Patents by Inventor Atsumi Niwa

Atsumi Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210195130
    Abstract: In a solid-state image sensor that detects presence or absence of an address event, power consumption when capturing an image is reduced. The solid-state image sensor includes a plurality of pixels and an analog-digital conversion unit. In the solid-state image sensor, each of the plurality of pixels generates an analog signal by photoelectric conversion. Moreover, in the solid-state image sensor, the analog-digital conversion unit converts the analog signal of a pixel into a digital signal, the pixel having an amount of change in incident light amount that falls outside a predetermined range, of the plurality of pixels.
    Type: Application
    Filed: October 15, 2019
    Publication date: June 24, 2021
    Inventor: Atsumi Niwa
  • Publication number: 20210185256
    Abstract: The present technology relates to an AD conversion device, an AD conversion method, an image sensor, and an electronic apparatus that are able to achieve high-speed, low-power-consumption AD conversion. In a case where an electrical signal and a variable-level reference signal are compared by a comparator and the result of comparison is used to perform AD (Analog to Digital) conversion of the electrical signal, control is exercised in such a manner that a bias current flowing in the comparator to operate the comparator during a certain section of the reference signal including a section where the reference signal changes is increased from a first current, which is larger than 0 (zero), to a second current, which is larger than the first current. The present technology is applicable, for example, to AD conversion of an electrical signal.
    Type: Application
    Filed: July 14, 2017
    Publication date: June 17, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Tomonori YAMASHITA, Yosuke UENO, Atsumi NIWA
  • Patent number: 11039098
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: June 15, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Publication number: 20210144320
    Abstract: A defective pixel is easily identified in a solid-state imaging element that detects an address event. An address event detecting unit detects, as an address event, a fact that an absolute value of a change amount of luminance exceeds a predetermined threshold value with regard to each of a plurality of pixels, and outputs a detection signal indicating a result of the detection. A detection frequency acquisition unit acquires a detection frequency of the address event with regard to each of the plurality of pixels. A defective pixel identification unit identifies, on the basis of a statistic of the detection frequency, a defective pixel where an abnormality has occurred among the plurality of pixels.
    Type: Application
    Filed: February 7, 2019
    Publication date: May 13, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi NIWA
  • Publication number: 20210099660
    Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 1, 2021
    Applicant: SONY CORPORATION
    Inventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
  • Publication number: 20210075990
    Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 11, 2021
    Inventors: ATSUMI NIWA, SHIZUNORI MATSUMOTO, EIJI HIRATA
  • Publication number: 20210058575
    Abstract: Presence or absence of an abnormality is easily determined in a solid-state imaging element that detects an address event. The solid-state imaging element includes a photoelectric conversion element, a test signal supply unit, a selection unit, and a comparator. The photoelectric conversion element converts incident light into an electric signal by photoelectric conversion. The test signal supply unit supplies, as a test signal, a signal that fluctuates with time. The selection unit selects either the electric signal or the test signal. The comparator compares a predetermined threshold value with the signal selected by the selection unit, and outputs a result of the comparison.
    Type: Application
    Filed: February 7, 2019
    Publication date: February 25, 2021
    Inventor: Atsumi Niwa
  • Publication number: 20210051288
    Abstract: A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 18, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Patent number: 10911707
    Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: February 2, 2021
    Assignee: Sony Corporation
    Inventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
  • Patent number: 10880509
    Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 29, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Atsumi Niwa, Shizunori Matsumoto, Eiji Hirata
  • Patent number: 10840936
    Abstract: Provided is an AD conversion unit that includes a comparator to compare an electric signal with a reference signal having a variable level, and performs AD conversion of the electric signal by using a result of the comparison between the electric signal and the reference signal by the comparator. An attenuation unit attenuates the electric signal supplied to the comparator with the amplitude of the electric signal.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: November 17, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masako Hasegawa, Ryuta Okamoto, Tomonori Yamashita, Atsumi Niwa, Yosuke Ueno
  • Publication number: 20200358977
    Abstract: An object is to reduce a circuit scale in a solid-state imaging element that detects an address event. The solid-state imaging element is provided with a plurality of photoelectric conversion elements, a signal supply unit, and a detection unit. In this solid-state imaging element, each of the plurality of photoelectric conversion elements photoelectrically converts incident light to generate a first electric signal. Furthermore, in the solid-state imaging element, the detection unit detects whether or not a change amount of the first electric signal of each of the plurality of photoelectric conversion elements exceeds a predetermined threshold and outputs a detection signal indicating a result of the detection result.
    Type: Application
    Filed: January 18, 2019
    Publication date: November 12, 2020
    Inventors: Atsumi Niwa, Yusuke Oike
  • Publication number: 20200351455
    Abstract: In a solid-state image sensor that detects an address event, the detection sensitivity for the address event is controlled to an appropriate value. The solid-state image sensor includes a pixel array unit and a control unit. In the solid-state image sensor, multiple pixel circuits are arranged in the pixel array unit, each detecting a change in luminance of incident light occurring outside a predetermined dead band as the address event. The control unit controls the width of the dead band according to the number of times the address event is detected in the pixel array unit within a fixed unit cycle.
    Type: Application
    Filed: December 14, 2018
    Publication date: November 5, 2020
    Inventor: Atsumi Niwa
  • Publication number: 20200260032
    Abstract: There is provided a solid-state image pickup element including: a photodiode configured to convert incident light into a photocurrent; an amplification transistor configured to amplify a voltage between a gate having a potential depending on the photocurrent and a source having a predetermined reference potential and output the amplified voltage from a drain; and a potential supply section configured to supply an anode of the photodiode and a back-gate of the amplification transistor with a predetermined potential lower than the reference potential.
    Type: Application
    Filed: March 13, 2019
    Publication date: August 13, 2020
    Inventor: Atsumi Niwa
  • Publication number: 20200260039
    Abstract: To a mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
    Type: Application
    Filed: July 17, 2018
    Publication date: August 13, 2020
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Atsumi Niwa
  • Publication number: 20200236319
    Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
    Type: Application
    Filed: April 3, 2020
    Publication date: July 23, 2020
    Applicant: SONY CORPORATION
    Inventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
  • Patent number: 10666284
    Abstract: The present disclosure relates to a solid-state imaging apparatus and electronic equipment which can realize operation with lower power consumption in a sensing mode. A solid-state imaging apparatus has an A/D conversion unit that A/D converts a pixel signal and an oscillator that generates a second internal clock with a frequency lower than that of a first internal clock obtained by multiplying an external clock, in which the A/D conversion unit is configured to operate, when operating by the second internal clock, with resolution lower than resolution of A/D conversion when operating by the first internal clock. The present disclosure can be applied to, for example, a CMOS image sensor.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 26, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Atsumi Niwa
  • Patent number: 10659716
    Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: May 19, 2020
    Assignee: Sony Corporation
    Inventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
  • Publication number: 20200053308
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Application
    Filed: February 19, 2018
    Publication date: February 13, 2020
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Publication number: 20200021769
    Abstract: The present technology is provided to accurately correct uneven luminance while suppressing an increase in the size of the solid-state imaging element. A pixel array unit includes a plurality of lines each including a predetermined number of pixels each being arrayed in a predetermined direction. An analog-to-digital conversion unit includes more than the predetermined number of analog-to-digital converters that convert analog signals into digital signals. A scanning circuit controls to sequentially select the plurality of lines and output more than the predetermined number of analog signals to the analog-to-digital conversion unit every time the line is selected. A correction unit performs black level correction processing on the digital signal.
    Type: Application
    Filed: October 27, 2017
    Publication date: January 16, 2020
    Inventors: ATSUMI NIWA, SHIZUNORI MATSUMOTO, EIJI HIRATA