Abstract: A ferrous-metal-alkaline-earth-metal mixed silicate based phosphor is used in form of a single component or a mixture as a light converter for a primarily visible and/or ultraviolet light emitting device. The phosphor has a rare earth element as an activator. The rare earth element is europium (Eu). Alternatively, the phosphor may have a coactivator formed of a rare earth element and at least one of Mn, Bi, Sn, and Sb.

Abstract: A light emitting device includes a light emitting element comprising a nitride semiconductor and a phosphor that can absorb a part of light emitted from the light emitting element and can emit light of a wavelength different from that of the absorbed light. The phosphor comprises a silicate phosphor comprising three alkali earth metals.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: The present invention provides a Group III nitride compound semiconductor device in which the amount of a current allowed to be applied on a p-type pad electrode can be increased. That is, in the Group III nitride compound semiconductor device according to the present invention, a portion of a translucent electrode coming in contact with a circumferential surface of the p-type pad electrode is formed as a thick port ion to thereby increase the area of contact between the circumferential surface and the translucent electrode to thereby increase the current allowed to be applied on the p-type pad electrode. In addition, the use of the thick portion prevents cracking from occuring between the translucent electrode and the circumferential surface of the pad electrode.

Abstract: An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained. That is, in the present invention, in a device having an outermost diameter of not smaller than 700 ?m, a distance from an n electrode to a farthest point of a p electrode is selected to be not larger than 500 ?m.

Abstract: A process of forming separation grooves for separating a semiconductor wafer into individual light-emitting devices, a process for thinning the substrate, process for adhering the wafer to the adhesive sheet to expose a substrate surface on the reverse or backside of the wafer, a scribing process for forming split lines in the substrate for dividing the wafer into light-emitting devices, and a process of forming a mirror structure comprising a light transmission layer, a reflective layer, and a corrosion-resistant layer, which are laminated in sequence using sputtering or deposition processes. Because the light transmission layer is laminated on the adhesive sheet, gases normally volatilized from the adhesion materials are sealed and do not chemically combine with the metal being deposited as the reflective layer. As a result, reflectivity of the reflective layer can be maintained.

Abstract: In a light emitting diode, a blue light emitting element is mounted on a base having a cup through a phosphor-containing mount so that the light emitting element is located within the cup and is mounted on the bottom of the cup through the phosphor-containing mount. The light emitting diode includes a light emitting element and a p electrode. By virtue of the above construction, blue light emitted from the light emitting element can be reflected from the lower surface of the p electrode without being radiated directly from the upper surface of the light emitting element to the outside of the light emitting diode. As a result, the blue light emitted from the light emitting element can be efficiently mixed with yellow light given off from the phosphor in the phosphor-containing mount to provide white light which is radiated to the outside of the light emitting diode with high efficiency.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: A process of forming separation grooves for separating a semiconductor wafer into individual light-emitting devices, a process for thinning the substrate, process for adhering the wafer to the adhesive sheet to expose a substrate surface on the reverse or backside of the wafer, a scribing process for forming split lines in the substrate for dividing the wafer into light-emitting devices, and a process of forming a mirror structure comprising a light transmission layer, a reflective layer, and a corrosion-resistant layer, which are laminated in sequence using sputtering or deposition processes. Because the light transmission layer is laminated on the adhesive sheet, gases normally volatilized from the adhesion materials are sealed and do not chemically combine with the metal being deposited as the reflective layer. As a result, reflectivity of the reflective layer can be maintained.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained.

Abstract: In a light emitting diode, a scattering material-containing light guiding/scattering layer is provided which directly receives light emitted from a light emitting element. The scattering material contained in the light guiding/scattering layer irregularly reflects and scatters the incident light. The scattered light is led to a fluorescence emitting layer formed of a transparent binder containing a phosphor material. The probability of incidence of light having high optical density, which has been emitted from the light emitting element, directly to the phosphor material contained in the fluorescence emitting layer is lowered, and light can be radiated from the whole fluorescence emitting layer. Therefore, uniform light having a desired color can be radiated with high efficiency from the light emitting diode.

Abstract: An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained. That is, in the present invention, in a device having an outermost diameter of not smaller than 700 &mgr;m, a distance from an n electrode to a farthest point of a p electrode is selected to be not larger than 500 &mgr;m.

Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.

Abstract: The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The phosphor is made of alkaline earth metal silicate fluorescent material activated with europium.

Abstract: In a light emitting diode, a blue light emitting element is mounted on a base having a cup through a phosphor-containing mount so that the light emitting element is located within the cup and is mounted on the bottom of the cup through the phosphor-containing mount. The light emitting diode includes a light emitting element and a p electrode. By virtue of the above construction, blue light emitted from the light emitting element can be reflected from the lower surface of the p electrode without being radiated directly from the upper surface of the light emitting element to the outside of the light emitting diode. As a result, the blue light emitted from the light emitting element can be efficiently mixed with yellow light given off from the phosphor in the phosphor-containing mount to provide white light which is radiated to the outside of the light emitting diode with high efficiency.