the light-receiving portion with a predetermined threshold value to obtain a detection result, and a control unit that performs control so that different pixels have different timing for an event detection period to cause the detection circuit to execute the event signal detection.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 27, 2022
    Inventors: ATSUMI NIWA, YUSUKE OIKE
  • Patent number: 11483507
    Abstract: There is provided a solid-state image pickup element including: a photodiode configured to convert incident light into a photocurrent; an amplification transistor configured to amplify a voltage between a gate having a potential depending on the photocurrent and a source having a predetermined reference potential and output the amplified voltage from a drain; and a potential supply section configured to supply an anode of the photodiode and a back-gate of the amplification transistor with a predetermined potential lower than the reference potential.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: October 25, 2022
    Assignee: Sony Semiconductor Solution Corporation
    Inventor: Atsumi Niwa
  • Patent number: 11483509
    Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: October 25, 2022
    Assignee: SONY CORPORATION
    Inventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
  • Patent number: 11470273
    Abstract: An object is to reduce a circuit scale in a solid-state imaging element that detects an address event. The solid-state imaging element is provided with a plurality of photoelectric conversion elements, a signal supply unit, and a detection unit. In this solid-state imaging element, each of the plurality of photoelectric conversion elements photoelectrically converts incident light to generate a first electric signal. Furthermore, in the solid-state imaging element, the detection unit detects whether or not a change amount of the first electric signal of each of the plurality of photoelectric conversion elements exceeds a predetermined threshold and outputs a detection signal indicating a result of the detection result.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: October 11, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Yusuke Oike
  • Publication number: 20220259460
    Abstract: A two-component curing adhesive using a curing reaction between a polyisocyanate composition (X) and a polyol composition (Y), wherein the polyisocyanate composition (X) includes a polyisocyanate (A), the polyol composition (Y) includes a polyol (B), and the polyisocyanate composition. (X) and the polyol composition (Y) each have a Trouton ratio within a range of 4.0 to 8.0.
    Type: Application
    Filed: February 15, 2021
    Publication date: August 18, 2022
    Applicant: DIC Corporation
    Inventors: Kenji Nakamura, Atsumi Sano, Tomoo Okubo, Masahiro Niwa
  • Publication number: 20220259472
    Abstract: A two-component curing adhesive using a curing reaction between a polyisocyanate composition (X) and a polyol composition (Y), wherein the polyisocyanate composition (X) includes a polyisocyanate (A), the polyol composition (Y) includes a polyol (B), and the polyisocyanate composition. (X) and the polyol composition (Y) each have an elongational viscosity of 0.1 to 10 Pa┬Ěs.
    Type: Application
    Filed: February 15, 2021
    Publication date: August 18, 2022
    Applicant: DIC Corporation
    Inventors: Kenji Nakamura, Atsumi Sano, Tomoo Okubo, Masahiro Niwa
  • Publication number: 20220264036
    Abstract: Miniaturization of pixels is facilitated in a solid-state imaging element that detects presence or absence of an address event. The solid-state imaging element includes a plurality of detection pixels and a detection circuit. In the solid-state imaging element including the plurality of detection pixels and the detection circuit, each of the plurality of detection pixels generates a voltage signal according to a logarithmic value of a photocurrent. Furthermore, in the solid-state imaging element including the plurality of detection pixels and the detection circuit, the detection circuit detects whether or not a change amount of a voltage signal of a detection pixel indicated by an input selection signal among the plurality of detection pixels exceeds a predetermined threshold value.
    Type: Application
    Filed: July 8, 2020
    Publication date: August 18, 2022
    Inventor: Atsumi Niwa
  • Patent number: 11394913
    Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: July 19, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Atsumi Niwa, Shizunori Matsumoto, Eiji Hirata
  • Patent number: 11388357
    Abstract: Presence or absence of an abnormality is easily determined in a solid-state imaging element that detects an address event. The solid-state imaging element includes a photoelectric conversion element, a test signal supply unit, a selection unit, and a comparator. The photoelectric conversion element converts incident light into an electric signal by photoelectric conversion. The test signal supply unit supplies, as a test signal, a signal that fluctuates with time. The selection unit selects either the electric signal or the test signal. The comparator compares a predetermined threshold value with the signal selected by the selection unit, and outputs a result of the comparison.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: July 12, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Patent number: 11375149
    Abstract: In a solid-state image sensor that detects presence or absence of an address event, power consumption when capturing an image is reduced. The solid-state image sensor includes a plurality of pixels and an analog-digital conversion unit. In the solid-state image sensor, each of the plurality of pixels generates an analog signal by photoelectric conversion. Moreover, in the solid-state image sensor, the analog-digital conversion unit converts the analog signal of a pixel into a digital signal, the pixel having an amount of change in incident light amount that falls outside a predetermined range, of the plurality of pixels.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: June 28, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Publication number: 20220159202
    Abstract: Stability of a current-voltage conversion circuit is increased in a solid-state imaging element that converts photocurrent to a voltage signal. A photodiode photoelectrically converts incident light and generates photocurrent. A conversion transistor converts photocurrent to a voltage signal and outputs the voltage signal from a gate. A current source transistor supplies predetermined constant current to an output signal line connected to the gate. A voltage supply transistor supplies a certain voltage corresponding to the predetermined constant current from the output signal line to a source of the conversion transistor. A capacitance is connected between the gate and the source of the conversion transistor.
    Type: Application
    Filed: February 4, 2022
    Publication date: May 19, 2022
    Applicant: Sony Semiconductor Solutions
    Inventor: Atsumi Niwa
  • Publication number: 20220109799
    Abstract: Time deviation between event detection and gradation acquisition is reduced. A solid-state imaging apparatus according to an embodiment includes: a pixel array unit (300) including a plurality of pixel blocks (310) arrayed in a matrix; and a drive circuit (211) that generates a pixel signal in a first pixel block in which firing of an address event has been detected among the plurality of pixel blocks, each of the plurality of pixel blocks including a first photoelectric conversion element (331) that generates an electric charge according to an amount of incident light, a detection unit (400) that detects the firing of the address event based on the electric charge generated in the first photoelectric conversion element, a second photoelectric conversion element (321) that generates an electric charge according to an amount of incident light, and a pixel circuit (322, 323, 324, 325, 326) that generates a pixel signal based on the electric charge generated in the second photoelectric conversion element.
    Type: Application
    Filed: January 23, 2020
    Publication date: April 7, 2022
    Inventors: ATSUMI NIWA, MOTONARI HONDA
  • Patent number: 11245861
    Abstract: Stability of a current-voltage conversion circuit is increased in a solid-state imaging element that converts photocurrent to a voltage signal. A photodiode photoelectrically converts incident light and generates photocurrent. A conversion transistor converts photocurrent to a voltage signal and outputs the voltage signal from a gate. A current source transistor supplies predetermined constant current to an output signal line connected to the gate. A voltage supply transistor supplies a certain voltage corresponding to the predetermined constant current from the output signal line to a source of the conversion transistor. A capacitance is connected between the gate and the source of the conversion transistor.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: February 8, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Patent number: 11240455
    Abstract: The present technology relates to an AD conversion device, an AD conversion method, an image sensor, and an electronic apparatus that are able to achieve high-speed, low-power-consumption AD conversion. In a case where an electrical signal and a variable-level reference signal are compared by a comparator and the result of comparison is used to perform AD (Analog to Digital) conversion of the electrical signal, control is exercised in such a manner that a bias current flowing in the comparator to operate the comparator during a certain section of the reference signal including a section where the reference signal changes is increased from a first current, which is larger than 0 (zero), to a second current, which is larger than the first current. The present technology is applicable, for example, to AD conversion of an electrical signal.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: February 1, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Tomonori Yamashita, Yosuke Ueno, Atsumi Niwa
  • Publication number: 20210385404
    Abstract: To shorten time required for AD conversion when a solid-state imaging element that detects presence or absence of an address event further captures image data. In a detection block, a first pixel that generates a first analog signal by photoelectric conversion and a second pixel that generates a second analog signal by photoelectric conversion are arrayed. A first analog-digital converter converts the first analog signal into a digital signal on the basis of whether or not a change amount of an incident light amount of the detection block exceeds a predetermined threshold. A second analog-digital converter converts the second analog signal into a digital signal on the basis of whether or not the change amount exceeds the threshold.
    Type: Application
    Filed: October 15, 2019
    Publication date: December 9, 2021
    Inventor: Atsumi Niwa
  • Publication number: 20210368125
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 25, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Publication number: 20210344863
    Abstract: A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 4, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Patent number: 11153519
    Abstract: A defective pixel is easily identified in a solid-state imaging element that detects an address event. An address event detecting unit detects, as an address event, a fact that an absolute value of a change amount of luminance exceeds a predetermined threshold value with regard to each of a plurality of pixels, and outputs a detection signal indicating a result of the detection. A detection frequency acquisition unit acquires a detection frequency of the address event with regard to each of the plurality of pixels. A defective pixel identification unit identifies, on the basis of a statistic of the detection frequency, a defective pixel where an abnormality has occurred among the plurality of pixels.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: October 19, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa