Patents by Inventor Atsushi Izawa

Atsushi Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6608725
    Abstract: An optical module, in which an optical device can be mounted and repaired without damaging an electrode on an electronic device side, is provided. A photodiode (1) and a pre-amplifier IC (2) are mounted on a base (stem) (4), and except for that, a relay terminal table (7) is provided. The photodiode (1) and the pre-amplifier IC (2) are connected through the relay terminal table (7) by means of bonding wires (3a, 3b). The relay terminal table (7) is connected via the bonding wire (3a) to an electrode (11) of the photodiode (1), as well as via the bonding wire (3b) to an electrode (12) of the pre-amplifier IC (2). In repairing the photodiode (1) only the bonding wire (3a) is removed for re-wiring, so that the electrode (12) of the pre-amplifier IC can be prevented from being damaged.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: August 19, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Atsushi Izawa, Masayuki Iwase
  • Patent number: 6552083
    Abstract: The present invention relates to an agent for inhibiting diseases associated with chronic rejection after organ transplantation, such as transplanted heart-accelerated coronary arteriosclerosis, containing as an active ingredient N-(3,4-dimethoxycinnamoyl)anthranilic acid represented by formula: or a pharmaceutically acceptable salt thereof, which has an inhibitory effect on vascular thickening in transplanted hearts.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: April 22, 2003
    Assignee: Kissei Pharmaceutical Co., Ltd.
    Inventors: Mitsuaki Isobe, Atsushi Izawa
  • Publication number: 20020067554
    Abstract: An optical module, in which an optical device can be mounted and repaired without damaging an electrode on an electronic device side, is provided. A photodiode (1) and a pre-amplifier IC (2) are mounted on a base (stem) (4), and except for that, a relay terminal table (7) is provided. The photodiode (1) and the pre-amplifier IC (2) are connected through the relay terminal table (7) by means of bonding wires (3a, 3b). The relay terminal table (7) is connected via the bonding wire (3a) to an electrode (11) of the photodiode (1), as well as via the bonding wire (3b) to an electrode (12) of the pre-amplifier IC (2). In repairing the photodiode (1) only the bonding wire (3a) is removed for re-wiring, so that the electrode (12) of the pre-amplifier IC can be prevented from being damaged.
    Type: Application
    Filed: June 26, 2001
    Publication date: June 6, 2002
    Inventors: Atsushi Izawa, Masayuki Iwase