Abstract: In a light emitting diode, a scattering material-containing light guiding/scattering layer is provided which directly receives light emitted from a light emitting element. The scattering material contained in the light guiding/scattering layer irregularly reflects and scatters the incident light. The scattered light is led to a fluorescence emitting layer formed of a transparent binder containing a phosphor material. The probability of incidence of light having high optical density, which has been emitted from the light emitting element, directly to the phosphor material contained in the fluorescence emitting layer is lowered, and light can be radiated from the whole fluorescence emitting layer. Therefore, uniform light having a desired color can be radiated with high efficiency from the light emitting diode.

Abstract: A process of forming separation grooves for separating a semiconductor wafer into individual light-emitting devices, a process for thinning the substrate, process for adhering the wafer to the adhesive sheet to expose a substrate surface on the reverse or backside of the wafer, a scribing process for forming split lines in the substrate for dividing the wafer into light-emitting devices, and a process of forming a mirror structure comprising a light transmission layer, a reflective layer, and a corrosion-resistant layer, which are laminated in sequence using sputtering or deposition processes. Because the light transmission layer is laminated on the adhesive sheet, gases normally volatilized from the adhesion materials are sealed and do not chemically combine with the metal being deposited as the reflective layer. As a result, reflectivity of the reflective layer can be maintained.

Abstract: An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained.

Abstract: The present invention provides a Group III nitride compound semiconductor device in which the amount of a current allowed to be applied on a p-type pad electrode can be increased.

Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.

Abstract: In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented.

Abstract: A process of forming separation grooves for separating a semiconductor wafer into individual light-emitting devices, a process for thinning the substrate, process for adhering the wafer to the adhesive sheet to expose a substrate surface on the reverse or backside of the wafer, a scribing process for forming split lines in the substrate for dividing the wafer into light-emitting devices, and a process of forming a mirror structure comprising a light transmission layer, a reflective layer, and a corrosion-resistant layer, which are laminated in sequence using sputtering or deposition processes. Because the light transmission layer is laminated on the adhesive sheet, gases normally volatilized from the adhesion materials are sealed and do not chemically combine with the metal being deposited as the reflective layer. As a result, reflectivity of the reflective layer can be maintained.

Abstract: A wafer is diced up to a depth of 15 .mu.m from the surface of a sapphire substrate along a dicing line set in the center of a processed region between electrodes for respective devices by using a blade having a width narrower than the width of the processed region, so that separation grooves are formed. In the present invention, the first contact layer, the second contact layer, the p layer, the light-emitting layer and the n layer are arranged in a region between a side surface of the blade and a side wall of the electrode formation region. Accordingly, stress is concentrated into an intersection line of the electrode formation region and the side wall which is erected so as to be L-shaped. Thus, cracks generated at the time of dicing are formed-toward the intersection line. As a result, the cracks never enter into the electrode formation region and, accordingly, never enter into the lower portion of the electrode.

Abstract: A relay mechanism for a steering wheel comprising a plurality of slip rings disposed isolated from each other in a circular track having a steering shaft as its center, and sliders, one provided at each slip ring. It further includes an arcuate common line slip ring extending so as to have a predetermined central angle, and a common line slider sliding on the common line slip ring with the steering shaft as its center, the common line slider being positioned at the midpoint of the common slip ring when the steering wheel is at its straight travel position. When the steering wheel is turned over more than a predetermined angle from its travel position, the common line connecting the slip rings and a power source is rendered non-conductive thereby to disable the signal transmission between the slip rings and electric devices.

Abstract: The steering wheel comprises a column section, a steering shaft passing through the column section, a boss portion secured to the top of the steering shaft, a boss plate secured on the boss portion, a pad section, a plurality of sun gears of the helical gear type, a plurality of planetary shafts, a plurality of pairs of planetary gears of the helical gear type attached to either end portion each of the respective planetary shafts and gearing with the corresponding sun gears, and a resilient member for urging the planetary gears of a pair mounted on at least one of the plural planetary shafts. At least one of the paired planetary gears is attached movably in the longitudinal direction of the axis of that planetary shaft, so that these planetary gears approach mutually or separate from each other in the axial direction of the respective planetary shaft.

Abstract: A steering wheel equipped with an electrical relay means is disclosed. The steering wheel includes a pad side unrotatable member and a column side unrotatable member. A boss extends centrally and at least one pad side slip ring is disposed concentrically with the boss and electrically insulated from an outer surface thereof. The slip ring is positioned below the pad side unrotatable member. Further, at least one column side slip ring is disposed concentrically with the boss, and positioned above the column side unrotatable member. A boss plate is disposed around the boss and at least one holder is fixed to the boss plate. Pad and column side contact pins are supported by the holder, and biased toward opposite direction to each other by a spring positioned inside the holder. A lubricant is filled in the holder, and is applied to the slip rings through axial bores formed in the pins. In another embodiment of the invention, two pins are in sliding contact with a single slip ring.

Abstract: A steering wheel having a telephone includes a pad portion secured to a steering shaft, wherein the pad portion comprises a base held on the steering shaft and a telephone detachably held on the base, the base has a receiving recess and a swing projection with which the telephone is engaged, and the telephone has an engaging recess in engagement with the swing projection and a radio communication means for transferring signals. Therefore, the driver can use the telephone of the present invention in his driving attitude without picking up it during operation of the steering wheel and other occupants can also pick up it from the steering wheel.

Abstract: A steering wheel comprises a rotatable steering shaft, a boss fixed onto the steering shaft, a pad non-rotatable mechanism mounted on the boss and used to hold pad means stationary, a support member for attaching the column-side non-rotatable member of the pad non-rotatable mechanism to the boss in such a manner that the column-side non-rotatable member is rotatable relative to the boss and stopper means provided on the column-side non-rotatable member and used to make the column-side non-rotatable member non-rotatable relative to a column.