Abstract: A heat exchanger includes a heating fluid flow path through which a heating fluid flows, a heated fluid flow path through which a heated fluid flows, a heat radiation unit that stacks a plurality of heat radiation plates in a thickness direction to thereby form a heat radiation flow path communicating with the heating fluid flow path between a plurality of heat radiation plates, a heat receiving unit provided stacked in the thickness direction of the heat radiation plates forming the heat radiation unit, that stacks a plurality of heat receiving plates in the thickness direction to form a heat receiving flow path communicating with a heated fluid flow path between the plurality of heat receiving plates, a heat storage unit formed of a space between the heat radiation unit and the heat receiving unit and a heat storage material filled inside the heat storage unit.

Abstract: A heat management system includes an outdoor heat exchanger that exchanges heat between a heat medium and outdoor air, a compressor that compresses the heat medium heat-exchanged by the outdoor heat exchanger, an indoor heat exchanger that exchanges heat between the heat medium compressed by the compressor and the indoor air, and an external device heat exchanger provided between the outdoor heat exchanger and the compressor, that exchanges heat between the heat generated by an external device and the heat medium.

Abstract: Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.

Abstract: A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 ?m or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 ?m or more.

Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).

Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.

Abstract: Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.

Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).

Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.

Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.

Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 ?m or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 ?m or more.

Abstract: A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.

Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.

Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.