Patents by Inventor Atsunori Kajiki

Atsunori Kajiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6696751
    Abstract: In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device. Unnecessary increasing of package dimensions is avoided by providing a semiconductor device comprising a package having a semiconductor element mounting region, a first region containing the aforementioned mounting region, and a second region partially adjoining the periphery of the above-described first region.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: February 24, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Atsunori Kajiki, Kenji Iida
  • Publication number: 20020045292
    Abstract: In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device. Unnecessary increasing of package dimensions is avoided by providing a semiconductor device comprising a package having a semiconductor element mounting region, a first region containing the aforementioned mounting region, and a second region partially adjoining the periphery of the above-described first region.
    Type: Application
    Filed: December 20, 2001
    Publication date: April 18, 2002
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Atsunori Kajiki, Kenji Iida
  • Publication number: 20010013646
    Abstract: In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device.
    Type: Application
    Filed: February 6, 2001
    Publication date: August 16, 2001
    Inventors: Atsunori Kajiki, Kenji Iida