Patents by Inventor Atsushi Isobe

Atsushi Isobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190162752
    Abstract: In an acceleration sensor detecting a vibration acceleration by using torsion of a beam joining a fixed portion and a membrane, a spring constant of the beam is decreased while an increase in a chip size due to extension of the beam is prevented, so that an acceleration sensor that is highly sensitive and small in a size is provided with a low price. A sensor of a capacitance detecting type includes a membrane having a stacking structure formed of two or more layers and a plurality of beams capable of twisting so that the membrane is movable in a detecting direction, a first beam of the plurality of beams is formed of the same layer as either an upper or a lower layer of the membrane, and a second beam thereof is formed of the same layer as either an upper or a lower layer of the movable portion.
    Type: Application
    Filed: September 11, 2018
    Publication date: May 30, 2019
    Inventors: Atsushi ISOBE, Yuudai KAMADA, Chisaki TAKUBO, Noriyuki SAKUMA, Tomonori SEKIGUCHI
  • Publication number: 20190084830
    Abstract: In a calculator in a MEMS manufacturing system, a stage control unit inclines a stage based on a stage angle 1 setting a stage inclination angle and a stage angle 2 of the inclination angle different from the stage angle 1. A stage-angle calculation unit calculates the stage inclination angles from first and second images acquired by a SEM apparatus when the stage control unit sets the stage at the stage angles 1 and 2. A 3D-data creation unit creates three-dimensional device data from a third image that is a device image acquired when the stage is set at the stage angle 1 and a fourth image that is a device image acquired when the stage is set at the stage angle 2. When the three-dimensional device data is created, a correction value calculated from the stage angles 1 and 2 and the first and second images is used.
    Type: Application
    Filed: July 9, 2018
    Publication date: March 21, 2019
    Inventors: Misuzu SAGAWA, Atsushi ISOBE
  • Publication number: 20180372774
    Abstract: An acceleration sensor has high sensitivity, low power consumption and high linearity of output to the applied acceleration under gravity. To solve the above problem, the acceleration sensor is provided with a movable section placed between a base substrate and a cap substrate and rotating about a rotation axis. A top left electrode included in the cap substrate and a left movable electrode included in the movable section form a left capacitor, and a top right electrode included in the cap substrate and a right movable electrode included in the movable section form a right capacitor. Then, a lateral width of a first detection region in which capacitance is detected between the top left electrode and the left movable electrode, and a lateral width of a second detection region in which capacitance is detected between the top right electrode and the right movable electrode are different from each other.
    Type: Application
    Filed: April 18, 2016
    Publication date: December 27, 2018
    Inventors: Atsushi ISOBE, Takashi SHIOTA, Yuudai KAMADA, Chisaki TAKUBO, Noriyuki SAKUMA
  • Publication number: 20180370793
    Abstract: A manufacturing method of a MEMS sensor includes a step of, by irradiating a first hole formed in a second layer on a semiconductor substrate with a focused ion beam for a first predetermined time, forming a first sealing film, which seals the first hole, on the first hole, and a step of, by irradiating a second hole formed in the second layer with a focused ion beam for a second predetermined time, forming a second sealing film, which seals the second hole, on the second hole. At this time, each of the first predetermined time and the second predetermined time is a time in which thermal equilibrium of the second layer is maintainable, and the step of forming the first sealing film and the step of forming the second sealing film are performed repeatedly.
    Type: Application
    Filed: March 12, 2018
    Publication date: December 27, 2018
    Inventors: Masaharu KINOSHITA, Atsushi ISOBE, Kazuo ONO, Noriyuki SAKUMA, Tomonori SEKIGUCHI, Keiji WATANABE
  • Patent number: 10160644
    Abstract: A manufacturing method of a MEMS sensor includes a step of, by irradiating a first hole formed in a second layer on a semiconductor substrate with a focused ion beam for a first predetermined time, forming a first sealing film, which seals the first hole, on the first hole, and a step of, by irradiating a second hole formed in the second layer with a focused ion beam for a second predetermined time, forming a second sealing film, which seals the second hole, on the second hole. At this time, each of the first predetermined time and the second predetermined time is a time in which thermal equilibrium of the second layer is maintainable, and the step of forming the first sealing film and the step of forming the second sealing film are performed repeatedly.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: December 25, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Masaharu Kinoshita, Atsushi Isobe, Kazuo Ono, Noriyuki Sakuma, Tomonori Sekiguchi, Keiji Watanabe
  • Publication number: 20180346321
    Abstract: An object of the invention is to provide a MEMS device that is easy to set a cavity inner pressure to a desired value by utilizing normally-used MEMS device manufacturing processes and process materials without increase in the number of processes of manufacturing the MEMS device. In order to solve the problem, as a typical MEMS device of the present invention, a MEMS device having a cavity includes an insulating film containing hydrogen in vicinity of the cavity and a hydrogen barrier film covering the insulating film.
    Type: Application
    Filed: March 6, 2018
    Publication date: December 6, 2018
    Inventors: Chisaki TAKUBO, Atsushi ISOBE, Noriyuki SAKUMA, Yuudai KAMADA, Tomonori SEKIGUCHI
  • Publication number: 20180321274
    Abstract: Provided are acceleration sensor, geophone and seismic prospecting system with high sensitivity and low power consumption. The acceleration sensor includes a mass body displaceable with respect to a rotation shaft. The acceleration sensor includes a first AC servo control facing a first symmetrical region of the first movable portion, a second AC servo control electrode facing a second symmetrical region of the second movable portion, and a DC servo control electrode facing an asymmetrical region of the second movable portion. A first AC servo capacitive element is formed by the first movable portion and the first AC servo control electrode, a second AC servo capacitive element is formed by the second movable portion and the second AC servo control electrode, and a DC servo capacitive element is formed by the second movable portion and the DC servo control electrode.
    Type: Application
    Filed: November 8, 2016
    Publication date: November 8, 2018
    Inventors: Yuudai KAMADA, Atsushi ISOBE, Noriyuki SAKUMA, Takashi SHIOTA, Chisaki TAKUBO
  • Publication number: 20180273378
    Abstract: Provided is a technology that enables the shortening of the designing period. A device designing method includes a step of extracting a structure compatible with requested characteristics from a database in which each structure of a device is associated with characteristics and a step of outputting the extracted structure and a tuning parameter for adjusting the structure into ranges of the requested characteristics. In regard to each structure parameter determining the structure of the device, characteristics obtained by performing a simulation while exhaustively changing the structure parameter in a manufacturable range and the structure parameter used for the simulation are stored in the database while being associated with each other.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 27, 2018
    Inventors: Tetsufumi KAWAMURA, Kazuki WATANABE, Atsushi ISOBE, Yuudai KAMADA, Shuntaro MACHIDA, Nobuyuki SUGII, Daisuke RYUZAKI
  • Publication number: 20180252745
    Abstract: There is provided an acceleration sensor with low noise and high sensitivity. Specifically, a first number of opening portions are formed in a region corresponding to a heavyweight section of a mass body, on a surface of a membrane layer, and a second number of opening portions are formed in a region corresponding to the heavyweight section of the mass body, on a back surface of the membrane layer. The opening portion and the opening portion are connected to each other to form a plurality of through portions on the membrane layer, and the first number is larger than the second number.
    Type: Application
    Filed: September 15, 2015
    Publication date: September 6, 2018
    Inventors: Atsushi ISOBE, Takashi SHIOTA, Yuudai KAMADA, Chisaki TAKUBO, Noriyuki SAKUMA
  • Publication number: 20180252744
    Abstract: Provided is an acceleration sensor having a large mass in a movable portion, and realizing high impact resistance. An acceleration sensor element 10a includes an upper substrate 20, a lower substrate 21 spaced apart from the upper substrate 20, and an intermediate substrate 19 provided between the upper substrate 20 and the lower substrate 21. Each of a first movable portion 16, a second movable portion 17, a frame portion 12, a fixed portion 13, and a spring portion 14 constituting the intermediate substrate 19 is configured with two layers of an upper layer and a lower layer, and a stopper portion 18 is provided at one end of the frame portion 12. A distance 31 between an end portion of the first movable portion 16 or the second movable portion 17 and an end portion of the stopper portion 18 in the upper layer and a distance 32 between an end portion of the first movable portion 16 or the second movable portion 17 and an end portion of the stopper portion 18 in the lower layer are different from each other.
    Type: Application
    Filed: August 8, 2017
    Publication date: September 6, 2018
    Inventors: Yuudai KAMADA, Atsushi ISOBE, Noriyuki SAKUMA, Chisaki TAKUBO, Tomonori SEKIGUCHI
  • Publication number: 20180238929
    Abstract: A membrane (mass body) included in an acceleration sensor includes a moving portion, a moving portion electrically separated from the moving portion, and a mechanical junction portion that mechanically connects the moving portion and the moving portion in a y-axis direction. The mechanical junction portion includes a first portion extending in a direction having a first angle with respect to the y-axis direction and a second portion extending in a direction having a second angle different from the first angle with respect to the y-axis direction in an xy plane, and is formed to have a non-linear shape in an x-axis direction.
    Type: Application
    Filed: February 16, 2018
    Publication date: August 23, 2018
    Inventors: Atsushi Isobe, Yuudai Kamada, Chisaki Takubo, Noriyuki Sakuma, Tomonori Sekiguchi
  • Publication number: 20180238926
    Abstract: Airtightness in a cavity of an inertial sensor (acceleration sensor) is increased to achieve high sensitivity. In the acceleration sensor having movable electrodes VE1, VE2 and fixed electrodes FE1, FE2, the fixed electrodes are formed by portions surrounded by a through hole TH1 provided in a cap layer CL, and the through hole is filled with an insulating film IF1 and polysilicon P and has a wide portion (WP). The wide portion has a gap SP that is not filled with the insulating film IF1 and the polysilicon P, and the gap SP is filled with the interlayer insulating film ID. With such a configuration, degassing can be exhausted through the gap (airway) SP in a pressure reducing step.
    Type: Application
    Filed: November 9, 2016
    Publication date: August 23, 2018
    Inventors: Takashi SHIOTA, Tatsuyuki SAITO, Tatemi IDO, Noriyuki SAKUMA, Yuudai KAMADA, Atsushi ISOBE, Chisaki TAKUBO
  • Publication number: 20180210005
    Abstract: There is provided an inertia sensor with low noise and high sensitivity. The inertia sensor captures a physical quantity as a change of electrostatic capacitance and detects the physical quantity based on a servo voltage generating electrostatic force that cancels the change of the electrostatic capacitance. The inertia sensor includes a detection capacitor unit that captures the physical quantity as the change of the electrostatic capacitance and a servo capacitor unit to which the servo voltage is applied. Here, the detection capacitor unit and the servo capacitor unit are connected mechanically through an insulation material.
    Type: Application
    Filed: July 10, 2015
    Publication date: July 26, 2018
    Inventors: Atsushi ISOBE, Yuki FURUBAYASHI, Takashi OSHIMA, Yuudai KAMADA, Takashi SHIOTA, Chisaki TAKUBO, Noriyuki SAKUMA
  • Publication number: 20180137212
    Abstract: Provided is a device design support apparatus in which a data input-output portion receives an input of a first device provisional specification relating to a device from a customer, a database generating portion generates a second database based on a first database stored in a database storing portion and the first device provisional specification, and a device specification generating portion generates a second device provisional specification relating to the device based on the second database, presents the second device provisional specification to the customer by outputting the generated second device provisional specification through the data input-output portion, receives the input of a change content of the second device provisional specification from the customer, and generates a device fixed specification of the device based on the second device provisional specification and the change content.
    Type: Application
    Filed: November 8, 2017
    Publication date: May 17, 2018
    Applicant: HITACHI, LTD.
    Inventors: Yuhua ZHANG, Tetsufumi KAWAMURA, Atsushi ISOBE, Nobuyuki SUGII, Daisuke RYUZAKI
  • Publication number: 20180121589
    Abstract: The present invention provides a technique for determining the circuit configuration and device structure that meet required specifications in a short time. A device design support method includes: a step (S2) of receiving an input of specifications of a sensor, and extracting the circuit configuration and device specification range corresponding to the received specifications of the sensor, by referring to a circuit design database in which the circuit configuration configuring the sensor, the range of the specifications of the device configuring the sensor, and the specifications of the sensor are associated with each other; and a step (S3) of extracting the device structure corresponding to the extracted device specification range by referring to a device design database in which the specifications of the device and the structure of the device are associated with each other.
    Type: Application
    Filed: October 19, 2017
    Publication date: May 3, 2018
    Inventors: Tetsufumi KAWAMURA, Nobuyuki SUGII, Yuudai KAMADA, Yuhua ZHANG, Atsushi ISOBE, Ryohei MATSUI, Daisuke RYUZAKI
  • Patent number: 9958472
    Abstract: A low-noise and high-sensitivity inertial sensor is provided. On the assumption that a movable portion VU1 and a movable portion VU2 are formed in the same SOI layer, the movable portion VU1 and the movable portion VU2 are mechanically connected to each other by a mechanical coupling portion MCU even while these movable portions are electrically isolated from each other. Thereby, according to a sensor element SE in the invention, it is possible to further suppress a shift between the capacitance of a MEMS capacitor 1 and the capacitance of a MEMS capacitor 2.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: May 1, 2018
    Assignee: HITACHI, LTD.
    Inventors: Yuudai Kamada, Atsushi Isobe, Noriyuki Sakuma, Takashi Oshima, Yuki Furubayashi
  • Patent number: 9906205
    Abstract: A technique capable of maintaining the filter characteristics of a transmitting filter and a receiving filter by reducing the influences of heat from the power amplifier given to the transmitting filter and the receiving filter as small as possible in the case where the transmitting filter and the receiving filter are formed on the same semiconductor substrate together with the power amplifier in a mobile communication equipment typified by a mobile phone is provided. A high heat conductivity film HCF is provided on a passivation film PAS over the entire area of a semiconductor substrate 1S including an area AR1 on which an LDMOSFET is formed and an area AR2 on which a thin-film piezoelectric bulk wave resonator BAW is formed. The heat mainly generated in the LDMOSFET is efficiently dissipated in all directions by the high heat conductivity film HCF formed on the surface of the semiconductor substrate 1S.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: February 27, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kengo Asai, Atsushi Isobe
  • Publication number: 20170292970
    Abstract: An acceleration sensor (1) includes a fixed portion (33), a movable portion (31) connected to the fixed portion (33), a lower electrode (11) that is disposed to face a lower surface of the movable portion (31), and an upper electrode (21) that is disposed to face an upper surface of the movable portion (31). A distance in an x-axis direction between an end portion (41) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (51) of the upper electrode (21) and the fixed portion (33). Further, a distance in the x-axis direction between an end portion (42) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (52) of the upper electrode (21) and the fixed portion (33).
    Type: Application
    Filed: November 11, 2014
    Publication date: October 12, 2017
    Inventors: Atsushi ISOBE, Noriyuki SAKUMA, Chisaki TAKUBO, Yuudai KAMADA, Takashi SHIOTA
  • Publication number: 20170018471
    Abstract: To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be suppressed. A physical quantity sensor includes a sensor element that detects a predetermined physical quantity and outputs an electrical signal, a plurality of lead portions that are connected to the sensor element, and a package substrate that accommodates the sensor element and the plurality of lead portions. The plurality of lead portions are connected at proximal end sides thereof to the package substrate side, and connected at distal end sides thereof to the sensor element side, and the plurality of lead portions support the sensor element in such a manner that the sensor element does not contact the package substrate and that the transmission of deformation of the package substrate side to the sensor element is suppressed.
    Type: Application
    Filed: June 15, 2016
    Publication date: January 19, 2017
    Inventors: Takanori AONO, Tomonori SEKIGUCHI, Takashi SHIOTA, Yuudai KAMADA, Atsushi ISOBE
  • Publication number: 20160164478
    Abstract: A technique capable of maintaining the filter characteristics of a transmitting filter and a receiving filter by reducing the influences of heat from the power amplifier given to the transmitting filter and the receiving filter as small as possible in the case where the transmitting filter and the receiving filter are formed on the same semiconductor substrate together with the power amplifier in a mobile communication equipment typified by a mobile phone is provided. A high heat conductivity film HCF is provided on a passivation film PAS over the entire area of a semiconductor substrate 1S including an area AR1 on which an LDMOSFET is formed and an area AR2 on which a thin-film piezoelectric bulk wave resonator BAW is formed. The heat mainly generated in the LDMOSFET is efficiently dissipated in all directions by the high heat conductivity film HCF formed on the surface of the semiconductor substrate 1S.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 9, 2016
    Inventors: Kengo ASAI, Atsushi ISOBE